Removed organic solderability preservative (OSPs) by Ar/O2 microwave plasma to improve solder joint in thermal compression flip chip bonding

2014 ◽  
Author(s):  
Jr-Wei Peng ◽  
Yan-Siang Chen ◽  
Yi Chen ◽  
Jiang-Long Liang ◽  
Kwang-Lung Lin ◽  
...  
Keyword(s):  
Solder Joint ◽  
Flip Chip ◽  
Microwave Plasma ◽  
Thermal Compression ◽  
Organic Solderability Preservative ◽  
Flip Chip Bonding

Investigation of Flip-Chip Bonding for MEMS Applications

2004 ◽  
Vol 126 (1) ◽  
pp. 48-51 ◽  
Author(s):  
W. Salalha ◽  
E. Zussman ◽  
P. Z. Bar-Yoseph
Keyword(s):  
Finite Element ◽  
Solder Joint ◽  
Flip Chip ◽  
Bond Number ◽  
Bonding Process ◽  
Mems Devices ◽  
Finite Element Analyses ◽  
Flip Chip Bonding ◽  
Solder Volume ◽  
Simulation Results

An investigation of the flip-chip bonding process for application in MEMS devices was carried out. Finite element analyses of axisymmetric and non-axisymmetric solder joint geometries were performed. It was found that in typical cases of MEMS devices in which the solder volume is small (Bo≪1, where Bo is the Bond number), the finite element solution of the axisymmetric solder joint is well approximated by a surface of revolution whose generating meridian is a circular arc. Experimental results of solder joints in flip-chip assembly were found to correlate well with simulation results.

Development of a novel thermal compression flip chip bonding with pre-applied NCF underfill

2012 ◽  
Author(s):  
Kota Takeda ◽  
Takao Koshi ◽  
Kenkichi Arai ◽  
Yoshihiro Machida ◽  
Kiyoshi Oi ◽  
...  
Keyword(s):  
Flip Chip ◽  
Thermal Compression ◽  
Flip Chip Bonding

Fully integrated low-power flip chip bonding of arrayed optoelectronic devices on SOS

2002 ◽  
Author(s):  
Ronald E. Reedy ◽  
Hal Anthony ◽  
Charles Kuznia ◽  
Mike Pendelton ◽  
Jim Cable ◽  
...  
Keyword(s):  
Low Power ◽  
Flip Chip ◽  
Optoelectronic Devices ◽  
Fully Integrated ◽  
Flip Chip Bonding

Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies

2014 ◽  
Vol 54 (5) ◽  
pp. 939-944 ◽  
Author(s):  
Ye Tian ◽  
Xi Liu ◽  
Justin Chow ◽  
Yi Ping Wu ◽  
Suresh K. Sitaraman
Keyword(s):  
Solder Joint ◽  
Experimental Evaluation ◽  
Flip Chip ◽  
Solder Joint Reliability ◽  
Snagcu Solder ◽  
Joint Reliability
Sign in / Sign up

Export Citation Format

Share Document