Thermal Stress Analysis of Cu/Low-k Interconnects in 3D-IC Structures

2006 ◽  
Author(s):  
M. C. Hsieh ◽  
Yung-yu Hsu ◽  
Chao-liang Chang
Keyword(s):  
Thermal Stress ◽  
Stress Analysis ◽  
3D Ic ◽  
Thermal Stress Analysis ◽  
Low K

Thermal stress analysis of the low-k layer in a flip-chip package

2016 ◽  
Vol 163 ◽  
pp. 78-82 ◽  
Author(s):  
L. Wang ◽  
C. Xu ◽  
L. Lin ◽  
C. Yang ◽  
J. Wang ◽  
...  
Keyword(s):  
Thermal Stress ◽  
Stress Analysis ◽  
Flip Chip ◽  
Thermal Stress Analysis ◽  
Low K

Thermal stress analysis of a directionally solidified Al–1wt%Ni alloy casting

2010 ◽  
Vol 46 (10) ◽  
pp. 889-895 ◽  
Author(s):  
Moisés M. Pariona ◽  
Josuel K. Rugenski ◽  
Manuel V. Canté ◽  
José E. Spinelli ◽  
Amauri Garcia
Keyword(s):  
Thermal Stress ◽  
Stress Analysis ◽  
Directionally Solidified ◽  
Thermal Stress Analysis ◽  
Alloy Casting ◽  
Ni Alloy
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