Hygrothermal analysis for the electrochemical migration failure in multi-chip packages during a highly accelerated stress test

2012 ◽  
Author(s):  
Jongguk Choe ◽  
Jae-Won Jang ◽  
Nam-Seog Kim ◽  
Soon-Bok Lee
Keyword(s):  
Stress Test ◽  
Electrochemical Migration ◽  
Accelerated Stress Test ◽  
Hygrothermal Analysis

A comparison of the Cu electrochemical migration behavior between Cu lines with 5 um L/S realized by conventional Semi Additive Process (SAP) and an innovative Excimer Laser Damascene Process

2018 ◽  
Vol 2018 (1) ◽  
pp. 000140-000145 ◽  
Author(s):  
Robert Gernhardt ◽  
Friedrich Müller ◽  
Markus Woehrmann ◽  
Habib Hichri ◽  
Karin Hauck ◽  
...  
Keyword(s):  
Excimer Laser ◽  
Stress Test ◽  
Chemical Mechanical Planarization ◽  
Electrochemical Migration ◽  
Migration Behavior ◽  
Additive Process ◽  
Interdigital Capacitor ◽  
Damascene Process ◽  
Accelerated Stress Test ◽  
Cu Migration

Abstract The technological evolution regarding multi-chip integrated Fan-Out packages and chip scale packages (CSPs) with high amounts of I/O demands for even higher routing densities. Conventional used technologies and materials like mask aligner and photosensitive polymers used for semi additive process (SAP) in the BEOL have reached its limits to push the resolution down to two um. New materials and technologies are necessary to overcome these limits. As the routing density increases, so does the reliability requirements. The electrochemical migration between Cu lines cannot be neglected and need to be analyzed as the distance between the Cu lines is decreasing. A new approach for fine-line multi redistribution layers (RDL) realized by an excimer laser dual damascene process was presented in the past, using laser ablation and Cu chemical mechanical planarization (CMP) to realize embedded Cu lines. This approach has several advantages regarding the processing but one of the most important characteristics of the damascene approach is the improved electrochemical migration behavior. The Cu lines are partially cladded by the Ti part of the seed layer due to the way of processing. The Ti acts as a barrier layer and inhibits the Cu migration into the surrounding polymer. RDL structures realized by conventional SAP have Ti only under and not between the Cu lines. In this study different test samples with interdigital structures (resp. interdigital capacitor IDC) with five um line and space width (L/S) were realized to analyze the electrochemical migration behavior between the fingers of the IDC. The samples were realized by SAP and by the excimer laser damascene process and were subsequently tested by the temperature humidity bias (THB) test resp. biased High Accelerated Stress Test (bHAST). With the help of this work, we were able to compare the reliability of both process variants and to demonstrate and prove the reliability of embedded copper lines realized by the excimer laser damascene process.

scholarly journals Boosting efficiency and stability using zirconia nanosphere-held carbon for proton exchange membrane fuel cells

RSC Advances ◽  
2018 ◽  
Vol 8 (1) ◽  
pp. 472-480 ◽  
Author(s):  
P. Dhanasekaran ◽  
Sharon R. Williams ◽  
D. Kalpana ◽  
Santoshkumar D. Bhat
Keyword(s):  
Fuel Cells ◽  
Proton Exchange Membrane ◽  
Stress Test ◽  
Pt Nanoparticles ◽  
Proton Exchange ◽  
Carbon Corrosion ◽  
Accelerated Stress Test ◽  
Exchange Membrane

Corrosion during the accelerated stress test for Pt on carbon and Pt on Zr–C 3 composite representing the steps for reduced carbon corrosion, stabilized Pt nanoparticles and re-deposition of Pt nanoparticles on the ZrO2:C composite.

scholarly journals Developing Accelerated Stress Test Protocols for Solid Oxide Fuel Cells and Electrolysers: The European Project AD ASTRA

2019 ◽  
Vol 91 (1) ◽  
pp. 563-570 ◽  
Author(s):  
Stephen J. McPhail ◽  
Davide Pumiglia ◽  
Jérôme Laurencin ◽  
Anke Hagen ◽  
Aline Leon ◽  
...  
Keyword(s):  
Fuel Cells ◽  
Solid Oxide Fuel Cells ◽  
Stress Test ◽  
Solid Oxide ◽  
Oxide Fuel ◽  
European Project ◽  
Accelerated Stress Test

scholarly journals Towards a Harmonized Accelerated Stress Test Protocol for Fuel Starvation Induced Cell Reversal Events in PEM Fuel Cells: The Effect of Pulse Duration

2020 ◽  
Vol 167 (12) ◽  
pp. 124520 ◽  
Author(s):  
Robert Marić ◽  
Christian Gebauer ◽  
Markus Nesselberger ◽  
Frédéric Hasché ◽  
Peter Strasser
Keyword(s):  
Fuel Cells ◽  
Pulse Duration ◽  
Stress Test ◽  
Pem Fuel Cells ◽  
Test Protocol ◽  
Accelerated Stress Test ◽  
Cell Reversal

Accelerated Stress Test Method for the Assessment of Membrane Lifetime in Vanadium Redox Flow Batteries

2019 ◽  
Vol 11 (51) ◽  
pp. 47917-47928 ◽  
Author(s):  
Fabio J. Oldenburg ◽  
Ayoub Ouarga ◽  
Thomas Justus Schmidt ◽  
Lorenz Gubler
Keyword(s):  
Stress Test ◽  
Test Method ◽  
Redox Flow Batteries ◽  
Flow Batteries ◽  
Accelerated Stress Test ◽  
Membrane Lifetime ◽  
Vanadium Redox
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