Effects of Heating Factors on Brittle Fractures of Solder Joints by High Speed Shear Test

2006 ◽  
Author(s):  
Bin Zhao ◽  
Bing An ◽  
Feng-shun Wu ◽  
Yi-ping Wu
Keyword(s):  
High Speed ◽  
Shear Test ◽  
Solder Joints ◽  
Brittle Fractures

Mechanical Property Evaluation of Sn-3.0A-0.5Cu BGA Solder Joints Using High-Speed Ball Shear Test

2009 ◽  
Vol 38 (12) ◽  
pp. 2489-2495 ◽  
Author(s):  
Sang-Su Ha ◽  
Jin-Kyu Jang ◽  
Sang-Ok Ha ◽  
Jong-Woong Kim ◽  
Jeong-Won Yoon ◽  
...  
Keyword(s):  
Mechanical Property ◽  
High Speed ◽  
Shear Test ◽  
Solder Joints ◽  
Ball Shear ◽  
Property Evaluation ◽  
Ball Shear Test

FAILURE BEHAVIORS OF FLIP CHIP SOLDER JOINTS UNDER VARIOUS LOADING CONDITIONS OF HIGH-SPEED SHEAR TEST

2009 ◽  
Vol 23 (06n07) ◽  
pp. 1809-1815 ◽  
Author(s):  
SANG-SU HA ◽  
SANG-OK HA ◽  
JIN-KYU JANG ◽  
JONG-WOONG KIM ◽  
JONG-BUM LEE ◽  
...  
Keyword(s):  
Strain Rate ◽  
High Speed ◽  
Shear Test ◽  
Flip Chip ◽  
Solder Joints ◽  
Rate Sensitivity ◽  
Loading Conditions ◽  
3 Dimensional ◽  
Dimensional Finite Element ◽  
Shear Speed

The failure behaviors of flip chip solder joints under various loading conditions of the high-speed shear test (H-SST) were investigated with an experimental and non-linear 3-dimensional finite element modeling study. The solder composition used in this study was Sn -3.0 Ag -0.5 Cu ( in wt .%). The shear forces were far greater by H-SST than by low-speed shear test (L-SST). The shear force further increased with increasing shear speed, mainly due to the high strain-rate sensitivity of the solder alloy. Brittle interfacial fractures were more easily achieved by H-SST, especially at the higher shear speed. This was discussed in terms of the relationship between the strain-rate and work-hardening effect and the resulting stress concentration at the interfacial regions

Mechanical strength and fracture mode transition of Sn-58Bi epoxy solder joints under high-speed shear test

2012 ◽  
Vol 23 (8) ◽  
pp. 1515-1520 ◽  
Author(s):  
Ilje Cho ◽  
Jee-Hyuk Ahn ◽  
Jeong-Won Yoon ◽  
Young-Eui Shin ◽  
Seung-Boo Jung
Keyword(s):  
Mechanical Strength ◽  
Fracture Mode ◽  
High Speed ◽  
Shear Test ◽  
Solder Joints ◽  
Mode Transition ◽  
Epoxy Solder

Failure behaviors of BGA solder joints under various loading conditions of high-speed shear test

2008 ◽  
Vol 20 (1) ◽  
pp. 17-24 ◽  
Author(s):  
Jong-Woong Kim ◽  
Young-Chul Lee ◽  
Sang-Su Ha ◽  
Seung-Boo Jung
Keyword(s):  
High Speed ◽  
Shear Test ◽  
Solder Joints ◽  
Loading Conditions

Predictive Failure Analysis of Solder Joints with Simultaneous High Speed EBSD and EDS

2018 ◽  
Author(s):  
J. Lindsay ◽  
P. Trimby ◽  
J. Goulden ◽  
S. McCracken ◽  
R. Andrews
Keyword(s):  
High Speed ◽  
Solder Joints ◽  
Phase Distribution ◽  
Bond Failure ◽  
Microstructural Parameters ◽  
Snpb Solder ◽  
Grain Orientations ◽  
Accelerated Thermal Cycling ◽  
The Relationship ◽  
Opening Up

Abstract The results presented here show how high-speed simultaneous EBSD and EDS can be used to characterize the essential microstructural parameters in SnPb solder joints with high resolution and precision. Analyses of both intact and failed solder joints have been carried out. Regions of strain localization that are not apparent from the Sn and Pb phase distribution are identified in the intact bond, providing key insights into the mechanism of potential bond failure. In addition, EBSD provides a wealth of quantitative detail such as the relationship between parent Sn grain orientations and Pb coarsening, the morphology and distribution of IMCs on a sub-micron scale and accurate grain size information for all phases within the joint. Such analyses enable a better understanding of the microstructural developments leading up to failure, opening up the possibility of improved accelerated thermal cycling (ATC) testing and better quality control.

High Productivity Thermo-Compression Flip Chip Bonding

2014 ◽  
Vol 2014 (1) ◽  
pp. 000100-000106
Author(s):  
Tom Colosimo ◽  
Horst Clauberg ◽  
Evan Galipeau ◽  
Matthew B. Wasserman ◽  
Michael Schmidt-Lange ◽  
...  
Keyword(s):  
High Speed ◽  
Large Scale ◽  
Flip Chip ◽  
Solder Joints ◽  
Rapid Heating ◽  
Temperature Cycle ◽  
Temperature Uniformity ◽  
Heating Rates ◽  
Heating And Cooling ◽  
Chip Technology

Advancements in electronic packaging performance and cost have historically been driven by higher integration primarily provided by fab shrinks that has followed the well-known Moore's law. However, due to the tremendous and continuously increasing cost of building new fabs, the performance/cost improvements achieved via node shrinks are negated. This leaves packaging innovation as the vehicle to achieve future cost-performance improvements. This has initiated a More-than-Moore idea that has led to vigorous R&D in packaging. Advanced packages which employ ultra-fine pitch flip chip technology for chip-to-substrate, chip-to-chip, or chip-to-interposer for the first level interconnect have been developed as an answer to obtaining higher performance. However, the costs are too high as compared to traditional wire bonding. The status today is that the fundamental technical hurdles of manufacturing the new advanced packages have been solved, but cost reduction and yield improvements have to be addressed for large-scale adoption into high volume manufacturing. In traditional flip chip assembly silicon chips are tacked onto a substrate and then the solder joints are melted and mass reflowed in an oven. This mass reflow technique is troublesome as the pitch of the solder bumps become finer. This is due to the large differences in the thermal expansion coefficient of the die and the substrate, which creates stress at the solder joints and warpage of the package when the die and substrate are heated and cooled together. To mitigate and resolve this issue, thermo-compression bonders have been developed which locally reflow the solder without subjecting the entire substrate to the heating and cooling cycle. This requires that the bondhead undergo heating past the melting point of solder and then cooling down to a low enough temperature to pick the next die from the wafer that is mounted to tape. Machines in the market today can accomplish this temperature cycle in 7 to 15 seconds. This is substantially slower than the standard flip chip process which leads to high cost and is delaying the introduction of these new packages. This paper shows a flip chip bonder with a new heating and cooling concept that will radically improve the productivity of thermo-compression bonding. Data and productivity cycles from this new bond head with heating rates of over 200°C/sec and cooling of faster than 100°C/sec are revealed. Experimental results are shown of exceptional temperature accuracy across the die of 5°C throughout the cycle and better than 3°C at the final heating stage. The high speed thermo-compression bonds are analyzed and the efficacy of the new concept is proven. Excellent temperature uniformity while heating rapidly is an absolute necessity for enabling good solder joints in a fast process. Without good temperature uniformity, additional dwell times need to be incorporated to allow heat to flow to all of the joints, negating any benefits from rapid heating. Whereas the current state-of-that-art is often to program temperature in steps, this bonder can be commanded and accurately follows more complex temperature profiles with great accuracy. Examples of how this profiling can be used to enhance the uniformity and integrity of the joints with non-conductive pastes, film, and without underfill along with the associated productivity improvements will be shown. Tests that show portability across platforms that will lead to set up time and yield improvements and are identified and quantified. Additionally new ideas for materials and equipment development to further enhance productivity and yield are explored.

Pb-free PBGA Design Points to Improve Handling Robustness

2012 ◽  
Vol 2012 (1) ◽  
pp. 000110-000118 ◽  
Author(s):  
Isabel de Sousa ◽  
Brian Roggeman ◽  
Oswaldo Chacon ◽  
Niki Spencer ◽  
Mamoru Ueno
Keyword(s):  
High Speed ◽  
Solder Joints ◽  
High Strain ◽  
Strain Rates ◽  
Process Variables ◽  
Flexural Stress ◽  
High Strain Rates ◽  
Ball Shear ◽  
Laminate Design ◽  
Free Solder

Pb-Free BGA solder joints are more brittle and more susceptible to interfacial fails than the leaded versions. These brittle failures typically occur if the modules are subjected to high strain rates through module handling impacts or PCB flexural stress. The high speed ball shear technique is a useful method to submit solder joints to high strain rates in a controlled manner to emulate the levels of strain the BGAs may see in handling. This measurement technique was used to evaluate different laminate design and process variables on organic laminate substrates to create a more robust Pb-Free solder joint. Experiments were conducted to evaluate the effects and interactions of laminate, module assembly process, SAC alloy composition, and thermal treatments. Modulations of shear speed and shear angle made it possible to observe transitions from ductile to brittle solder fractures. The high speed ball shear method was successful to differentiate subtle effects resulting from different design points and process variables. The copper composition in the PbFree solder alloy, thermal history, and geometric factors such as solder volume, solder resist opening and solder resist thickness all had measurable impacts on the shear strength and transition point of ductile to brittle failure. Some BGA configurations have also been tested in reliability, namely in thermal cycling, and were shown to meet application requirements. Optimal design points can therefore be applied to enhance handling robustness without compromising on reliability.

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