Fabrication of 3D Hybrid Pixel Detector Modules Based on TSV Processing and Advanced Flip Chip Assembly of Thin Read Out Chips

2017 ◽  
Author(s):  
Kai Zoschke ◽  
Hermann Opperman ◽  
Thomas Fritzsch ◽  
Mario Rothermund ◽  
Ulf Oestermann ◽  
...  
Keyword(s):  
Flip Chip ◽  
Pixel Detector ◽  
Flip Chip Assembly

Flip chip assembly of thinned chips for hybrid pixel detector applications

2014 ◽  
Vol 9 (05) ◽  
pp. C05039-C05039 ◽  
Author(s):  
T Fritzsch ◽  
K Zoschke ◽  
M Woehrmann ◽  
M Rothermund ◽  
F Huegging ◽  
...  
Keyword(s):  
Flip Chip ◽  
Pixel Detector ◽  
Flip Chip Assembly

Flip chip assembly with advanced RDL technology

2013 ◽  
Author(s):  
Shengmin Wen ◽  
KyungRok Park ◽  
Patrick Thompson ◽  
Dwayne Shirley ◽  
JeongSeok Lee ◽  
...  
Keyword(s):  
Flip Chip ◽  
Flip Chip Assembly

scholarly journals Characterization of Ni/SnPb-TiW/Pt Flip Chip Interconnections in Silicon Pixel Detector Modules

2015 ◽  
Author(s):  
Aneliya KARADZHINOVA ◽  
Anton Nolvi ◽  
Jaakko Härkönen ◽  
Panja Luukka ◽  
Teppo Mäenpää ◽  
...  
Keyword(s):  
Flip Chip ◽  
Pixel Detector ◽  
Silicon Pixel Detector

Solder and Solderless Flip Chip Assembly on a MCM-D in a BGA Package

1998 ◽  
pp. 79-79
Author(s):  
Peter Bodo ◽  
Hans Hentzell ◽  
Jan Strandberg ◽  
Joacim Haglund ◽  
Sima Valizadeh
Keyword(s):  
Flip Chip ◽  
Bga Package ◽  
Flip Chip Assembly
Sign in / Sign up

Export Citation Format

Share Document