Fabrication process of a triple-layer stacked TSV interposer for switch matrix consisting of eight RF chips
1986 ◽
Vol 44
◽
pp. 652-653
1987 ◽
Vol 48
(C5)
◽
pp. C5-353-C5-356
High Temperature Material Processes An International Quarterly of High-Technology Plasma Processes
◽
1997 ◽
Vol 1
(1)
◽
pp. 41-47
◽
2020 ◽
Vol 85
(778)
◽
pp. 903-911
Keyword(s):
Keyword(s):