Rapid developmenting of electronic packaging industry of China

2003 ◽  
Author(s):  
Bi Keyun
Keyword(s):  
Electronic Packaging ◽  
Packaging Industry

Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys

2014 ◽  
Vol 26 (3) ◽  
pp. 147-161 ◽  
Author(s):  
Ervina Efzan Mhd Noor ◽  
Amares Singh
Keyword(s):  
Melting Temperature ◽  
Solder Alloy ◽  
Electronic Packaging ◽  
Environmental Concern ◽  
Bulk Solder ◽  
Solidification Temperature ◽  
Content Type ◽  
Snpb Solder ◽  
Packaging Industry ◽  
Sac Solder

Purpose – The aim of the present study was to gather and review all the important properties of the Sn–Ag–Cu (SAC) solder alloy. The SAC solder alloy has been proposed as the alternative solder to overcome the environmental concern of lead (Pb) solder. Many researchers have studied the SAC solder alloy and found that the properties such as melting temperature, wettability, microstructure and interfacial, together with mechanical properties, are better for the SAC solder than the tin – lead (SnPb) solders. Meanwhile, addition of various elements and nanoparticles seems to produce enhancement on the prior bulk solder alloy as well. These benefits suggest that the SAC solder alloy could be the next alternative solder for the electronic packaging industry. Although many studies have been conducted for this particular solder alloy, a compilation of all these properties regarding the SAC solder alloy is still not available for a review to say. Design/methodology/approach – Soldering is identified as the metallurgical joining method in electronic packaging industry which uses filler metal, or well known as the solder, with a melting point < 425°C (Yoon et al., 2009; Ervina and Marini, 2012). The SAC solder has been developed by many methods and even alloying it with some elements to enhance its properties (Law et al., 2006; Tsao et al., 2010; Wang et al., 2002; Gain et al., 2011). The development toward miniaturization, meanwhile, requires much smaller solder joints and fine-pitch interconnections for microelectronic packaging in electronic devices which demand better solder joint reliability of SAC solder Although many studies have been done based on the SAC solder, a review based on the important characteristics and the fundamental factor involving the SAC solder is still not sufficient. Henceforth, this paper resolves in stating all its important properties based on the SAC solder including its alloying of elements and nanoparticles addition for further understanding. Findings – Various Pb-free solders have been studied and investigated to overcome the health and environmental concern of the SnPb solder. In terms of the melting temperature, the SAC solder seems to possess a high melting temperature of 227°C than the Pb solder SnPb. Here, the melting temperature of this solder falls within the range of the average reflow temperature in the electronic packaging industry and would not really affect the process of connection. A good amendment here is, this melting temperature can actually be reduced by adding some element such as titanium and zinc. The addition of these elements tends to decrease the melting temperature of the SAC solder alloy to about 3°C. Adding nanoparticles, meanwhile, tend to increase the melting temperature slightly; nonetheless, this increment was not seemed to damage other devices due to the very slight increment and no drastic changes in the solidification temperature. Henceforth, this paper reviews all the properties of the Pb-free SAC solder system by how it is developed from overcoming environmental problem to achieving and sustaining as the viable candidate in the electronic packaging industry. The Pb-free SAC solder can be the alternative to all drawbacks that the traditional SnPb solder possesses and also an upcoming new invention for the future needs. Although many studies have been done in this particular solder, not much information is gathered in a review to give better understanding for SAC solder alloy. In that, this paper reviews and gathers the importance of this SAC solder in the electronic packaging industry and provides information for better knowledge. Originality/value – This paper resolves in stating of all its important properties based on the SAC solder including its alloying of elements and nanoparticles addition for further understanding.

scholarly journals Silicon Die with Integrated Epoxy for Improved Interface Adhesion

2021 ◽  
pp. 50-53
Author(s):  
F. R. Gomez ◽  
R. Rodriguez
Keyword(s):  
Electronic Packaging ◽  
Die Design ◽  
Interface Adhesion ◽  
Die Attach ◽  
Epoxy Material ◽  
Packaging Industry ◽  
Thin Silicon ◽  
Augmented Design

Breakthroughs and innovations are constantly being developed in electronic packaging industry to address the manufacturing challenges and overcome existing assembly limitations. An augmented design of thin Silicon die is introduced to establish a robust and improved interface adhesion between the die and the die attach material during the die attach process. The wafer preparation flow is also presented. The realization of the augmented die design with integrated epoxy material would ultimately provide a robust connection and would mitigate the die attach related issues such delamination, die cracks and voids.

Effect of Aging Temperature on the Intermetallic Compound (IMC) Formation of Sn-0.7Cu/Si3N4 Composite Solder

2013 ◽  
Vol 795 ◽  
pp. 522-525 ◽  
Author(s):  
S.I. Najib ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Saud Norainiza
Keyword(s):  
Intermetallic Compound ◽  
Aging Temperature ◽  
Electronic Packaging ◽  
Isothermal Aging ◽  
Aging Process ◽  
Composite Solder ◽  
Intermetallic Formation ◽  
Imcs Growth ◽  
Packaging Industry ◽  
Growth Formation

Nowadays, excessive growth intermetallic formation becomes the major issue in electronic packaging industry. The investigation on the effect of aging temperature to the intermetallic compound (IMCs) growth formation for Sn-0.7Cu/1.0-Si3N4 was studied. Isothermal aging process was carried out for 24 hours, with 5 difference aging temperature from 50°C up to 150°C. It is found that the Cu-Sn IMCs which appear after reflowed process, has grew rapidly when aging temperature was increased up to 125°C and started to reduced after 150°C aging temperature.

Polymer Core BGA Stress Analysis at Minimal Vertical Loading

2012 ◽  
Vol 622-623 ◽  
pp. 639-642 ◽  
Author(s):  
Z. Sauli ◽  
V. Retnasamy ◽  
S. Taniselass ◽  
N.A.Z. Rahman ◽  
M.H.A. Aziz
Keyword(s):  
Stress Response ◽  
Stress Analysis ◽  
Electronic Packaging ◽  
Solder Ball ◽  
Ball Grid Array ◽  
New Materials ◽  
Vertical Loading ◽  
Packaging Industry ◽  
Simulation Results

Ball grid array is an interconnection method widely used in the electronic packaging industry. The reliability of the solder ball is being improved by introducing new materials for the solder ball. In this study, the stress response of BGA solder ball during minimum vertical loading is analyzed through simulation. The stress response between two types of solder ball, Normal BGA and Micropearl BGA are compared. The Micropearl BGA is a solder ball which contains polymer core. The vertical loading forces used were 1N and 3N. A commercial computational software ANSYS was used for the simulation. The simulation results showed that the Normal BGA exhibited higher stress response.

POTENTIALS OF THE PACKAGING INDUSTRY OF VIETNAM

2020 ◽  
Vol 14 (6) ◽  
Author(s):  
Nguyen Hoang Nguyen ◽  
Pham Thi Kieu Trang
Keyword(s):  
Packaging Industry

Effect of ink and paperboard characteristics on flexographic print quality based on print density

TAPPI Journal ◽  
2011 ◽  
Vol 10 (9) ◽  
pp. 7-13
Author(s):  
KHODADAD MALMIRCHEGINI ◽  
FARSHAD SARKHOSH RAHMANI
Keyword(s):  
Water Absorption ◽  
Significant Influence ◽  
Particle Diameter ◽  
Print Quality ◽  
Printing Technology ◽  
Plastic Films ◽  
Printing Inks ◽  
Packaging Industry ◽  
Solids Content ◽  
Density Results

Flexography is an evolving printing technology that is suitable for printing on coated and uncoated paperboard and board, nonporous substrates including metalized and paperboard foils, and plastic films used especially in the packaging industry. This study evaluated the effect of paperboard and ink characteristics on flexographic print density in paperboard. Three commercial paperboards from different companies were prepared: brown kraft from Thailand, white kraft from Spain, and test liner from Iran. Four samples of process print inks from Iran were used in this investigation. Paperboard properties, such as roughness and water absorption, and ink characteristics, including solids content, PH and particle diameter, were measured. The inks were printed on paperboards using a roll no.15 applicator with a blade metering device, and the print densities were measured. Results showed that solids content, pH, and particle diameter of printing inks influenced print density, while the roughness and water absorption of the three types of paperboard had no significant influence on print density. Results also illustrated that two levels of ink viscosity (25–30 and 50–55 mPa·s) were insignificant to print density.

Using watermark visibility measurements to select an optimized pair of spot colors for use in a binary watermark

2020 ◽  
Vol 2020 (15) ◽  
pp. 197-1-197-7
Author(s):  
Alastair Reed ◽  
Vlado Kitanovski ◽  
Kristyn Falkenstern ◽  
Marius Pedersen
Keyword(s):  
Food Packaging ◽  
Red Light ◽  
Human Observer ◽  
Viewing Distance ◽  
Point Of Sale ◽  
Complementary Color ◽  
Low Visibility ◽  
Packaging Industry ◽  
Spot Color ◽  
Selection Of

Spot colors are widely used in the food packaging industry. We wish to add a watermark signal within a spot color that is readable by a Point Of Sale (POS) barcode scanner which typically has red illumination. Some spot colors such as blue, black and green reflect very little red light and are difficult to modulate with a watermark at low visibility to a human observer. The visibility measurements that have been made with the Digimarc watermark enables the selection of a complementary color to the base color which can be detected by a POS barcode scanner but is imperceptible at normal viewing distance.

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