Thermal Characterization of Multi Stack Packages Using Linear Superposition Method

2006 ◽  
Author(s):  
Jaewook Yoo ◽  
Yunhyeok Im ◽  
Kiwon Choi ◽  
Taeje Cho ◽  
Sayoon Kang ◽  
...  
Keyword(s):  
Thermal Characterization ◽  
Superposition Method ◽  
Linear Superposition

A Simple Method for Thermal Characterization of Stacked Die Electronic Packages in Staggered Arrangement

2018 ◽  
Vol 15 (3) ◽  
pp. 117-125 ◽  
Author(s):  
Bharath R. Bharadwaj ◽  
SriNithish Kandagadla ◽  
Praveen J. Nadkarni ◽  
V. Krishna ◽  
T. R. Seetharam ◽  
...  
Keyword(s):  
Heat Dissipation ◽  
Superposition Principle ◽  
Thermal Characterization ◽  
Electronic Packages ◽  
Heat Sources ◽  
Linear Superposition ◽  
Simple Method ◽  
Ansys Simulation ◽  
Staggered Arrangement

Abstract The need for compactness and efficiency of processing devices has kept increasing rapidly over the past few years. This need for compactness has driven the dice to be stacked one above the other. But with this come the difficulty of heat dissipation and its characterization because there are multiple heat sources and a single effective heat-conductive path. Hence, it becomes important to know the distribution and characterization of heat and temperature to provide effective cooling systems. In this article, we discuss the temperature distribution of various power configurations on stacked dice with five dice, when the dice are in staggered arrangement. The simulations have been carried out for both free convection and forced convection conditions using the ANSYS commercial software. The linear Superposition principle (LSP) is demonstrated on these configurations and validated with the results obtained from ANSYS simulation. LSP can be applied for the quick estimation of die temperatures with negligible error.

Random pseudo promptings applied to the thermal characterization of a wet porous material

1999 ◽  
Vol 6 (1) ◽  
pp. 101-108 ◽  
Author(s):  
E. Delacre ◽  
D. Defer ◽  
E. Antczak ◽  
B. Duthoit
Keyword(s):  
Porous Material ◽  
Thermal Characterization

Photoacoustic thermal characterization of the dehydration process of Agar-SiO2emulsions

2005 ◽  
Vol 125 ◽  
pp. 177-180
Author(s):  
T. Lopez ◽  
M. Picquart ◽  
G. Aguirre ◽  
Y. Freile ◽  
D. H. Aguilar ◽  
...  
Keyword(s):  
Thermal Characterization ◽  
Dehydration Process

Thermal characterization of ABS-Graphene blended three dimensional printed functional prototypes for electro chemical energy storage

2018 ◽  
Vol 1 (1) ◽  
pp. 1-11 ◽  
Author(s):  
Kamaljit Singh Boparai ◽  
Rupinder Singh
Keyword(s):  
Energy Storage ◽  
Structural Changes ◽  
Fused Deposition Modeling ◽  
Morphological Changes ◽  
Three Dimensional ◽  
Thermal Characterization ◽  
Chemical Energy ◽  
Flow Index ◽  
Fused Deposition

This study highlights the thermal characterization of ABS-Graphene blended three dimensional (3D) printed functional prototypes by fused deposition modeling (FDM) process. These functional prototypes have some applications as electro-chemical energy storage devices (EESD). Initially, the suitability of ABS-Graphene composite material for FDM applications has been examined by melt flow index (MFI) test. After establishing MFI, the feedstock filament for FDM has been prepared by an extrusion process. The fabricated filament has been used for printing 3D functional prototypes for printing of in-house EESD. The differential scanning calorimeter (DSC) analysis was conducted to understand the effect on glass transition temperature with the inclusion of Graphene (Gr) particles. It has been observed that the reinforced Gr particles act as a thermal reservoir (sink) and enhances its thermal/electrical conductivity. Also, FT-IR spectra realized the structural changes with the inclusion of Gr in ABS matrix. The results are supported by scanning electron microscopy (SEM) based micrographs for understanding the morphological changes.

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