Flexible waveguide probe for silicon-photonics wafer-level test

2011 ◽  
Author(s):  
Roberto R. Panepucci ◽  
Abdullah J. Zakariya ◽  
Lavanya V. K. Kudapa
Keyword(s):  
Silicon Photonics ◽  
Wafer Level

Test system for wafer-level silicon-photonics testing

2020 ◽  
Author(s):  
Peng Zhang ◽  
Bo Tang ◽  
Yan Yang ◽  
Bin Li ◽  
Ruonan Liu ◽  
...  
Keyword(s):  
Silicon Photonics ◽  
Test System ◽  
Wafer Level

Test-station for flexible semi-automatic wafer-level silicon photonics testing

2016 ◽  
Author(s):  
Jeroen De Coster ◽  
Peter De Heyn ◽  
Marianna Pantouvaki ◽  
Brad Snyder ◽  
Hongtao Chen ◽  
...  
Keyword(s):  
Silicon Photonics ◽  
Wafer Level

MEMS Wafer-level Packaging Technology Using LTCC Wafer

2012 ◽  
Vol 132 (8) ◽  
pp. 246-253 ◽  
Author(s):  
Mamoru Mohri ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level ◽  
Packaging Technology ◽  
Wafer Level Packaging

Silicon Migration Seal Wafer-Level Vacuum Encapsulation

2020 ◽  
Vol 140 (7) ◽  
pp. 165-169
Author(s):  
Yukio Suzuki ◽  
Dupuit Victor ◽  
Toshiya Kojima ◽  
Yoshiaki Kanamori ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level

Development of Wafer Level Chip Size Packaging Process and its Application to the CMOS Image Sensor Module for Medical Device

2017 ◽  
Vol 137 (2) ◽  
pp. 48-58
Author(s):  
Noriyuki Fujimori ◽  
Takatoshi Igarashi ◽  
Takahiro Shimohata ◽  
Takuro Suyama ◽  
Kazuhiro Yoshida ◽  
...  
Keyword(s):  
Medical Device ◽  
Cmos Image Sensor ◽  
Image Sensor ◽  
Wafer Level ◽  
Packaging Process ◽  
Sensor Module ◽  
Chip Size

Low Temperature Al-Al Thermo-compression Bonding with Sn Oxidation Protect Layer for Wafer-level Hermetic Sealing

2016 ◽  
Vol 136 (6) ◽  
pp. 237-243 ◽  
Author(s):  
Shiro Satoh ◽  
Hideyuki Fukushi ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Low Temperature ◽  
Wafer Level ◽  
Hermetic Sealing
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