Electromigration failure with thermal gradient effect in SnAgCu solder joints with various UBM

2009 ◽  
Author(s):  
Luhua Xu ◽  
S.W. Liang ◽  
Di Xu ◽  
Jung-Kyu Han ◽  
Jarrett Liang ◽  
...  
Keyword(s):  
Thermal Gradient ◽  
Solder Joints ◽  
Snagcu Solder ◽  
Gradient Effect

Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu

2007 ◽  
Vol 47 (12) ◽  
pp. 2161-2168 ◽  
Author(s):  
Weiqun Peng ◽  
Eduardo Monlevade ◽  
Marco E. Marques
Keyword(s):  
Thermal Aging ◽  
Solder Joints ◽  
Interfacial Structure ◽  
Snagcu Solder

A Theoretical Study of the Temperature Gradient Effect on the Soret Coefficient in n-Pentane/n-Decane Mixtures Using Non-Equilibrium Molecular Dynamics

2020 ◽  
Vol 45 (4) ◽  
pp. 319-332
Author(s):  
Xiaoyu Chen ◽  
Ruquan Liang ◽  
Yong Wang ◽  
Ziqi Xia ◽  
Lichun Wu ◽  
...  
Keyword(s):  
Molecular Dynamics ◽  
Temperature Gradient ◽  
Thermal Gradient ◽  
Linear Response ◽  
Theoretical Study ◽  
Soret Coefficient ◽  
Thermal Gradients ◽  
Gradient Effect ◽  
Non Equilibrium Molecular Dynamics ◽  
Non Equilibrium

AbstractThe effect of the temperature gradient on the Soret coefficient in n-pentane/n-decane (n-C5/n-C10) mixtures was investigated using non-equilibrium molecular dynamics (NEMD) with the heat exchange (eHEX) algorithm. n-Pentane/n-decane mixtures with three different compositions (0.25, 0.5, and 0.75 mole fractions, respectively) and the TraPPE-UA force field were used in computing the Soret coefficient ({S_{T}}) at 300 K and 1 atm. Added/removed heat quantities (ΔQ) of 0.002, 0.004, 0.006, 0.008, and 0.01 kcal/mol were employed in eHEX processes in order to study the effect of different thermal gradients on the Soret coefficient. Moreover, a phenomenological description was applied to discuss the mechanism of this effect. Present results show that the Soret coefficient values firstly fluctuate violently and then become increasingly stable with increasing ΔQ (especially in the mixture with a mole fraction of 0.75), which means that ΔQ has a smaller effect on the Soret coefficient when the temperature gradient is higher than a certain thermal gradient. Thus, a high temperature gradient is recommended for calculating the Soret coefficient under the conditions that a linear response and constant phase are ensured in the system. In addition, the simulated Soret coefficient obtained at the highest ΔQ within three different compositions is in great agreement with experimental data.

A competition between stress triaxiality and joule heating on microstructure evolution and degradation of SnAgCu solder joints

2020 ◽  
Vol 54 ◽  
pp. 221-227
Author(s):  
Waluyo Adi Siswanto ◽  
M. Arun ◽  
Irina V. Krasnopevtseva ◽  
A. Surendar ◽  
Andino Maseleno
Keyword(s):  
Joule Heating ◽  
Microstructure Evolution ◽  
Solder Joints ◽  
Stress Triaxiality ◽  
Snagcu Solder

scholarly journals Mechanical Behaviour of Grains in SnAgCu Solder Joints

2006 ◽  
Author(s):  
Jicheng Gong ◽  
Changqing Liu ◽  
Paul P. Conway ◽  
Vadim V. Silberschmidt
Keyword(s):  
Mechanical Behaviour ◽  
Solder Joints ◽  
Snagcu Solder

scholarly journals A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints

2018 ◽  
Vol 47 (5) ◽  
pp. 2526-2544 ◽  
Author(s):  
Peter Borgesen ◽  
Luke Wentlent ◽  
Sa’d Hamasha ◽  
Saif Khasawneh ◽  
Sam Shirazi ◽  
...  
Keyword(s):  
Thermal Fatigue ◽  
Solder Joints ◽  
Snagcu Solder ◽  
Fatigue Model

Experimental Study of Thermomigration in Lead-Free Nanoelectronics Solder Joints

2006 ◽  
Author(s):  
Mohd F. Abdulhamid ◽  
Cemal Basaran ◽  
Douglas C. Hopkins
Keyword(s):  
Experimental Study ◽  
Intermetallic Compound ◽  
Thermal Gradient ◽  
Solder Joints ◽  
Lead Free ◽  
Cold Side ◽  
High Thermal Gradient

The study of thermomigration on Sn-Ag-Cu solder sphere subjected to a high thermal gradient of 1100°C/cm is presented. After 286 hours, the hot end showed a thin and flat intermetallic compound (IMC) while the cold side showed a scallop-like Cu6Sn5 IMC. Small voids can be seen within the Cu6Sn5 IMC after 712 hours on the cold side, while the IMC on the opposite side showed no observable changes.

Measurement of impact toughness of eutectic SnPb and SnAgCu solder joints in ball grid array by mini-impact tester

2008 ◽  
Vol 23 (5) ◽  
pp. 1482-1487 ◽  
Author(s):  
Yuhuan Xu ◽  
Shengquan Ou ◽  
K.N. Tu ◽  
Kejun Zeng ◽  
Rajiv Dunne
Keyword(s):  
Impact Toughness ◽  
High Speed ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Snagcu Solder ◽  
Snpb Solder ◽  
Impact Tester ◽  
Pull Tests ◽  
The Impact ◽  
Eutectic Snpb

The most frequent cause of failure for wireless, handheld, and portable consumer electronic products is an accidental drop to the ground. The impact may cause interfacial fracture of ball-grid-array solder joints. Existing metrology, such as ball shear and ball pull tests, cannot characterize the impact-induced high speed fracture failure. In this study, a mini-impact tester was utilized to measure the impact toughness and to characterize the impact reliability of both eutectic SnPb and SnAgCu solder joints. The annealing effect at 150 °C on the impact toughness was investigated, and the fractured surfaces were examined. The impact toughness of SnAgCu solder joints with the plating of electroless Ni/immersion Au (ENIG) became worse after annealing, decreasing from 10 or 11 mJ to 7 mJ. On the other hand, an improvement of the impact toughness of eutectic SnPb solder joints with ENIG was recorded after annealing, increasing from 6 or 10 to 15 mJ. Annealing has softened the bulk SnPb solder so that more plastic deformation can occur to absorb the impact energy.

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