A study of microwave curing process for underfill used in flip chip packaging. Part 2: 3D FEM simulation of microwave power distribution inside variable frequency microwave oven

2002 ◽  
Author(s):  
Sung Yi ◽  
Lie Liu ◽  
Chian Kerm Sin ◽  
Fei Su ◽  
Shan Gao
Keyword(s):  
Microwave Power ◽  
Power Distribution ◽  
Flip Chip ◽  
Fem Simulation ◽  
Microwave Oven ◽  
Variable Frequency ◽  
Curing Process ◽  
3D Fem ◽  
Microwave Curing ◽  
Flip Chip Packaging

The Study of Underfill Epoxy Hardness in Reducing Curing Process Time for Flip Chip Packaging

2011 ◽  
Vol 462-463 ◽  
pp. 1194-1199
Author(s):  
Zainudin Kornain ◽  
Azman Jalar ◽  
Rozaidi Rashid ◽  
Shahrum Abdullah
Keyword(s):  
Thermal Expansion ◽  
Flip Chip ◽  
Ball Grid Array ◽  
Process Time ◽  
Curing Process ◽  
Curing Time ◽  
Hold Temperature ◽  
Flip Chip Packaging ◽  
Time Cycle ◽  
The Impact

Underfilling is the vital process to reduce the impact of the thermal stress that results from the mismatch in the co-efficient of thermal expansion (CTE) between the silicon chip and the substrate in Flip Chip Packaging. This paper reported the pattern of underfill’s hardness during curing process for large die Ceramic Flip Chip Ball Grid Array (FC-CBGA). A commercial amine based underfill epoxy was dispensed into HiCTE FC-CBGA and cured in curing oven under a new method of two-step curing profile. Nano-identation test was employed to investigate the hardness of underfill epoxy during curing steps. The result has shown the almost similar hardness of fillet area and centre of the package after cured which presented uniformity of curing states. The total curing time/cycle in production was potentially reduced due to no significant different of hardness after 60 min and 120 min during the period of second hold temperature.

An Optimization of Two-Steps Curing Profile to Eliminate Voids Formation in Underfill Epoxy for Hi-CTE Flip Chip Packaging

2010 ◽  
Vol 97-101 ◽  
pp. 23-27 ◽  
Author(s):  
Zainudin Kornain ◽  
Azman Jalar ◽  
Rozaidi Rashid ◽  
Shahrum Abdullah
Keyword(s):  
Flip Chip ◽  
Coefficient Of Thermal Expansion ◽  
Ball Grid Array ◽  
Statistic Analysis ◽  
Curing Process ◽  
Ceramic Ball ◽  
Die Attach ◽  
Ball Grid Array Package ◽  
Flip Chip Packaging ◽  
The Impact

Underfilling is the preferred process to reduce the impact of the thermal stress that results from the mismatch in the coefficient of thermal expansion (CTE) between the silicon chip and the substrate in Flip Chip Packaging. Voids formation in underfill is considered as failure in flip chip manufacturing process. Voids formation possibly caused by several factors such as poor soldering and flux residue during die attach process, voids entrapment due moisture contamination, dispense pattern process and setting up the curing process. This paper presents the optimization of two steps curing profile in order to reduce voids formation in underfill for Hi-CTE Flip Chip Ceramic Ball Grid Array Package (FC-CBGA). A C-Mode Scanning Aqoustic Microscopy (C-SAM) was used to scan the total count of voids after curing process. Statistic analysis was conducted to analyze the suitable curing profile in order to minimize or eliminate the voids formation. It was shown that the two steps curing profile provided solution for void elimination.

Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability

2009 ◽  
Vol 131 (3) ◽  
Author(s):  
Satoru Katsurayama ◽  
Hironori Tohmyoh
Keyword(s):  
Thermal Cycling ◽  
Flip Chip ◽  
Capillary Flow ◽  
Curing Process ◽  
Assembly Process ◽  
Test Circuit ◽  
Interconnect Reliability ◽  
Flip Chip Packaging ◽  
Underfill Material

In flip chip packages, it is common practice for interconnects to be encapsulated with a liquid underfill material. This paper describes the effects of different underfill processes, i.e., the conventional capillary-flow underfill and two no-flow underfill processes, on flip chip packaging. The warpage of the package was examined, and the value of this during three different underfill encapsulating processes was measured. In addition, the interconnect reliability of the bump bonds after thermal-cycling was evaluated using a test circuit. The warpage of the package before curing varied depending on the assembly process, but that after curing was almost the same for all the processes studied. It was found that the interconnect reliability is closely related to the differences in the warpage arising from the assembly process, and that the smaller change in warpage introduced by the curing process gave a higher interconnect reliability for the bump bonds. Based on these findings, lower curing temperatures are considered to be more effective for improving the mountability of the package and the interconnect reliability.

scholarly journals 3D-FEM Simulation of Hot Rolling Process and Characterization of the Resultant Microstructure of a Light-Weight Mn Steel

Crystals ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 569
Author(s):  
Ana Claudia González-Castillo ◽  
José de Jesús Cruz-Rivera ◽  
Mitsuo Osvaldo Ramos-Azpeitia ◽  
Pedro Garnica-González ◽  
Carlos Gamaliel Garay-Reyes ◽  
...  
Keyword(s):  
Hot Rolling ◽  
Thermomechanical Processing ◽  
Computational Simulation ◽  
Effective Strain ◽  
Fem Simulation ◽  
Rolling Process ◽  
3D Fem ◽  
Hot Rolling Process ◽  
Mn Steel

Computational simulation has become more important in the design of thermomechanical processing since it allows the optimization of associated parameters such as temperature, stresses, strains and phase transformations. This work presents the results of the three-dimensional Finite Element Method (FEM) simulation of the hot rolling process of a medium Mn steel using DEFORM-3D software. Temperature and effective strain distribution in the surface and center of the sheet were analyzed for different rolling passes; also the change in damage factor was evaluated. According to the hot rolling simulation results, experimental hot rolling parameters were established in order to obtain the desired microstructure avoiding the presence of ferrite precipitation during the process. The microstructural characterization of the hot rolled steel was carried out using optical microscopy (OM), scanning electron microscopy (SEM) and X-ray diffraction (XRD). It was found that the phases present in the steel after hot rolling are austenite and α′-martensite. Additionally, to understand the mechanical behavior, tensile tests were performed and concluded that this new steel can be catalogued in the third automotive generation.

3D-FEM simulation model of the Earth-ionosphere cavity

2019 ◽  
Vol 33 (6) ◽  
pp. 734-742 ◽  
Author(s):  
E. S. Goncharov ◽  
A. N. Lyakhov ◽  
T. V. Loseva
Keyword(s):  
Simulation Model ◽  
Fem Simulation ◽  
3D Fem ◽  
The Earth

A High-Linearity 76–85-GHz 16-Element 8-Transmit/8-Receive Phased-Array Chip With High Isolation and Flip-Chip Packaging

2014 ◽  
Vol 62 (10) ◽  
pp. 2337-2356 ◽  
Author(s):  
Bon-Hyun Ku ◽  
Ozgur Inac ◽  
Michael Chang ◽  
Hyun-Ho Yang ◽  
Gabriel M. Rebeiz
Keyword(s):  
Flip Chip ◽  
Phased Array ◽  
High Isolation ◽  
High Linearity ◽  
Flip Chip Packaging
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