Quantification of creep strain in small lead-free solder joints with the in situ micro electronic-resistance measurement

Li Jiang; Keling Yang; Jiemin Zhou; Ke Xiang; Wenjie Wang

doi:10.1016/j.microrel.2007.08.004

Quantification of creep strain in small lead-free solder joints with the in situ micro electronic-resistance measurement

Microelectronics Reliability ◽

10.1016/j.microrel.2007.08.004 ◽

2008 ◽

Vol 48 (3) ◽

pp. 438-444 ◽

Cited By ~ 10

Author(s):

Li Jiang ◽

Keling Yang ◽

Jiemin Zhou ◽

Ke Xiang ◽

Wenjie Wang

Keyword(s):

Creep Strain ◽

Solder Joints ◽

Lead Free ◽

Resistance Measurement ◽

Lead Free Solder ◽

Free Solder

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Quantification of creep strain in small lead-free solder joints with the in-situ micro electronic-resistance measurement

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 ◽

10.1109/esime.2007.359933 ◽

2007 ◽

Author(s):

Li Jiang ◽

Keling Yang ◽

Jiemin Zhou ◽

Ke Xiang ◽

Wenjie Wang

Keyword(s):

Creep Strain ◽

Solder Joints ◽

Lead Free ◽

Resistance Measurement ◽

Lead Free Solder ◽

Free Solder

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Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-011-0538-z ◽

2011 ◽

Vol 23 (1) ◽

pp. 136-147 ◽

Cited By ~ 11

Author(s):

Yanhong Tian ◽

Wei Liu ◽

Rong An ◽

Wei Zhang ◽

Lina Niu ◽

...

Keyword(s):

Tensile Test ◽

Intermetallic Compounds ◽

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

Fracture Behaviors ◽

Free Solder

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In-situ observation on electrochemical migration of lead-free solder joints under water drop test

2008 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2008.4607147 ◽

2008 ◽

Cited By ~ 3

Author(s):

Y.H. Xia ◽

W. Jillek ◽

E. Schmitt

Keyword(s):

Solder Joints ◽

Water Drop ◽

Drop Test ◽

Lead Free ◽

In Situ Observation ◽

Electrochemical Migration ◽

Lead Free Solder ◽

Water Drop Test ◽

Free Solder

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Prediction of steady-state creep strain rate and rupture life for SnAg-based Lead-free solder joints by SP test

International Journal of Precision Engineering and Manufacturing ◽

10.1007/s12541-013-0169-9 ◽

2013 ◽

Vol 14 (7) ◽

pp. 1245-1250 ◽

Cited By ~ 5

Author(s):

Zheng-Jie Yang ◽

Hyo-Sun Yu ◽

Sung-Mo Yang ◽

Joon-Hyuk Song ◽

So-Young Park

Keyword(s):

Steady State ◽

Strain Rate ◽

Creep Strain ◽

Solder Joints ◽

Rupture Life ◽

Steady State Creep ◽

Creep Strain Rate ◽

Lead Free ◽

Lead Free Solder ◽

Free Solder

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Effects of isothermal aging and in-situ current stress on the reliability of lead-free solder joints

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2010.5490790 ◽

2010 ◽

Author(s):

Anurag Bansal ◽

Tae-Kyu Lee ◽

Kuo-Chuan Liu ◽

Jie Xue

Keyword(s):

Isothermal Aging ◽

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

Current Stress ◽

Free Solder

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Methodology for Analyzing Strain States During In Situ Thermomechanical Cycling in Individual Lead-Free Solder Joints Using Synchrotron Radiation

Journal of Electronic Materials ◽

10.1007/s11664-009-0919-8 ◽

2009 ◽

Vol 38 (12) ◽

pp. 2712-2719 ◽

Cited By ~ 14

Author(s):

Thomas R. Bieler ◽

Tae-kyu Lee ◽

Kuo-Chuan Liu

Keyword(s):

Synchrotron Radiation ◽

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

Thermomechanical Cycling ◽

Free Solder ◽

Individual Lead

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S167 In-Situ Study of Electromigration Induced Strain/Stress Evolution and Distribution in Sn-Cu Lead-Free Solder Joints Using Synchrotron White Beam X-ray Microdiffraction

Powder Diffraction ◽

10.1154/1.2951845 ◽

2008 ◽

Vol 23 (2) ◽

pp. 189-189

Author(s):

K. Chen ◽

N. Tamura ◽

F. Y. OuYang ◽

K. N. Tu

Keyword(s):

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

Stress Evolution ◽

X Ray ◽

In Situ Study ◽

White Beam ◽

Strain Stress ◽

Free Solder

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In-Situ Study of the Effect of Electromigration on Strain Evolution and Mechanical Property Change in Lead-free Solder Joints

56th Electronic Components and Technology Conference 2006 ◽

10.1109/ectc.2006.1645800 ◽

2006 ◽

Cited By ~ 2

Author(s):

Fei Ren ◽

Luhua Xu ◽

Xi Zhang ◽

Jae-Woong Nah ◽

J.H.L. Pang ◽

...

Keyword(s):

Mechanical Property ◽

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

Property Change ◽

In Situ Study ◽

Strain Evolution ◽

Free Solder

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Research on Microstructure and Shear Behavior of Au/Sn-Ag-Cu/Cu Lead-free Solder Joints at Different Soldering Temperatures

Journal of Electronic Materials ◽

10.1007/s11664-021-09107-z ◽

2021 ◽

Author(s):

Xinmeng Zhai ◽

Yue Chen ◽

Yuefeng Li ◽

Jun Zou ◽

Mingming Shi ◽

...

Keyword(s):

Solder Joints ◽

Shear Behavior ◽

Lead Free ◽

Lead Free Solder ◽

Free Solder

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Electromigration Induced Stress in Lead-Free Solder Joints

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.371 ◽

2016 ◽

Cited By ~ 1

Author(s):

Jiamin Ni ◽

Antoinette Maniatty ◽

Yong Liu ◽

Jifa Hao ◽

Matt Ring

Keyword(s):

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

Induced Stress ◽

Free Solder

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