Millimeter-Wave Antenna in Fan-Out Wafer Level Packaging for 60 GHz WLAN Application

Author(s):  
Zihao Chen ◽  
Lim Teck Guan ◽  
David Soon Wee Ho ◽  
Surya Bhattacharya
2012 ◽  
Vol 173 (1) ◽  
pp. 238-243 ◽  
Author(s):  
E. Herth ◽  
S. Seok ◽  
N. Rolland ◽  
T. Lasri

2021 ◽  
Vol 2021 ◽  
pp. 1-15
Author(s):  
H. M. Arifur Rahman ◽  
Mohammad Monirujjaman Khan ◽  
Mohammed Baz ◽  
Mehedi Masud ◽  
Mohammed A. AlZain

This paper presents a novel design for a multiple band millimeter wave antenna with a wide active region in the extremely high frequency (EHF) range. The antenna's performance was tested at three evenly separated frequencies: 60 GHz within the V-band region, 80 GHz within the E-band region, and 100 GHz. Simulation exhibits satisfactory results in terms of gain and efficiency, although the efficiency falling tendency for higher frequency persists. As millimeter wave antennas have miniature-like dimensions and low penetration depth into human body layers, the performance of these antennas is less disturbed by the presence of a human body, making them ideal for body-centric wireless communication (BCWC) applications. Thus, a human body model was created virtually with the necessary property data. Simulations are repeated at the same frequencies as before, with the antenna kept close to the constructed human body model. The results were promising as the gains found increased radiation patterns and return loss curves remained almost identical, except some efficiencies that were considered. Some H-plane radiation patterns are changed by the presence of a human body. Although all three frequencies present satisfactory results, 60 GHz is found to be more balanced, but 100 GHz shows better gain and directivity. Multiple band operability makes this antenna suitable for various applications. Finally, a distance-based analysis was conducted to realize the in-depth characteristics of the antenna by placing the antenna at five different gaps from the human body. The result verifies the antenna’s category as suitable for body-centric communications.


IEEE Access ◽  
2021 ◽  
pp. 1-1
Author(s):  
Sandhiya Reddy Govindarajulu ◽  
Rimon Hokayem ◽  
Elias A. Alwan

2011 ◽  
Vol 3 (2) ◽  
pp. 179-188 ◽  
Author(s):  
Christophe Calvez ◽  
Romain Pilard ◽  
Christian Person ◽  
Jean-Philippe Coupez ◽  
François Gallée ◽  
...  

Antenna on chip (AoC) and antenna in package (AiP) solutions for millimeter-wave (mmWave) applications and their characterization are presented in this paper. Antenna integration on low resistivity (LR) and high resistivity (HR) silicon substrate are expected. And, in a packaging approach, the combination of antenna on silicon with a material, which has the effect of a “lens”, allowing increasing gain is presented. In a second part, to satisfy beamforming capabilities, a hybrid integration of the antenna on silicon and glass substrates is proposed.


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