Reliability evaluation of an extreme TSV interposer and interconnects for the 20nm technology CoWoS IC package

2015 ◽  
Author(s):  
Bahareh Banijamali ◽  
Tom Lee ◽  
Henley Liu ◽  
Suresh Ramalingam ◽  
Ivor Barber ◽  
...  
Keyword(s):  
Reliability Evaluation ◽  
Ic Package

Reliability evaluation of a CoWoS-enabled 3D IC package

2013 ◽  
Author(s):  
Bahareh Banijamali ◽  
Chien-Chia Chiu ◽  
Cheng-Chieh Hsieh ◽  
Tsung-Shu Lin ◽  
Clark Hu ◽  
...  
Keyword(s):  
Reliability Evaluation ◽  
3D Ic ◽  
Ic Package

Acoustic microscopy techniques for the inspection of integrated circuit devices and packages

1992 ◽  
Vol 50 (2) ◽  
pp. 966-967
Author(s):  
Thomas M. Moore
Keyword(s):  
Integrated Circuit ◽  
Acoustic Microscopy ◽  
Hybrid Technique ◽  
Frequency Scanning ◽  
Ic Packaging ◽  
Ic Package ◽  
Microscopy Techniques ◽  
Ic Package Inspection ◽  
Pulse Echo ◽  
Scanning Acoustic Microscope

In the last decade, a variety of characterization techniques based on acoustic phenomena have come into widespread use. Characteristics of matter waves such as their ability to penetrate optically opaque solids and produce image contrast based on acoustic impedance differences have made these techniques attractive to semiconductor and integrated circuit (IC) packaging researchers.These techniques can be divided into two groups. The first group includes techniques primarily applied to IC package inspection which take advantage of the ability of ultrasound to penetrate deeply and nondestructively through optically opaque solids. C-mode Acoustic Microscopy (C-AM) is a recently developed hybrid technique which combines the narrow-band pulse-echo piezotransducers of conventional C-scan recording with the precision scanning and sophisticated signal analysis capabilities normally associated with the high frequency Scanning Acoustic Microscope (SAM). A single piezotransducer is scanned over the sample and both transmits acoustic pulses into the sample and receives acoustic echo signals from the sample.

Reliability evaluation of substation control systems

1999 ◽  
Vol 146 (6) ◽  
pp. 626 ◽  
Author(s):  
L.R. Castro Ferreira ◽  
P.A. Crossley ◽  
J. Goody ◽  
R.N. Allan
Keyword(s):  
Control Systems ◽  
Reliability Evaluation

Reliability Evaluation for a Wet-Plated Electrode with a Al/Al2O3/Cu Insulated Metal Substrate

2013 ◽  
Vol 51 (7) ◽  
pp. 523-527 ◽  
Author(s):  
Su-Jeong Suh ◽  
Chang-Hyoung Lee ◽  
Young-Lae Cho ◽  
Hwa-Sun Park ◽  
Won-Pyo Lee ◽  
...  
Keyword(s):  
Reliability Evaluation ◽  
Metal Substrate

A Hybrid Method for Distribution Substation Reliability Evaluation

2017 ◽  
Vol 12 (2) ◽  
pp. 142
Author(s):  
Hemakumar Reddy Galiveeti ◽  
Arup Kumar Goswami ◽  
Nalin B. Dev Choudhury
Keyword(s):  
Hybrid Method ◽  
Reliability Evaluation
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