Application of submodeling technique to transient drop impact analysis of board-level stacked die packages

2006 ◽  
Author(s):  
Hsiang-chen Hsu ◽  
Yu-chia Hsu ◽  
Hui-yu Lee ◽  
Chang-lin Yeh ◽  
Yi-shao Lai
Keyword(s):  
Impact Analysis ◽  
Drop Impact ◽  
Board Level

A Comprehensive Review of Drop Impact Modeling on Portable Electronic Devices

2011 ◽  
Vol 64 (2) ◽  
Author(s):  
Y. H. Yau ◽  
Shijie Norman Hua
Keyword(s):  
Impact Analysis ◽  
Electronic Devices ◽  
Time Frame ◽  
Drop Impact ◽  
Current Status ◽  
Impact Performance ◽  
The Past ◽  
Comprehensive Survey ◽  
Board Level ◽  
Future Work

This article is dedicated to the review of publications on drop impact analysis performed on consumer electronic devices such as cellular phones and two-way radios in the past decade. Prior to the highlights of this review, the scope and motivation behind this work will be briefly explained. A comprehensive survey on published literatures devoted to the methodologies established to analyze the reliability of electronic products exposed to the event of drop impact is presented. The scope of the review is extended beyond product level analysis to also include drop impact study at board level. This type of review is novel and has not been published in the past. The focus will be on the different analytical and numerical modeling approaches and the current status of finite element method in predicting the drop impact performance of electronic devices. Of equal interest is the methodology adopted in past work to establish a correlation between numerical and experimental results. This article serves as a reference to all intended future work which could be an extension from the current known art of drop impact analysis on electronic devices. The time frame of this review is up to year 2010.

Mechanical Event Simulation of Drop Testing for Toy Product

2006 ◽  
Vol 532-533 ◽  
pp. 993-996
Author(s):  
Anthony Yee Kai Yam ◽  
Kai Leung Yung ◽  
Chi Wo Lam
Keyword(s):  
Material Properties ◽  
Impact Analysis ◽  
Plastic Material ◽  
Free Fall ◽  
Drop Impact ◽  
Local Analysis ◽  
Element Analysis ◽  
Event Simulation ◽  
Long Time ◽  
The Impact

Toys that are free from drop failures normally take a long time to develop. It is often time and cost consuming after the production tooling is built to detect drop test failure. This paper introduces a new drop testing analysis method for Toys. The method uses a simple approach with a local analysis that based on the linear and non linear finite element analysis. Modeling and transient drop analysis of a pre-school toy is used as a case study to demonstrate the method. The impact analysis of the product hitting the solid concrete floor after a free fall is presented. The analysis focuses on the deformation of the housing for a product with electronic circuit and mechanical mechanism inside. Experimental data has been obtained for drop simulation of the housing and its correlation with the plastic material properties. The stress and strain of the housing during drop impact tests are noted. The effects of the material properties to the housing deflection under drop/impact shock have been investigated. Numerical results are compared with experimental results to validate the method.

Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera Measurements

2009 ◽  
Vol 131 (1) ◽  
Author(s):  
J. J. M. Zaal ◽  
W. D. van Driel ◽  
F. J. H. G. Kessels ◽  
G. Q. Zhang
Keyword(s):  
High Speed ◽  
Simulation Models ◽  
3D Models ◽  
Drop Impact ◽  
Impact Testing ◽  
Navigation Systems ◽  
High Speed Camera ◽  
Impact Performance ◽  
Impact Simulations ◽  
Board Level

The increased use of mobile appliances such as mobile phones and navigation systems in today’s society has resulted in an increase in reliability issues related to drop performance. Mobile appliances are dropped several times during their lifespan and the product is required to survive common drop accidents. A widely accepted method to assess the drop reliability of microelectronics on board-level is the drop impact test. This test has been standardized by international councils such as Joint Electron Device Engineering Council and is widely adopted throughout the industry. In this research the solder loading is investigated by combining high-speed camera measurements of several drop impact tests with verified finite element models. These simulation models are developed in order to gain an insight on the loading pattern of solder joints based on interconnect layout, drop conditions, and product specifications prior to physical prototyping. Deflections and frequencies during drop testing are measured using a high-speed camera setup. The high-speed camera experiments are performed on two levels: machine level (rebounds with and without a catcher) and product level (with different levels of energy and different pulse times). Parametric (dynamic and quasistatic) 3D models are developed to predict the drop impact performance. The experimental results are used to verify and enhance the simulation models, e.g., by tuning the damping parameters. As a result, the verified models can be used to determine the location of the critical solder joint and to obtain estimates of the solder lifetime performance.

A coupled thermal-drop impact analysis-based safety assessment of radioactive material cask

2018 ◽  
Vol 9 (2) ◽  
pp. 185-195 ◽  
Author(s):  
Qiang Liu ◽  
Shun-Peng Zhu ◽  
Zheng-Yong Yu ◽  
Ran Ding
Keyword(s):  
High Altitude ◽  
Nuclear Fuel ◽  
Safety Assessment ◽  
Impact Analysis ◽  
Fuel Cycle ◽  
Drop Impact ◽  
Radioactive Material ◽  
Assessment Procedure ◽  
Content Type ◽  
Fire Accidents

Purpose Transport is an integral part of the nuclear fuel cycle. The procedures employed are designed and conducted to ensure the public and environment protection both routinely and when transport accidents occur. According to this, the purpose of this paper is to focus on a coupled thermal-drop impact analysis-based safety assessment of a nuclear fuel cask. Design/methodology/approach For the cask, high altitude falling and fire accidents are the two most serious accidents during its transportation. In this paper, a sequentially coupled thermal-drop impact analysis is performed by using a nuclear fuel cask model for safety assessment. High altitude falling and fire accidents of the nuclear fuel cask were conducted by using finite element simulations for coupled thermal-drop impact analysis. Findings Results showed that the cask can withstand a drop test and survive a fire of 800°C for 30 minutes. In addition, an improved design is explored and evaluated, which provides a reference for structural design and safety assessment of nuclear fuel casks. Originality/value A coupled thermal-drop impact analysis-based safety assessment procedure is developed for the nuclear fuel cask.

Free drop impact analysis of shipping cask

1989 ◽  
Vol 114 (1) ◽  
pp. 33-52 ◽  
Author(s):  
Phillip A. Pfeiffer ◽  
James M. Kennedy
Keyword(s):  
Impact Analysis ◽  
Drop Impact ◽  
Free Drop

G0301-3-5 Drop Impact Analysis of Polystyrene Foam

2009 ◽  
Vol 2009.1 (0) ◽  
pp. 43-44
Author(s):  
Masaru HARADA ◽  
Takao MORI ◽  
Satoshi USUDA ◽  
Naoko ANDO ◽  
Kazuki Nagaoka
Keyword(s):  
Impact Analysis ◽  
Drop Impact ◽  
Polystyrene Foam

Development of high speed board level bend tester for drop impact applications

2009 ◽  
Author(s):  
Shu Min Lim ◽  
Zhong Chen ◽  
Hun Shen Ng ◽  
Tong Yan Tee ◽  
Choong Peng Khoo ◽  
...  
Keyword(s):  
High Speed ◽  
Drop Impact ◽  
Board Level
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