Effect of Epoxy Flux Underfill on Thermal Cycling Reliability of Sn-8Zn-3Bi Lead-Free Solder in a Sensor Application

2016 ◽  
Author(s):  
M. Mostofizadeh ◽  
M. Najari ◽  
D. Das ◽  
M. Pecht ◽  
L. Frisk
Keyword(s):  
Thermal Cycling ◽  
Lead Free ◽  
Lead Free Solder ◽  
Sensor Application ◽  
Free Solder

Thermal Cycling Reliability of Chip Resistor Lead Free Solder Joints

2003 ◽  
Author(s):  
N. Islam ◽  
J. C. Suhling ◽  
P. Lall ◽  
T. Shete ◽  
H. S. Gale ◽  
...  
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Fatigue Resistance ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Snagcu Alloy ◽  
Temperature Ranges ◽  
Free Solder

In this study, we have examined the thermal cycling reliability of several lead free chip resistor solder joint configurations. Five sizes of resistors (2512, 1206, 0805, 0603, 0402), 2 temperature ranges (−40 to 125°C and −40 to 150°C), and five different solder types have been examined. The solders include the normal SnAgCu alloy recommended by earlier studies (95.5Sn-3.8Ag-0.7Cu), and several variations that include small percentages of Bismuth and Indium to enhance fatigue resistance. Results have been compared to data for standard 63Sn-37Pb joints.

RELIABILITY EVALUATION OF BGA SOLDER JOINTS DURING ACCELERATED LIFE TEST

2006 ◽  
Vol 20 (25n27) ◽  
pp. 4553-4558
Author(s):  
OUK SUB LEE ◽  
NO HOON MYOUNG ◽  
DONG HYEOK KIM ◽  
MAN JAE HUR ◽  
SI WOON HWANG
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Coefficient Of Thermal Expansion ◽  
Accelerated Life Test ◽  
Lead Free ◽  
Lead Free Solder ◽  
Metal Fatigue ◽  
Mechanical Loads ◽  
Free Solder

The use of BGA (Ball Grid Array) interconnects utilizing the lead-free solder joint has grown rapidly because of its small volume and diversity of application. Thus, it requires the continuous quantification and refinement of lead-free solder joint reliability. The lead-free solder creep and cyclically applied mechanical loads cause metal fatigue on the lead-free solder joint which inevitably leads to an electrical discontinuity. In the field application, BGA solder joints experience mechanical loads during temperature changes caused by power up/down events as the result of the CTE (Coefficient of Thermal Expansion) mismatch between the substrate and the Si die. In this paper, extremely small resistance changes at joint area corresponding to through-cracks generated by thermal fatigue were measured. In this way, the failure was defined in terms of anomalous changes in electrical resistance of the joint. Furthermore the reliability of BGA solder joints in thermal cycling is evaluated by using the modified coffin-Manson criterion which may define and distinguish failure. Any change in circuit resistance according to the accumulated damage induced by the thermal cycling in the joint was recorded and evaluated in order to quantitate reliability of solder joint.

scholarly journals Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling – ERRATUM

2012 ◽  
Vol 27 (6) ◽  
pp. 978-978 ◽  
Author(s):  
Hongtao Chen ◽  
Maik Mueller ◽  
Toni Tuomas Mattila ◽  
Jue Li ◽  
Xuwen Liu ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Aging Effects on the Mechanical Behavior and Reliability of SAC Alloys

2009 ◽  
Author(s):  
Yifei Zhang ◽  
Zijie Cai ◽  
Jeffrey C. Suhling ◽  
Pradeep Lall
Keyword(s):  
Thermal Cycling ◽  
Mechanical Behavior ◽  
Room Temperature ◽  
Material Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
Aging Effects ◽  
Free Solder ◽  
Effects Of Aging ◽  
Temperature Aging

The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In our prior work on aging effects, we have demonstrated that the observed material behavior variations of Sn-Ag-Cu (SAC) lead free solders during room temperature aging (25°C) and elevated temperature aging (125°C) were unexpectedly large and universally detrimental to reliability. Such effects for lead free solder materials are especially important for the harsh applications environments present in high performance computing and in automotive, aerospace, and defense applications. However, there has been little work in the literature, and the work that has been done has concentrated on the degradation of solder ball shear strength (e.g. Dage Shear Tester). Current finite element models for solder joint reliability during thermal cycling accelerated life testing are based on traditional solder constitutive and failure models that do not evolve with material aging. Thus, there will be significant errors in the calculations with the new lead free SAC alloys that illustrate dramatic aging phenomena. In the current work, we have extended our previous studies to include a full test matrix of aging temperatures and solder alloys. The effects of aging on mechanical behavior have been examined by performing stress-strain and creep tests on four different SAC alloys (SAC105, SAC205, SAC305, SAC405) that were aged for various durations (0–6 months) at room temperature (25°C), and several elevated temperatures (50, 75, 100, and 125°C). Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Variations of the mechanical and creep properties (elastic modulus, yield stress, ultimate strength, creep compliance, etc.) were observed and modeled as a function of aging time and aging temperature. In this paper, we report on the creep results. The chosen selection of SAC alloys has allowed us to explore the effects of silver content on aging behavior (we have examined SACN05 with N = 1%, 2%, 3%, and 4% silver; with all alloys containing 0.5% copper). In order to reduce the aging induced degradation of the material behavior of the SAC alloys, we are testing several doped SAC alloys in our ongoing work. These materials include SAC0307-X, SAC105-X, and SAC305-X; where the standard SAC alloys have been modified by the addition of small percentages of one or more additional elements (X). Using dopants (e.g. Bi, In, Ni, La, Mg, Mn, Ce, Co, Ti, etc.) has become widespread to enhance shock/drop reliability, and we have extended this approach to examine the ability of dopants to reduce the effects of aging and extend thermal cycling reliability.

Effects of Thermal Cycling on the Mechanical and Microstructural Evolution of SAC305 Lead-Free Solder

2019 ◽  
Author(s):  
S. M. Kamrul Hasan ◽  
Abdullah Fahim ◽  
Jeffrey C. Suhling ◽  
Sa’d Hamasha ◽  
Pradeep Lall
Keyword(s):  
Mechanical Properties ◽  
Elastic Modulus ◽  
High Temperature ◽  
Thermal Cycling ◽  
Microstructural Evolution ◽  
Lead Free ◽  
Lead Free Solder ◽  
Temperature Extreme ◽  
Aging Effects ◽  
Free Solder

Abstract Lead free electronic assemblies are often subjected to thermal cycling during qualification testing or during actual use. The dwell periods at the high temperature extreme during thermal cycling cause thermal aging phenomena in the solder material, including microstructural evolution and material property degradation. In addition, lead free solders can also experience aging effects during the ramp periods between the low and high temperature extremes of the cycling. In this study, the mechanical behavior evolution occurring in SAC305 lead free solder subjected to various thermal cycling exposures has been investigated. Uniaxial test specimens were prepared by reflowing solder in rectangular cross-section glass tubes with a controlled temperature profile. After reflow solidification, the samples were placed into the environmental chamber and thermally cycled from −40 C to +125 C under a stress-free condition (no load). Several thermal cycling profiles were examined including: (1) 90 minute cycles with 15 minutes ramps and 30 minutes dwells, (2) air-to-air thermal shock exposures with 30 minutes dwells and near instantaneous ramps, (3) 30 minute cycles with 15 minutes ramps and no dwells (saw tooth profile), (4) 150 minute cycles with 45 minutes ramps and 30 minutes dwells, and (5) no cycling (simple aging at the high temperature extreme). For each profile, 10–15 samples were cycled for various durations of cycling (e.g. 48, 96, and 240 cycles), which were equivalent to various aging times at the high temperature extreme of T = 125 C. After cycling, the stress-strain curves and mechanical properties including effective elastic modulus and Ultimate Tensile Strength (UTS) of all the cycled samples were measured. For each cycling profile, the evolutions of the mechanical properties were characterized as a function of the cycling duration, as well as the net aging time at the high temperature extreme. Comparison of the results of various thermal cycling profiles showed that the detrimental effects of aging are accelerated in a thermal cycling environment. Furthermore, microstructure evolution during thermal cycling has also been investigated to validate the observed mechanical properties degradation. The test results revealed that the mechanical properties degradation of SAC305 are higher in thermal cycling compared to simple equivalent aging. For example, the elastic modulus and UTS of SAC305 reduced by 41%, and 38%, respectively after 5 days aging whereas these properties reduced by 69%, and 51%, respectively after 5 days equivalent aging using thermal cycling profile #4 (240 cycles).

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