High resolution analysis of intermetallic compounds in microelectronic interconnects using Electron Backscatter Diffraction and Transmission Electron Microscopy
2009 ◽
Vol 385
(2)
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pp. 231-235
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2009 ◽
Vol 24
(3)
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pp. 647-651
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2014 ◽
Vol 778-780
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pp. 226-229
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2016 ◽
Vol 61
(1)
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pp. 461-468
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2006 ◽
Vol 224
(3)
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pp. 306-321
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2010 ◽
Vol 160
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pp. 211-216
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