Crystal plasticity finite element analysis of electromigration-induced deformation behavior in lead-free solder joints

2015 ◽  
Author(s):  
Jiamin Ni ◽  
Antoinette Maniatty ◽  
Yong Liu ◽  
Jifa Hao
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Crystal Plasticity ◽  
Deformation Behavior ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Element Analysis ◽  
Crystal Plasticity Finite Element ◽  
Free Solder

scholarly journals Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis

2001 ◽  
Vol 42 (5) ◽  
pp. 809-813 ◽  
Author(s):  
Young-Eui Shin ◽  
Kyung-Woo Lee ◽  
Kyong-Ho Chang ◽  
Seung-Boo Jung ◽  
Jae Pil Jung
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Lead Free ◽  
Element Analysis ◽  
Thermal Fatigue Life
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