Effect of bonding pressure on transducer ultrasonic propagation in thermosonic flip chip bonding

2006 ◽  
Author(s):  
Long Zhili ◽  
Han Lei ◽  
Wu Yunxin ◽  
Zhong Jue
Keyword(s):  
Flip Chip ◽  
Bonding Pressure ◽  
Flip Chip Bonding ◽  
Ultrasonic Propagation

New Flip-Chip Interconnect Technology for High Performance and High Reliability Applications

2012 ◽  
Vol 2012 (1) ◽  
pp. 000482-000490
Author(s):  
Eiji Yamaguchi ◽  
Mutsuo Tsuji ◽  
Nozomi Shimoishizaka ◽  
Takahiro Nakano ◽  
Katsunori Hirata
Keyword(s):  
High Performance ◽  
Flip Chip ◽  
High Reliability ◽  
Device Structure ◽  
Bonding Pressure ◽  
Flip Chip Bonding ◽  
Reflow Temperature ◽  
Device Structures ◽  
Bonding Technology ◽  
The Cost

As the current and next generation devices are embracing geometries below 28nm and requiring softer low-K dielectric isolation on very thin large silicon dies ∼ to perform a reliable die-to-package interconnect is becoming a challenge. Further, the high pressure from Cu wire bonding and high reflow temperature of conventional flip-chip bonding often results in damage of device structure. A new flip-chip bonding technology has been developed for such critical applications, and is claimed to be “damage free”. It uses soft bump made by non-full cured conductive paste on the package substrate. These soft bumps require ultra-low bonding pressure on the pad of the die. Thus the bonding process don't make any damage on ULK isolation layer. Details of the process, material sets used for such fragile device structures have been discussed. Reliability results are shared, which further ensures the robustness of this process. Finally, the cost advantage through adaptation of this process has also been elaborated.

Fully integrated low-power flip chip bonding of arrayed optoelectronic devices on SOS

2002 ◽  
Author(s):  
Ronald E. Reedy ◽  
Hal Anthony ◽  
Charles Kuznia ◽  
Mike Pendelton ◽  
Jim Cable ◽  
...  
Keyword(s):  
Low Power ◽  
Flip Chip ◽  
Optoelectronic Devices ◽  
Fully Integrated ◽  
Flip Chip Bonding
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