Reliability and new failure modes of encapsulated flip chip on board under thermal shock testing

2003 ◽  
Author(s):  
Cheng Bo ◽  
Wang Li ◽  
Zhang Qun ◽  
Gao Xia ◽  
Xie Xiaoming ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Flip Chip ◽  
Failure Modes ◽  
Shock Testing

Process Characterization and the Effect of Process Defects on Flip Chip Reliability

1999 ◽  
Author(s):  
Brian J. Lewis ◽  
Hilary Sasso
Keyword(s):  
Process Parameters ◽  
Flip Chip ◽  
Failure Modes ◽  
Shock Testing ◽  
Fine Pitch ◽  
Process Characterization ◽  
Solder Bumps ◽  
Optimum Height ◽  
High Yields

Abstract Processing fine pitch flip chip devices continues to pose problems for packaging and manufacturing engineers. Optimizing process parameters such that defects are limited and long-term reliability of the assembly is increased can be a very tedious task. Parameters that effect the robustness of the process include the flux type and placement parameters. Ultimately, these process parameters can effect the long-term reliability of the flip chip assembly by either inhibiting or inducing process defects. Therefore, care is taken to develop a process that is robust enough to supply high yields and long term reliability, but still remains compatible with a standard surface mount technology process. This is where process optimization becomes most critical and difficult. What is the optimum height of the flux thin film used for a dip process? What force is required to insure that the solder bumps make contact with the pads? What are the limiting boundaries in which high yields and high reliabilities are achieved, while maintaining a streamlined, proven process? The following study evaluates a set of process parameters and their impact on process defects and reliability. The study evaluates process parameters including, flux type, flux application parameters, placement force and placement accuracy to determine their impact. Solder voiding, inadequate solder wetting, and crack propagation and delamination in the underfill layer are defects examined in the study. Assemblies will be subjected to liquid-to-liquid thermal shock testing (−55° C to 125°C) to determine failure modes due to the aforementioned defects. The results will show how changes in process parameters effect yield and reliability.

Reliability Evaluation of Underfill Encapsulated Pb-Free Flip Chip Package under Thermal Shock Test

2007 ◽  
Vol 544-545 ◽  
pp. 621-624
Author(s):  
Dae Gon Kim ◽  
Jong Woong Kim ◽  
Sang Su Ha ◽  
Ja Myeong Koo ◽  
Bo In Noh ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Flip Chip ◽  
Solder Bump ◽  
Initial Reaction ◽  
Thermal Shock Test ◽  
Shock Testing ◽  
Thermally Activated ◽  
Solder Fatigue ◽  
Two Phases ◽  
Electroless Ni

Thermo-mechanical reliability of the solder bumped flip chip packages having underfill encapsulant was evaluated with thermal shock testing. In the initial reaction, the reaction product between the solder and Cu mini bump of chip side was Cu6Sn5 IMC layer, while the two phases which were (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 were formed between the solder and electroless Ni-P layer of the package side. A crack was formed at the upper edge region of solder bump, and propagated through the solder region. The primary failure mechanism of the solder joints in this type of package was confirmed to be thermally activated solder fatigue failure. After thermal shocks of 2000 cycles, one more crack which was not observed in the case of non-underfill encapsulated flip chip was observed at the left side of interface between solder bump and substrate. The addition of this crack formation should be due to the underfill encapsulation between the Si chip and substrate.

scholarly journals Thermal Shock Analysis and Testing of Simulated Ceramic Components for Gas Turbine Applications

1995 ◽  
Author(s):  
Harindra Rajiyah ◽  
Louis P. Inzinna ◽  
Gerald G. Trantina ◽  
Robert M. Orenstein ◽  
Martin B. Cutrone
Keyword(s):  
Thermal Shock ◽  
Gas Turbine ◽  
Failure Modes ◽  
Failure Prediction ◽  
Rectangular Plates ◽  
Shock Testing ◽  
Multiple Data ◽  
Ceramic Components ◽  
Transient Thermal ◽  
Data Censoring

A ceramic gas seal for a utility gas turbine was designed and analyzed using ANSYS and CARES/LIFE. SN-88 silicon nitride was selected as the candidate material. The objective was to validate the failure prediction methodology using rectangular plates which were thermally shocked in a fluidized bed. The failure prediction methodology would then be applied to the representative component geometry. Refined ANSYS finite element modeling of both the plate and component geometries was undertaken. The CARES/LIFE reliability analysis of the component geometry for fast fracture was performed for two cases: I) steady-state thermo-mechanical loads during normal gas turbine operation and II) transient thermal shock loading during a turbine trip. Thermal shock testing of alumina disks were performed in order to gain confidence in the testing and analysis procedures. Both notched and unnotched SN88 plates were then tested. Failure modes were identified through flexure tests and data censoring was performed using SAS. Weibull modulus was assumed to be invariant with temperature and the scale parameter was assumed to vary through a scaling variable such that multiple data could be pooled.

Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials

2008 ◽  
Vol 130 (4) ◽  
Author(s):  
Saketh Mahalingam ◽  
Ananth Prabhakumar ◽  
Sandeep Tonapi ◽  
Suresh K. Sitaraman
Keyword(s):  
Experimental Data ◽  
Thermal Shock ◽  
Flip Chip ◽  
Fatigue Loading ◽  
Thermomechanical Fatigue ◽  
Interfacial Delamination ◽  
Shock Testing ◽  
Solder Bumps ◽  
Theoretical Predictions ◽  
Flip Chip Assembly

The occurrence of passivation-underfill interfacial delamination is detrimental to the reliability of the flip chip assembly as it can result in the premature cracking of the solder bumps. In this paper, the propagation of delamination in a nanofilled no-flow underfill material from the chip passivation in flip chip assemblies has been assessed under accelerated thermal shock testing. A theoretical model of the flip chip assembly has been developed, and the delamination occurring at the silicon nitride (SiN)–underfill interface has been studied under monotonic as well as thermomechanical fatigue loading. Using empirical models for delamination propagation, the growth of delamination under monotonic as well as thermomechanical fatigue loading in a flip chip assembly has been predicted. These predictions agree well with the thermal shock cycling experimental data. The agreement between the theoretical predictions and experimental data suggests that the models and the methodology developed in this work can be used to design flip chip assemblies with nanofillled no-flow underfill materials against interfacial delamination.

Thermal Shock Analysis and Testing of Simulated Ceramic Components for Gas Turbine Applications

1996 ◽  
Vol 118 (2) ◽  
pp. 246-250 ◽  
Author(s):  
H. Rajiyah ◽  
L. P. Inzinna ◽  
G. G. Trantina ◽  
R. M. Orenstein ◽  
M. B. Cutrone
Keyword(s):  
Thermal Shock ◽  
Gas Turbine ◽  
Failure Modes ◽  
Failure Prediction ◽  
Rectangular Plates ◽  
Shock Testing ◽  
Multiple Data ◽  
Ceramic Components ◽  
Transient Thermal ◽  
Data Censoring

A ceramic gas seal for a utility gas turbine was designed and analyzed using ANSYS and CARES/LIFE. SN-88 silicon nitride was selected as the candidate material. The objective was to validate the failure prediction methodology using rectangular plates, which were thermally shocked in a fluidized bed. The failure prediction methodology would then be applied to the representative component geometry. Refined ANSYS finite element modeling of both the plate and component geometries was undertaken. The CARES/LIFE reliability analysis of the component geometry for fast fracture was performed for two cases: (I) steady-state thermomechanical loads during normal gas turbine operation and (II) transient thermal shock loading during a turbine trip. Thermal shock testing of alumina disks was performed in order to gain confidence in the testing and analysis procedures. Both notched and unnotched SN88 plates were then tested. Failure modes were identified through flexure tests and data censoring was performed using SAS. Weibull modulus was assumed to be invariant with temperature and the scale parameter was assumed to vary through a scaling variable such that multiple data could be pooled.

Structure Evolution of 7YSZ Thermal Barrier Coating During Thermal Shock Testing

2015 ◽  
Vol 30 (12) ◽  
pp. 1261
Author(s):  
ZHANG Xiao-Feng ◽  
ZHOU Ke-Song ◽  
ZHANG Ji-Fu ◽  
ZHANG Yong ◽  
LIU Min ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Thermal Barrier Coating ◽  
Structure Evolution ◽  
Thermal Barrier ◽  
Shock Testing ◽  
Barrier Coating

281. An evaluation of the critical pv-values of carbons for a mechanical seal by thermal shock testing

Carbon ◽  
1982 ◽  
Vol 20 (2) ◽  
pp. 156
Author(s):  
S. Sato ◽  
K. Kawamata ◽  
J. Aizawa ◽  
M. Ishii
Keyword(s):  
Thermal Shock ◽  
Mechanical Seal ◽  
Shock Testing

Board-Level Reliability of Pb-Free Surface Mounted Assemblies during Thermal Shock Testing

2006 ◽  
Vol 15-17 ◽  
pp. 633-638 ◽  
Author(s):  
Jong Woong Kim ◽  
Hyun Suk Chun ◽  
Sang Su Ha ◽  
Jong Hyuck Chae ◽  
Jin Ho Joo ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Solder Joints ◽  
Lead Frame ◽  
Shear Forces ◽  
Microstructural Investigation ◽  
Shock Testing ◽  
Ceramic Capacitor ◽  
Board Level ◽  
Board Level Reliability ◽  
Thermal Shocks

Board-level reliability of conventional Sn-37Pb and Pb-free Sn-3.0Ag-0.5Cu solder joints was evaluated using thermal shock testing. In the microstructural investigation of the solder joints, the formation of Cu6Sn5 intermetallic compound (IMC) layer was observed between both solders and Cu lead frame, but any crack or newly introduced defect cannot be found even after 2000 cycles of thermal shocks. Shear test of the multi layer ceramic capacitor (MLCC) joints were also conducted to investigate the effect of microstructural variations on the bonding strength of the solder joints. Shear forces of the both solder joints decreased with increasing thermal shock cycles. The reason to the decrease in shear force was discussed with fracture surfaces of the shear tested solder joints.

151. Thermal shock testing using focused electron beam heating

Carbon ◽  
1969 ◽  
Vol 7 (6) ◽  
pp. 732
Author(s):  
R.D Reiswig ◽  
P.E Armstrong ◽  
L.S Levinson
Keyword(s):  
Electron Beam ◽  
Thermal Shock ◽  
Shock Testing ◽  
Beam Heating ◽  
Electron Beam Heating
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