Flux function added solder anisotropic conductive films (ACFs) for high power and fine pitch assemblies

2013 IEEE 63rd Electronic Components and Technology Conference ◽

10.1109/ectc.2013.6575805 ◽

2013 ◽

Cited By ~ 10

Author(s):

Seung-Ho Kim ◽

Yongwon Choi ◽

Yoosun Kim ◽

Kyung-Wook Paik

Keyword(s):

High Power ◽

Flux Function ◽

Conductive Films ◽

Fine Pitch

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High power and fine pitch assembly using solder Anisotropic Conductive Films (ACFs) combined with ultrasonic bonding technique

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2010.5490937 ◽

2010 ◽

Cited By ~ 3

Author(s):

Kiwon Lee ◽

Kyung Wook Paik

Keyword(s):

High Power ◽

Conductive Films ◽

Ultrasonic Bonding ◽

Fine Pitch ◽

Bonding Technique

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Nanofiber ACFs (anisotropic conductive films) for ultra-fine pitch interconnection

2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO) ◽

10.1109/nano.2015.7388671 ◽

2015 ◽

Author(s):

Kyung-Wook Paik ◽

Sang-Hoon Lee ◽

Tae-Wan Kim

Keyword(s):

Conductive Films ◽

Fine Pitch

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A Study on the Magnetic Dispersion of the Conductive Particles of Anchoring-Polymer-Layer Anisotropic Conductive Films and Its Fine-Pitch Interconnection Properties

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2019.2921055 ◽

2019 ◽

Vol 9 (7) ◽

pp. 1235-1243

Author(s):

Jun-Ho Byeon ◽

Dal-Jin Yoon ◽

Kyung-Wook Paik

Keyword(s):

Polymer Layer ◽

Conductive Films ◽

Fine Pitch ◽

Conductive Particles

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Anisotropic conductive films (ACFs) for ultra-fine pitch chip-on-glass (COG) applications

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432074 ◽

2005 ◽

Cited By ~ 2

Author(s):

Myung Jin Yim ◽

Jinsang Hwang ◽

Kyung Wook Paik

Keyword(s):

Conductive Films ◽

Fine Pitch

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A Study on Nano-Sized Silica Contents and Size Effect in Non-conductive Films (NCFs) for Ultra Fine-Pitch Cu-Pillar/Sn-Ag Micro-Bump Interconnection

2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2017.101 ◽

2017 ◽

Cited By ~ 1

Author(s):

Hanmin Lee ◽

Seyong Lee ◽

Semin Cho ◽

Younghyun Yu ◽

Jongho Park ◽

...

Keyword(s):

Size Effect ◽

Conductive Films ◽

Cu Pillar ◽

Fine Pitch

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A Study on the Double Layer Non Conductive Films (NCFs) for Fine-Pitch Cu-Pillar/Sn-Ag Micro-Bump Interconnection

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.128 ◽

2016 ◽

Cited By ~ 6

Author(s):

SeYong Lee ◽

Ji-Won Shin ◽

Hyeong Gi Lee ◽

Young Soon Kim ◽

Kyung-Wook Paik

Keyword(s):

Double Layer ◽

Conductive Films ◽

Cu Pillar ◽

Fine Pitch

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Fine pitch flex-on-flex (FOF) assembly using nanofiber solder anisotropic conductive films (ACFs) and ultrasonic bonding method

2013 IEEE 63rd Electronic Components and Technology Conference ◽

10.1109/ectc.2013.6575804 ◽

2013 ◽

Author(s):

Sang Hoon Lee ◽

Kyung Lim Suk ◽

Kyung-Wook Paik

Keyword(s):

Conductive Films ◽

Ultrasonic Bonding ◽

Fine Pitch ◽

Bonding Method

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High Performance Nano-scale Conductive Films with Low Temperature Sintering for Fine Pitch Electronic Interconnect

High Density Design Packaging and Microsystem Integration, 2007 International Symposium on ◽

10.1109/hdp.2007.4283593 ◽

2007 ◽

Cited By ~ 1

Author(s):

Yi Li ◽

M.J. Yim ◽

K.S. Moon ◽

C.P. Wong

Keyword(s):

Low Temperature ◽

High Performance ◽

Low Temperature Sintering ◽

Conductive Films ◽

Nano Scale ◽

Fine Pitch

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A Study on the Anchoring Polymer Layer (APL) Anisotropic Conductive Films (ACFs) with Self-Exposed Conductive Particles Surface for Ultra-Fine Pitch Chip-on-Glass (COG) Applications

2019 IEEE 69th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2019.000-7 ◽

2019 ◽

Author(s):

Dal-Jin Yoon ◽

Kyung-Wook Paik

Keyword(s):

Polymer Layer ◽

Conductive Films ◽

Fine Pitch ◽

Conductive Particles

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A Study on the Conductive Particle Movements in Polyvinylidene Fluoride Anchoring Polymer Layer Anisotropic Conductive Films for 20- $\mu$ m Fine-Pitch Interconnection

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2019.2891256 ◽

2019 ◽

Vol 9 (2) ◽

pp. 209-215 ◽

Cited By ~ 1

Author(s):

Sang-Hoon Lee ◽

Dal-Jin Yoon ◽

Kyung-Wook Paik

Keyword(s):

Polyvinylidene Fluoride ◽

Polymer Layer ◽

Conductive Particle ◽

Conductive Films ◽

Fine Pitch

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