A 3D Packaging Technology for 4 Gbit Stacked DRAM with 3 Gbps Data Transfer

2006 ◽  
Author(s):  
M. Kawano ◽  
S. Uchiyama ◽  
Y. Egawa ◽  
N. Takahashi ◽  
Y. Kurita ◽  
...  
Keyword(s):  
Data Transfer ◽  
Packaging Technology ◽  
3D Packaging

Wafer Level Assembly Technique Development for Fine Pitch Flip Chip 3D Die-to-Wafer Integration

2010 ◽  
Vol 2010 (1) ◽  
pp. 000548-000553
Author(s):  
Zhaozhi Li ◽  
Brian J. Lewis ◽  
Paul N. Houston ◽  
Daniel F. Baldwin ◽  
Eugene A. Stout ◽  
...  
Keyword(s):  
Flip Chip ◽  
Low Cost ◽  
Three Dimensional ◽  
Cost Effective ◽  
Market Demand ◽  
Wafer Level ◽  
Packaging Technology ◽  
Fine Pitch ◽  
3D Packaging ◽  
Assembly Technique

Three Dimensional (3D) Packaging has become an industry obsession as the market demand continues to grow toward higher packaging densities and smaller form factor. In the meanwhile, the 3D die-to-wafer (D2W) packaging structure is gaining popularity due to its high manufacturing throughput and low cost per package. In this paper, the development of the assembly process for a 3D die-to-wafer packaging technology, that leverages the wafer level assembly technique and flip chip process, is introduced. Research efforts were focused on the high-density flip chip wafer level assembly techniques, as well as the challenges, innovations and solutions associated with this type of 3D packaging technology. Processing challenges and innovations addressed include flip chip fluxing methods for very fine-pitch and small bump sizes; wafer level flip chip assembly program creation and yield improvements; and set up of the Pb-free reflow profile for the assembled wafer. 100% yield was achieved on the test vehicle wafer that has totally 1,876 flip chip dies assembled on it. This work has demonstrated that the flip chip 3D die-to-wafer packaging architecture can be processed with robust yield and high manufacturing throughput, and thus to be a cost effective, rapid time to market alternative to emerging 3D wafer level integration methodologies.

scholarly journals High-Density 3D Packaging Technology for CCD Micro-Camera System Module

2002 ◽  
Vol 122 (2) ◽  
pp. 67-72 ◽  
Author(s):  
Hiroshi Yamada ◽  
Takashi Togasaki ◽  
Masanobu Kimura ◽  
Hajime Sudo ◽  
Nobuaki Kawahara
Keyword(s):  
High Density ◽  
Camera System ◽  
Packaging Technology ◽  
3D Packaging ◽  
System Module

Three-Dimensional Packaging Technology for Stacked DRAM With 3-Gb/s Data Transfer

2008 ◽  
Vol 55 (7) ◽  
pp. 1614-1620 ◽  
Author(s):  
Masaya Kawano ◽  
Nobuaki Takahashi ◽  
Yoichiro Kurita ◽  
Koji Soejima ◽  
Masahiro Komuro ◽  
...  
Keyword(s):  
Data Transfer ◽  
Three Dimensional ◽  
Packaging Technology

3D Packaging Technology for Integrated Antenna Front-Ends

2008 ◽  
Author(s):  
Barbara Bonnet ◽  
Philippe Monfraix ◽  
Renaud Chiniard ◽  
Jerome Chaplain ◽  
Claude Drevon ◽  
...  
Keyword(s):  
Packaging Technology ◽  
3D Packaging ◽  
Integrated Antenna

A 3D packaging technology for acoustically optimized integration of 2D CMUT arrays and front end circuits

2017 ◽  
Author(s):  
Alessandro Stuart Savoia ◽  
Barbara Mauti ◽  
Giosue Caliano ◽  
Giulia Matrone ◽  
Marco Piastra ◽  
...  
Keyword(s):  
Packaging Technology ◽  
Front End ◽  
3D Packaging ◽  
Front End Circuits

Use of 3D Packaging Technology for Satellite Active Antennas Front-ends

2012 ◽  
Vol 2012 (1) ◽  
pp. 000554-000560
Author(s):  
B. Bonnet ◽  
R. Chiniard ◽  
H. Legay ◽  
D. Nevo ◽  
P. Monfraix ◽  
...  
Keyword(s):  
Signal To Noise Ratio ◽  
Disruptive Technology ◽  
Space Applications ◽  
Ka Band ◽  
Packaging Technology ◽  
Active Devices ◽  
Active Antennas ◽  
Front End ◽  
3D Packaging ◽  
Technological Developments

Multi-Chip Module Vertical (MCM-V) technology, also called 3D packaging technology, enables the realization of a compact and low loss integrated feed for active antennas in Ka band. The active devices can be located in the vicinity of the radiating element, which reduces dramatically the volume and complexity of the antenna front-end for future architectures with more than a hundred beams in Ka band. This paper deals with the optimization of 3D packaging technology to reach the requirements of 30GHz microwave modules for space applications. The technological developments that have been led on the design and the assembly processes are detailed. The measurement results of an integrated feed module in radiation are given and the circuit designed to optimize the signal-to-noise ratio of the front-end for receiving antennas is characterized. The performance is as good as for an optimized planar front-end with a waveguide access for a much more compact module, especially in terms of footprint in an antenna array. These results successfully position 3D packaging as a disruptive technology for future space and telecom subsystems.

Utilizing a low cost 3D packaging technology for consumer applications

1995 ◽  
Vol 41 (4) ◽  
pp. 1095-1102 ◽  
Author(s):  
S.P. Larcombe ◽  
J.M. Stern ◽  
P.A. Ivey ◽  
L. Seed
Keyword(s):  
Low Cost ◽  
Packaging Technology ◽  
3D Packaging
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