A novel method to predict fluid/structure interaction in IC packaging
Keyword(s):
2013 ◽
Vol 116
(1131)
◽
pp. 71-73
2012 ◽
Vol 52
(1)
◽
pp. 241-252
◽
2017 ◽
Vol 239
◽
pp. 012010
Keyword(s):
2018 ◽
Vol 28
(2)
◽
pp. 306-315
◽
2013 ◽
Vol 65
(11)
◽
pp. 1120-1127
◽