Online re-mesh and multi-rate deformation simulation by GPU for haptic interaction with large scale elastic objects

2012 ◽  
Author(s):  
Kazuyoshi Tagawa ◽  
Sasaki Yasuyuki ◽  
Hiromi T. Tanaka
Keyword(s):  
Large Scale ◽  
Haptic Interaction ◽  
Deformation Simulation

Accurate and Efficient CPU/GPU-Based 3-DOF Haptic Rendering of Complex Static Virtual Environments

2009 ◽  
Vol 18 (5) ◽  
pp. 340-360 ◽  
Author(s):  
Jong-Phil Kim ◽  
Beom-Chan Lee ◽  
Hyungon Kim ◽  
Jaeha Kim ◽  
Jeha Ryu
Keyword(s):  
Virtual Environments ◽  
Large Scale ◽  
Search Algorithm ◽  
Search Time ◽  
Haptic Rendering ◽  
Nearest Neighbor Search ◽  
Local Geometry ◽  
Complex Data ◽  
Haptic Interaction ◽  
Depth Maps

This paper proposes a novel, accurate, and efficient hybrid CPU/GPU-based 3-DOF haptic rendering algorithm for highly complex and large-scale virtual environments (VEs) that may simultaneously contain different types of object data representations. In a slower rendering process on the GPU, local geometry near the haptic interaction point (HIP) is obtained in the form of six directional depth maps from virtual cameras adaptively located around the object to be touched. In a faster rendering process on the CPU, collision detection and response computations are performed using the directional depth maps without the need for any complex data hierarchy of virtual objects, or data conversion of multiple data formats. To efficiently find an ideal HIP (IHIP), the proposed algorithm uses a new “abstract” local occupancy map instance (LOMI) and the nearest neighbor search algorithm, which does not require physical memory for storing voxel types during online voxelization and reduces the search time by a factor of about 10. Finally, in order to achieve accurate haptic interaction, sub-voxelization of a voxel in LOMI is proposed. The effectiveness of the proposed algorithm is subsequently demonstrated with several benchmark examples.

Reflow Phenomenon Analysis of Large Scale Integrated Cu Interconnections in Via Holes by Viscoelastic Deformation Simulation

2010 ◽  
Vol 39 (3) ◽  
pp. 318-325 ◽  
Author(s):  
Takashi Onishi ◽  
Masao Mizuno ◽  
Tetsuya Yoshikawa ◽  
Jun Munemasa ◽  
Takao Inoue ◽  
...  
Keyword(s):  
Large Scale ◽  
Viscoelastic Deformation ◽  
Deformation Simulation ◽  
Via Holes

An Integrated Approach to Determine Optimal Process Information of Large-Scale Line-Heating Process With Deformation Simulation

2004 ◽  
Vol 20 (04) ◽  
pp. 211-220 ◽  
Author(s):  
Jong Gye Shin ◽  
Yong-Gyun Kim ◽  
Jong-Ho Nam
Keyword(s):  
Kinematic Analysis ◽  
Large Scale ◽  
Integrated Approach ◽  
Integrated System ◽  
Heating Process ◽  
Skilled Workers ◽  
Optimal Process ◽  
Line Heating ◽  
Process Information ◽  
Deformation Simulation

In shipbuilding industries, line heating has been used to fabricate plates of compound curvature. Line heating is a labor-intensive, time-consuming, and manual process carried out only by skilled workers. To enhance productivity as well as accuracy, it is imperative to automate such a process. A kinematic analysis has been introduced as a way to suggest a layout of computed heating lines. However, no verification of the resulting heating lines has been made either qualitatively or quantitatively. In this paper, an integrated system that performs the deformation simulation of plates with compound curvature is developed. This system generates optimal process information for the fabrication of curved plates using the line-heating process, by combining kinematic analysis, thermo-elasto-plastic analysis, and object comparison. The integrated system is implemented and verified by large-scale curved models used in shipyards.

Some comments about observations and image processing of comet 29P/Schwassmann-Wachmann 1

1999 ◽  
Vol 173 ◽  
pp. 243-248
Author(s):  
D. Kubáček ◽  
A. Galád ◽  
A. Pravda
Keyword(s):  
Image Processing ◽  
Large Scale ◽  
Harvard College ◽  
Oak Ridge ◽  
Large Scale Structures ◽  
Short Period Comet ◽  
Short Period ◽  
Scale Structures ◽  
Harvard College Observatory ◽  
Period Comet

AbstractUnusual short-period comet 29P/Schwassmann-Wachmann 1 inspired many observers to explain its unpredictable outbursts. In this paper large scale structures and features from the inner part of the coma in time periods around outbursts are studied. CCD images were taken at Whipple Observatory, Mt. Hopkins, in 1989 and at Astronomical Observatory, Modra, from 1995 to 1998. Photographic plates of the comet were taken at Harvard College Observatory, Oak Ridge, from 1974 to 1982. The latter were digitized at first to apply the same techniques of image processing for optimizing the visibility of features in the coma during outbursts. Outbursts and coma structures show various shapes.

Evolution of Large-Scale Coronal Structures

1994 ◽  
Vol 144 ◽  
pp. 29-33
Author(s):  
P. Ambrož
Keyword(s):  
Magnetic Field ◽  
Field Line ◽  
Large Scale ◽  
Coronal Magnetic Field ◽  
Source Surface ◽  
Solar Cycles ◽  
Characteristic Relationship ◽  
The Magnetic Field ◽  
Coronal Structures

AbstractThe large-scale coronal structures observed during the sporadically visible solar eclipses were compared with the numerically extrapolated field-line structures of coronal magnetic field. A characteristic relationship between the observed structures of coronal plasma and the magnetic field line configurations was determined. The long-term evolution of large scale coronal structures inferred from photospheric magnetic observations in the course of 11- and 22-year solar cycles is described.Some known parameters, such as the source surface radius, or coronal rotation rate are discussed and actually interpreted. A relation between the large-scale photospheric magnetic field evolution and the coronal structure rearrangement is demonstrated.

Large-scale Motion of Solar Filaments

2000 ◽  
Vol 179 ◽  
pp. 205-208
Author(s):  
Pavel Ambrož ◽  
Alfred Schroll
Keyword(s):  
Magnetic Flux ◽  
Proper Motion ◽  
Time Scale ◽  
Large Scale ◽  
Accuracy Of Measurements ◽  
Solar Filaments ◽  
General Movement ◽  
Scale Motion ◽  
Velocity Scatter

AbstractPrecise measurements of heliographic position of solar filaments were used for determination of the proper motion of solar filaments on the time-scale of days. The filaments have a tendency to make a shaking or waving of the external structure and to make a general movement of whole filament body, coinciding with the transport of the magnetic flux in the photosphere. The velocity scatter of individual measured points is about one order higher than the accuracy of measurements.

Some applications of electron beam microanalysis techniques in VLSI process evaluation

1983 ◽  
Vol 41 ◽  
pp. 160-161
Author(s):  
Simon Thomas
Keyword(s):  
Integrated Circuits ◽  
Process Evaluation ◽  
Large Scale ◽  
Technology Development ◽  
Analytical Techniques ◽  
Successful Implementation ◽  
Analysis Of Failures ◽  
Characterization Of Materials ◽  
Circuits Vlsi

Trends in the technology development of very large scale integrated circuits (VLSI) have been in the direction of higher density of components with smaller dimensions. The scaling down of device dimensions has been not only laterally but also in depth. Such efforts in miniaturization bring with them new developments in materials and processing. Successful implementation of these efforts is, to a large extent, dependent on the proper understanding of the material properties, process technologies and reliability issues, through adequate analytical studies. The analytical instrumentation technology has, fortunately, kept pace with the basic requirements of devices with lateral dimensions in the micron/ submicron range and depths of the order of nonometers. Often, newer analytical techniques have emerged or the more conventional techniques have been adapted to meet the more stringent requirements. As such, a variety of analytical techniques are available today to aid an analyst in the efforts of VLSI process evaluation. Generally such analytical efforts are divided into the characterization of materials, evaluation of processing steps and the analysis of failures.

Electron microscopy study of reactively sputter-deposited Ti/N films on silicon

1992 ◽  
Vol 50 (2) ◽  
pp. 1362-1363
Author(s):  
V. C. Kannan ◽  
A. K. Singh ◽  
R. B. Irwin ◽  
S. Chittipeddi ◽  
F. D. Nkansah ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Large Scale ◽  
Hexagonal Phase ◽  
Microscopy Study ◽  
Electron Microscopy Study ◽  
Process Conditions ◽  
Tin Films ◽  
Wide Range ◽  
Fcc Phase ◽  
Circuits Vlsi

Titanium nitride (TiN) films have historically been used as diffusion barrier between silicon and aluminum, as an adhesion layer for tungsten deposition and as an interconnect material etc. Recently, the role of TiN films as contact barriers in very large scale silicon integrated circuits (VLSI) has been extensively studied. TiN films have resistivities on the order of 20μ Ω-cm which is much lower than that of titanium (nearly 66μ Ω-cm). Deposited TiN films show resistivities which vary from 20 to 100μ Ω-cm depending upon the type of deposition and process conditions. TiNx is known to have a NaCl type crystal structure for a wide range of compositions. Change in color from metallic luster to gold reflects the stabilization of the TiNx (FCC) phase over the close packed Ti(N) hexagonal phase. It was found that TiN (1:1) ideal composition with the FCC (NaCl-type) structure gives the best electrical property.

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