Explicit submodeling and digital image correlation based life-prediction of leadfree electronics under shock-impact

2009 ◽  
Author(s):  
Pradeep Lall ◽  
Sandeep Shantaram ◽  
Arjun Angral ◽  
Mandar Kulkarni
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Life Prediction ◽  
Image Correlation ◽  
Shock Impact

Damage Accumulation and Life-Prediction Models for SnAgCu Leadfree Electronics Under Shock-Impact

2009 ◽  
Author(s):  
Pradeep Lall ◽  
Sandeep Shantaram ◽  
Arjun Angral ◽  
Mandar Kulkarni ◽  
Jeff Suhling
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Thermal Aging ◽  
Cohesive Zone ◽  
Life Prediction ◽  
Failure Modes ◽  
Damage Index ◽  
Image Correlation ◽  
Shock Impact ◽  
Cohesive Zone Elements

Relative damage-index based on the leadfree interconnect transient strain history from digital image correlation, explicit finite-elements, cohesive-zone elements, and component’s survivability envelope has been developed for life-prediction of two-leadfree electronic alloy systems. Life prediction of pristine and thermally-aged assemblies, have been investigated. Solder alloy system studied include Sn1Ag0.5Cu, and 96.5Sn3.5Ag. Transient strains during the shock-impact have been measured using digital image correlation in conjunction with high-speed cameras operating at 50,000 fps. Both the board strains and the package strains have been measured in a variety of drop orientations including JEDEC horizontal drop orientation, vertical drop orientation and intermediate drop orientations. In addition the effect of sequential stresses of thermal aging and shock-impact on the failure mechanisms has also been studied. The thermal aging condition used for the study includes 125°C for 100 hrs. The presented methodology addresses the need for life prediction of new lead-free alloy-systems under shock and vibration, which is largely beyond the state of art. Three failure modes have been predicted including interfacial failure at the copper-solder interface, solder-PCB interface, and the solder joint failure. Explicit non-linear finite element models with cohesive-zone elements have been developed and correlated with experimental results. Velocity data from digital image correlation has been used to drive the attachment degrees of freedom of the submodel and extract transient interconnect strain histories. Explicit finite-element sub-modeling has been correlated with the full-field strain in various locations, orientations, on both the package and the board-side. The survivability of the leadfree interconnections under sequential loading (thermal aging and shock-impact) from simulation has been compared with pristine circuit assemblies subjected to shock-impact. Sequential loading changes the failure modes and decreases the drop reliability as compared to the room temperature experimental results. Damage index based survivability envelope is intended for component integration to ensure reliability in harsh environments.

Creep-fatigue life prediction of perforated copper-alloy plate by using Digital Image Correlation Method

2018 ◽  
Vol 2018 (0) ◽  
pp. J0320104
Author(s):  
Tatsuya KAMEYAMA ◽  
Takumi TOKIYOSHI ◽  
Chikako KATOU ◽  
Toshihide IGARI ◽  
Hiroyuki KOBAYASHI ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Digital Image Correlation ◽  
Digital Image ◽  
Copper Alloy ◽  
Life Prediction ◽  
Correlation Method ◽  
Fatigue Life Prediction ◽  
Image Correlation ◽  
Alloy Plate ◽  
Creep Fatigue

Measurement of Hysteresis Energy Using Digital Image Correlation With Application to Energy-Based Fatigue Life Prediction

2019 ◽  
Vol 141 (9) ◽  
Author(s):  
Dino Celli ◽  
M.-H. Herman Shen ◽  
Casey Holycross ◽  
Onome Scott-Emuakpor ◽  
Tommy George
Keyword(s):  
Fatigue Life ◽  
Energy Dissipation ◽  
Digital Image Correlation ◽  
Digital Image ◽  
Strain Energy ◽  
Life Prediction ◽  
Cyclic Strain ◽  
Fatigue Life Prediction ◽  
Image Correlation ◽  
Prediction Methods

A modified experimental method using digital image correlation (DIC), a noncontact optical method for measuring full-field displacements and strains, is used to interrogate accumulated fatigue damage for low and high cycle fatigue at continuum scales. Previous energy-based fatigue life prediction methods have shown that cyclic strain energy dissipated during fatigue acts as a key damage parameter for accurate determination of total and remaining fatigue life. DIC enables the collection of accurate strain energy measurements or damaging energy of complex geometries that would otherwise be exceedingly difficult and time consuming using traditional strain measurement techniques. Thus, the use of DIC to obtain strain energy measurements of gas turbine engine (GTE) components is highly advantageous for energy-based fatigue life prediction methods. Presented in this study is the experimental characterization of the cyclic strain energy dissipation as a means of predicting fatigue performance and assessment of damage progression of Aluminum 6061 subjected to fully reversed axial fatigue loading utilizing DIC. Validation of total and cyclic strain energy dissipation DIC measurements is accomplished with the simultaneous use of axial extensometery for direct comparison and implementation to strain energy-based life prediction methods.

Measurement of Hysteresis Energy Using Digital Image Correlation With Application to Energy Based Fatigue Life Prediction

2018 ◽  
Author(s):  
Dino Celli ◽  
M.-H. Herman Shen ◽  
Casey Holycross ◽  
Onome Scott-Emuakpor ◽  
Tommy George
Keyword(s):  
Fatigue Life ◽  
Energy Dissipation ◽  
Digital Image Correlation ◽  
Digital Image ◽  
Strain Energy ◽  
Life Prediction ◽  
Cyclic Strain ◽  
Fatigue Life Prediction ◽  
Image Correlation ◽  
Prediction Methods

A modified experimental method using digital image correlation (DIC), a non-contact optical method for measuring full-field displacements and strains, is used to interrogate accumulated fatigue damage for low and high cycle fatigue (LCF/HCF) at continuum scales. Previous energy based fatigue life prediction methods have shown that cyclic strain energy dissipated during fatigue acts as a key damage parameter for accurate determination of total and remaining fatigue life. DIC enables the collection of accurate strain energy measurements or damaging energy of complex geometries that would otherwise be exceedingly difficult and time consuming using traditional strain measurement techniques. Thus, the use of DIC to obtain strain energy measurements of gas turbine engine components is highly advantageous for energy-based fatigue life prediction methods. Presented in this study is the experimental characterization of the cyclic strain energy dissipation as a means of predicting fatigue performance and assessment of damage progression of Aluminum 6061 subjected to fully reversed axial fatigue loading utilizing DIC. Validation of total and cyclic strain energy dissipation DIC measurements are accomplished with the simultaneous use of axial extensometery for direct comparison and implementation to strain energy based life prediction methods.

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