Software power estimation and optimization for high performance, 32-bit embedded processors

2002 ◽  
Author(s):  
J.T. Russell ◽  
M.F. Jacome
Keyword(s):  
High Performance ◽  
Power Estimation ◽  
Embedded Processors

NTB branch predictor: dynamic branch predictor for high-performance embedded processors

2014 ◽  
Vol 72 (5) ◽  
pp. 1679-1693 ◽  
Author(s):  
Cong Thuan Do ◽  
Hong Jun Choi ◽  
Dong Oh Son ◽  
Jong Myon Kim ◽  
Cheol Hong Kim
Keyword(s):  
High Performance ◽  
Embedded Processors ◽  
Branch Predictor

Power Estimation and Validation of Embedded Multiplier Based on ANN and Regression Technique

2021 ◽  
Author(s):  
Neerja Singh ◽  
Gaurav Verma ◽  
Vijay Khare
Keyword(s):  
Curve Fitting ◽  
High Performance ◽  
Timing Analysis ◽  
Digital Signal ◽  
Power Estimation ◽  
Critical Issue ◽  
Regression Technique ◽  
Design Stage ◽  
Early Design Stage ◽  
Post Synthesis

Nowadays, high-end Field-Programmable Gate Arrays (FPGAs) are capable of implementing relatively high-performance systems in the field of Digital Signal Processing (DSP). Due to the abundant application of multipliers, their implementation efficiency and performance have become a critical issue in designing the DSP systems. On the other hand, FPGAs consume a large amount of power due to their complex circuitry. So, the power estimation of FPGA implementations at an early design stage has become a critical design metric. Various models are available in the literature based on Look-up Tables (LUTs), but not much literature is available on speed-optimized multiplier design using DSP slices only. In this paper, an embedded multiplier (12.0 IP core) has been analyzed and customized for different Input/Output (I/O) configurations to estimate the power using Vivado Design Suite (2014.4) targeted to the Zynq-family FPGA device (Zynq evolution and development kit). The embedded multiplier IP has been optimized for performance using two different approaches, i.e., Mults (DSP)-based and LUTs-based. Post-synthesis attributes have been used for formulating the power estimation models based on Artificial Neural Network (ANN) and curve fitting and regression technique. The power values estimated from the proposed models have been authenticated with reference to those assessed from the commercial tool. Based on the results obtained, ANN-based model provides average errors of 0.73% and 0.88% for the LUTs and DSP-based designs, respectively. Whereas, the model based on curve fitting and regression technique provides average errors of 3.61% and 1.59% for the LUTs and DSP-based designs, respectively. The timing analysis has been done to get the design performance and time complexity of the proposed models. Area analysis of the design has also been performed in order to report the resource utilization.

LP-NUCA: Networks-in-Cache for High-Performance Low-Power Embedded Processors

2012 ◽  
Vol 20 (8) ◽  
pp. 1510-1523 ◽  
Author(s):  
Darío Suárez Gracia ◽  
Giorgos Dimitrakopoulos ◽  
Teresa Monreal Arnal ◽  
Manolis G. H. Katevenis ◽  
Víctor Viñals Yufera
Keyword(s):  
Low Power ◽  
High Performance ◽  
Embedded Processors

Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap

2021 ◽  
Vol 143 (3) ◽  
Author(s):  
Yuanchen Hu ◽  
Md Obaidul Hossen ◽  
Zhimin Wan ◽  
Muhannad S. Bakir ◽  
Yogendra Joshi
Keyword(s):  
Heat Transfer ◽  
Integrated Circuit ◽  
High Performance ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
Heat Removal ◽  
Power Estimation ◽  
Leakage Power ◽  
Pin Fin ◽  
Pin Fins

Abstract Three-dimensional (3D) stacked integrated circuit (SIC) chips are one of the most promising technologies to achieve compact, high-performance, and energy-efficient architectures. However, they face a heat dissipation bottleneck due to the increased volumetric heat generation and reduced surface area. Previous work demonstrated that pin-fin enhanced microgap cooling, which provides fluidic cooling between layers could potentially address the heat dissipation challenge. In this paper, a compact multitier pin-fin single-phase liquid cooling model has been established for both steady-state and transient conditions. The model considers heat transfer between layers via pin-fins, as well as the convective heat removal in each tier. Spatially and temporally varying heat flux distribution, or power map, in each tier can be modeled. The cooling fluid can have different pumping power and directions for each tier. The model predictions are compared with detailed simulations using computational fluid dynamics/heat transfer (CFD/HT). The compact model is found to run 120–600 times faster than the CFD/HT model, while providing acceptable accuracy. Actual leakage power estimation is performed in this codesign model, which is an important contribution for codesign of 3D-SICs. For the simulated cases, temperatures could decrease 3% when leakage power estimation is adopted. This model could be used as electrical-thermal codesign tool to optimize thermal management and reduce leakage power.

Sign in / Sign up

Export Citation Format

Share Document