Development of CMOS-process-compatible interconnect technology for 3D-stacking of NAND flash memory chips
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2012 ◽
Vol 12
(10)
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pp. 7604-7618
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2012 ◽
Vol E95.C
(5)
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pp. 837-841
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2020 ◽
Vol E103.C
(4)
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pp. 171-180
2013 ◽
Vol E96.A
(12)
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pp. 2645-2651
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