In-situ Non-destructive Ultrasonic Rheology Technique for Monitoring Different Lead-free Solder Pastes for Surface Mount Applications

2008 ◽  
Author(s):  
A. Seman ◽  
N.N. Ekere ◽  
S.J. Ashenden ◽  
S. Mallik ◽  
A.E. Marks ◽  
...  
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Surface Mount ◽  
Solder Pastes ◽  
Free Solder ◽  
Non Destructive

Practical Application and Analysis of Lead-Free Solder on Chip-On-Flip-Chip SiP for Hearing Aids

2017 ◽  
Vol 2017 (1) ◽  
pp. 000201-000207 ◽  
Author(s):  
Youngtak Lee ◽  
Doug Link
Keyword(s):  
Hearing Aids ◽  
Flip Chip ◽  
Failure Modes ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Practical Application ◽  
Surface Mount ◽  
Free Solder ◽  
On Chip

Abstract Due to rapid growth of the microelectronics industry, packaged devices with small form factors, low costs, high power performance, and increased efficiency have become of high demand in the market. To realize the current market development trend, flip chip interconnection and System-in-Package (SiP) are some of the promising packaging solutions developed. However, a surprising amount of surface mount technology (SMT) defects are associated with the use of lead-free solder paste and methods by which the paste is applied. Two such defects are solder extrusion and tombstoning. Considerable amount of defects associated with solder overflow are found on chip-on-flip-chip (COFC) SiP in hearing aids. Through the use of design of experiments (DOE), lead-free solder defect causes on hearing aids application can be better understood and subsequently reduced or eliminated. This paper will examine the failure modes of solder extrusion and tombstoning that occurred when two different types of lead-free solders, Sn-Ag-Cu (SAC) and BiAgX were used within a SiP for attachment of surface mount devices (SMD) chip components for hearing aid applications. The practical application and analysis of lead-free solder for hearing aids will include the comprehensive failure analysis of the SMD components and compare the modeling and analysis of the two different solder types through the DOE process.

Comparative Modeling and Analysis of Lead-Free Solder Extrusion for the Design of Reliability

2016 ◽  
Vol 2016 (1) ◽  
pp. 000111-000116
Author(s):  
Youngtak Lee ◽  
Doug Link
Keyword(s):  
Design Of Experiments ◽  
Flip Chip ◽  
Failure Modes ◽  
Form Factors ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Modeling And Analysis ◽  
Surface Mount ◽  
Free Solder

Abstract Due to rapid growth of the microelectronics industry, packaged devices with small form factors, low costs, high power performance, and increased efficiency have become of high demand in the market. To realize the current market development trend, flip chip interconnection and System-in-Package (SiP) are some of the promising packaging solutions developed. However, a surprising amount of surface mount technology (SMT) defects are associated with the use of lead-free solder paste and methods by which the paste is applied. Two such defects are solder extrusion and tombstoning. Through the use of design of experiments (DOE), lead-free solder defect causes can be better understood and subsequently reduced or eliminated. This paper will examine the failure modes of solder extrusion and tombstoning that occurred when two different types of lead-free solders, Sn-Ag-Cu (SAC) and BiAgX were used within a SiP for attachment of surface mount devices (SMD) chip components. The systematic investigation will include the comprehensive failure analysis of the SMD components and compare the modeling and analysis of the two different solder types utilizing the design of experiments methods.

In Situ Measurement of Ionic Migration of Lead-Free Solder by Quartz Crystal Microbalance.

1999 ◽  
Vol 50 (12) ◽  
pp. 1142-1146 ◽  
Author(s):  
Makoto NAKAMURA ◽  
Hirokazu TANAKA ◽  
Sachio YOSHIHARA ◽  
Takashi SHIRAKASHI
Keyword(s):  
Quartz Crystal Microbalance ◽  
Quartz Crystal ◽  
In Situ Measurement ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder
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