High density R2R screen printed silver interconnections for hybrid system integration

2016 ◽  
Author(s):  
Thomas M. Kraft ◽  
Lydia Leppanen ◽  
Terho Kololuoma ◽  
Sanna Lahokallio ◽  
Laura Frisk ◽  
...  
Keyword(s):  
Hybrid System ◽  
System Integration ◽  
High Density ◽  
Screen Printed

scholarly journals Integrated Avionics System (IAS): Integrating 3D Technology on a Spacecraft Panel

2003 ◽  
Author(s):  
Don J. Hunter
Keyword(s):  
System Integration ◽  
New Technologies ◽  
System Development ◽  
High Density ◽  
Design System ◽  
Flexible System ◽  
Integration Schemes ◽  
Environmental Test ◽  
Low Mass ◽  
System Packaging

As spacecraft designs converge toward miniaturization, and with the volumetric and mass challenges placed on avionics, programs will continue to advance the “state of the art” in spacecraft system development with new challenges to reduce power, mass and volume. Traditionally, the trend is to focus on high-density component packaging technologies. Industry has made significant progress in these technologies, and other related internal and external interconnection schemes. Although new technologies have improved packaging densities, a system packaging architecture is required that not only reduces spacecraft volume and mass budgets, but increase integration efficiencies, provide modularity and flexibility to accommodate multiple missions while maintaining a low recurring cost. With these challenges in mind, a novel system packaging approach incorporates solutions that provide broader environmental applications, more flexible system interconnectivity, scalability, and simplified assembly test and integration schemes. The Integrated Avionics System (IAS) provides for a low-mass, modular distributed or centralized packaging architecture which combines ridged-flex technologies, high-density COTS hardware and a new 3-D mechanical packaging approach, Horizontal Mounted Cube (HMC). This paper will describe the fundamental elements of the IAS, HMC hardware design, system integration and environmental test results.

scholarly journals Evaluation of a PV-TEG Hybrid System Configuration for an Improved Energy Output: A Review

2021 ◽  
Vol 10 (2) ◽  
pp. 385-400
Author(s):  
Umar Abubakar Saleh ◽  
Muhammad Akmal Johar ◽  
Siti Amely Binti Jumaat ◽  
Muhammad Nazri Rejab ◽  
Wan Akashah Wan Jamaludin
Keyword(s):  
Solar Cells ◽  
Hybrid System ◽  
System Integration ◽  
Solar Spectrum ◽  
Energy Output ◽  
Critical Parameters ◽  
Future Research ◽  
Solar Pv ◽  
Thermoelectric Effects ◽  
Wide Range

The development of renewable energy, especially solar, is essential for meeting future energy demands. The use of a wide range of the solar spectrum through the solar cells will increase electricity generation and thereby improve energy supply. However, solar photovoltaics (PV) can only convert a portion of the spectrum into electricity. Excess solar radiation is wasted by heat, which decreases solar PV cells’ efficiency and decreases their life span. Interestingly, thermoelectric generators (TEGs) are bidirectional devices that act as heat engines, converting the excess heat into electrical energy through thermoelectric effects through when integrated with a PV. These generators also enhance device efficiency and reduce the amount of heat that solar cells dissipate. Several experiments have been carried out to improve the hybrid PV-TEG system efficiency, and some are still underway. In the present study, the photovoltaic and thermoelectric theories are reviewed. Furthermore, different hybrid system integration methods and experimental and numerical investigations in improving the efficiency of PV-TEG hybrid systems are also discussed. This paper also assesses the effect of critical parameters of PV-TEG performance and highlights possible future research topics to enhancing the literature on photovoltaic-thermoelectric generator systems.

Advanced Silicon Interposer for High density and High Integration Electronic Packages

2015 ◽  
Vol 2015 (DPC) ◽  
pp. 000865-000905
Author(s):  
SATORU KUMOCHI ◽  
Sumio Koiwa ◽  
Kosuke Suzuki ◽  
Yoshitaka Fukuoka
Keyword(s):  
System Integration ◽  
High Density ◽  
High Resistivity ◽  
Through Silicon Vias ◽  
Passive Device ◽  
Fine Pitch ◽  
Mems Technology ◽  
Cte Mismatch ◽  
Silicon Vias ◽  
Electrical Loss

As electronic product becomes smaller and lighter with an increasing number of function← the demand for high density and high integration becomes stronger. Interposers for system in package will became more and more important for advanced electronic systems. Interposers will be needed more complicated structure for 2.5D , 3D package and MEMS, OEMEMS new heterogeneous package structure Silicon interposers with through silicon vias (TSV) and back end of line (BEOL) wirring offer compelling benefits for 2.5D and 3D system integration; however, they are limited by high cost and high electrical loss. [1] This paper presents the demonstration of Silicon Interposers with fine pitch through Silicon vias(TSV),with embedded passive device. We have developed the TSV interposer with redistribution layers on both sides using MEMS technology, high aspect ratio deep etching technology and filled Cu plating with deep through holes for cost reduction and low electrical loss. The TSV interposer with 400μm thick high resistivity Si, obtained without backside processing use of carriers. Excellent through via reliability was demonstrated, due to double side thick polymer insulator that buffers the stress created by CTE mismatch between glass, copper vias and copper traces, and TSV at 200μm pitch passed 1000 thermal cycles from −55°C to 125°C. We have evaluated high frequency transmission characteristic of Si through hole by the measurement S21 parameter. Highly insulating TSV resulted in insertion loss of less than 1dB at 20GHz. Thin film SiN capacitor as embedded passive device was built in surface of TSV interposer by via first and via last method. The capacitance and leakage current of capacitor was measured and compared with two types of fabrication method.

Wire Bonding Looping Solutions for High Density System-in-Package (SiP)

2017 ◽  
Vol 2017 (1) ◽  
pp. 000426-000431 ◽  
Author(s):  
Basil Milton ◽  
Odal Kwon ◽  
Cuong Huynh ◽  
Ivy Qin ◽  
Bob Chylak
Keyword(s):  
System Integration ◽  
3D Visualization ◽  
Wire Bonding ◽  
High Density ◽  
Wire Length ◽  
Loop Formation ◽  
Passive Components ◽  
Wire Bond ◽  
Design Software ◽  
The Wire

Abstract System-in-Package (SiP) have seen a lot of growth in recent years especially in mobile devices due to its higher level of system integration, more design flexibility and smaller form factor. Two or more semiconductor die and passive components are usually present in a SiP device. Die to die bonding and increased I/O density are two common challenges associated with wire bonding in SiPs. High density SiP packages often have high I/O counts and tight wire clearance. As a result, the requirements for wire bond looping are high. To avoid wire shorts, the wire bond loops need to be well designed in order to have optimal wire clearance between various tiers of wire loops as well as neighboring loops. The formed loops need to have low wire sway after wire bonding and low wire sweep after molding. Due to the existence of multiple dies and other passive components within the same package, special wire bond loops with long flat lengths and sharp bending angles are sometimes necessary to clear the die edges and the other components. In this paper, we will review a few new wire bonding looping solutions including 3D looping design software, 3D loop clearance checking and multi-tier loop formation improvements. A robust package design is essential to improve production yield. A 3D looping design software has been developed to evaluate the robustness of various package designs from a wire looping perspective. The software is able to detect potential issues early on in the design cycle and evaluate alternatives quickly, therefore reduces the time to market and improves design robustness. A spatial 3D clearance checking tool has been developed to detect any interference between the densely populated wire loops. The tool can also detect interference between the wires and the edges of different dies. Furthermore, the wire clearance against various components in the package can also be assessed. Process engineers can leverage the clearance check tool and the 3D visualization of wires, multiple dies and components to aid wire bonding looping optimization. Multi-tier looping requires a large range of loop height and wire length capability. In order to achieve optimal looping for high density multi-tier applications, a separate wire bonding looping software has been developed to generate optimal wire bonding motion trajectories that can achieve the loop shapes designed by the 3D looping design software. An example of 6 loop tier application is developed and results are analyzed to show the wire bonding capabilities including looping height from 75um to 500um and wire length up to 5mm.

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