Current density effects on the electrical reliability of ultra fine-pitch micro-bump for TSV integration

Author(s):  
Young-Bae Park ◽  
Seung-Hyun Kim ◽  
Jong-Jin Park ◽  
June-Bum Kim ◽  
Ho-Young Son ◽  
...  
1990 ◽  
Vol 360 ◽  
pp. 305 ◽  
Author(s):  
N. J. Sack ◽  
R. Schuster ◽  
A. Khedim ◽  
R. Koppmann ◽  
A. Hofmann

2011 ◽  
Author(s):  
K. Sundaram ◽  
V. Dhanasekaran ◽  
T. Mahalingam ◽  
M. Raja ◽  
Takeyu Kim ◽  
...  

1994 ◽  
Vol 128 (3) ◽  
pp. 205-214 ◽  
Author(s):  
N. Ray ◽  
P. Rajasekar ◽  
P. Chakraborty ◽  
S. D. Dey

1985 ◽  
Vol 135 (2-3) ◽  
pp. 280-282 ◽  
Author(s):  
Nandini Ray ◽  
P. Chakraborty ◽  
S.D. Dey

Sign in / Sign up

Export Citation Format

Share Document