3D Silicon Photonics Interposer for Tb/s Optical Interconnects in Data Centers with Double-Side Assembled Active Components and Integrated Optical and Electrical Through Silicon Via on SOI

Author(s):  
Bogdan Sirbu ◽  
Yann Eichhammer ◽  
Hermann Oppermann ◽  
Tolga Tekin ◽  
Jochen Kraft ◽  
...  
2017 ◽  
Vol 35 (4) ◽  
pp. 631-638 ◽  
Author(s):  
M. Pantouvaki ◽  
S. A. Srinivasan ◽  
Y. Ban ◽  
P. De Heyn ◽  
P. Verheyen ◽  
...  

1996 ◽  
Author(s):  
B. Laurich ◽  
I. Campbell ◽  
D. Smith ◽  
A. Bishop ◽  
A. Saxena ◽  
...  

2005 ◽  
Author(s):  
Torsten Wipiejewski ◽  
Ben Lui ◽  
Eric Tong ◽  
Kin Yau ◽  
Vincent Hung ◽  
...  

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