Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps

2009 ◽  
Author(s):  
Aibin Yu ◽  
John H. Lau ◽  
Soon Wee Ho ◽  
Aditya Kumar ◽  
Hnin Wai Yin ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Three Dimensional ◽  
Fine Pitch

Quality and Reliability of 3D TSV Interposer and Fine Pitch Solder Micro-bumps for 28nm Technology

2011 ◽  
Vol 2011 (1) ◽  
pp. 000189-000192 ◽  
Author(s):  
Bahareh Banijamali ◽  
Raghunandan Chaware ◽  
Suresh Ramalingam ◽  
Myongseob Kim
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
High Reliability ◽  
Three Dimensional ◽  
Electrical Performance ◽  
Related Factors ◽  
Fine Pitch ◽  
Cte Mismatch ◽  
Quality And Reliability

Silicon interposer minimizes CTE mismatch between the chip and copper filled TSV interposer resulting in high reliability micro bumps. Furthermore, providing high wiring density interconnections and improved electrical performance are the reasons TSV interposer has emerged as a good solution and getting significant industry attention. High density three dimensional (3D) interconnects formed by high aspect ratio through silicon via (TSV) and fine pitch solder micro bumps are presented in this paper. Different design/material related factors are evaluated during this study in order to yield high aspect ratio void-free TSV copper via and reliable micro-bumps. Quality and reliability of copper TSV and micro-bumps are monitored in-situ during the process. This paper presents some of the quality and reliability results as well as micro-bump and TSV resistance data. Furthermore, bake and thermal-cycling measurements are presented to insure reliability of the design and the material selected for the 28nm technology TSV interposer FPGA.

Accelerating ion diffusion with unique three-dimensionally interconnected nanopores for self-membrane high-performance pseudocapacitors

Nanoscale ◽  
2017 ◽  
Vol 9 (46) ◽  
pp. 18311-18317 ◽  
Author(s):  
Yuan Gao ◽  
Yuanjing Lin ◽  
Zehua Peng ◽  
Qingfeng Zhou ◽  
Zhiyong Fan
Keyword(s):  
Aspect Ratio ◽  
Surface Area ◽  
Structural Stability ◽  
High Aspect Ratio ◽  
High Performance ◽  
Three Dimensional ◽  
Rate Capability ◽  
Large Surface Area ◽  
Nanoporous Structure ◽  
Ion Diffusion

Three-dimensional interconnected nanoporous structure (3-D INPOS) possesses high aspect ratio, large surface area, as well as good structural stability. Profiting from its unique interconnected architecture, the 3-D INPOS pseudocapacitor achieves a largely enhanced capacitance and rate capability.

scholarly journals Self-ordered nanospike porous alumina fabricated under a new regime by an anodizing process in alkaline media

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Mana Iwai ◽  
Tatsuya Kikuchi ◽  
Ryosuke O. Suzuki
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Porous Alumina ◽  
Three Dimensional ◽  
Alkaline Media ◽  
Alkaline Electrolyte ◽  
Subsequent Formation ◽  
Interpore Distance ◽  
Wide Range ◽  
Ordered Porous

AbstractHigh-aspect ratio ordered nanomaterial arrays exhibit several unique physicochemical and optical properties. Porous anodic aluminum oxide (AAO) is one of the most typical ordered porous structures and can be easily fabricated by applying an electrochemical anodizing process to Al. However, the dimensional and structural controllability of conventional porous AAOs is limited to a narrow range because there are only a few electrolytes that work in this process. Here, we provide a novel anodizing method using an alkaline electrolyte, sodium tetraborate (Na2B4O7), for the fabrication of a high-aspect ratio, self-ordered nanospike porous AAO structure. This self-ordered porous AAO structure possesses a wide range of the interpore distance under a new anodizing regime, and highly ordered porous AAO structures can be fabricated using pre-nanotexturing of Al. The vertical pore walls of porous AAOs have unique nanospikes measuring several tens of nanometers in periodicity, and we demonstrate that AAO can be used as a template for the fabrication of nanomaterials with a large surface area. We also reveal that stable anodizing without the occurrence of oxide burning and the subsequent formation of uniform self-ordered AAO structures can be achieved on complicated three-dimensional substrates.

scholarly journals High-Aspect-Ratio Copper Via Filling Used for Three-Dimensional Chip Stacking

2003 ◽  
Vol 150 (6) ◽  
pp. G355 ◽  
Author(s):  
Jian-Jun Sun ◽  
Kazuo Kondo ◽  
Takuji Okamura ◽  
SeungJin Oh ◽  
Manabu Tomisaka ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Three Dimensional

scholarly journals Strong and Reversible Adhesion of Interlocked 3D-Microarchitectures

Coatings ◽  
2019 ◽  
Vol 9 (1) ◽  
pp. 48 ◽  
Author(s):  
Minho Seong ◽  
Hyun-Ha Park ◽  
Insol Hwang ◽  
Hoon Eui Jeong
Keyword(s):  
Aspect Ratio ◽  
Structural Stability ◽  
High Aspect Ratio ◽  
Three Dimensional ◽  
Normal Direction ◽  
One Dimensional ◽  
Reversible Adhesion ◽  
Adhesion Behavior ◽  
Organic Nanomaterials ◽  
Good Agreement

Diverse physical interlocking devices have recently been developed based on one-dimensional (1D), high-aspect-ratio inorganic and organic nanomaterials. Although these 1D nanomaterial-based interlocking devices can provide reliable and repeatable shear adhesion, their adhesion in the normal direction is typically very weak. In addition, the high-aspect-ratio, slender structures are mechanically less durable. In this study, we demonstrate a highly flexible and robust interlocking system that exhibits strong and reversible adhesion based on physical interlocking between three-dimensional (3D) microscale architectures. The 3D microstructures have protruding tips on their cylindrical stems, which enable tight mechanical binding between the microstructures. Based on the unique 3D architectures, the interlocking adhesives exhibit remarkable adhesion strengths in both the normal and shear directions. In addition, their adhesion is highly reversible due to the robust mechanical and structural stability of the microstructures. An analytical model is proposed to explain the measured adhesion behavior, which is in good agreement with the experimental results.

scholarly journals Ultra-high-aspect-orthogonal and tunable three dimensional polymeric nanochannel stack array for BioMEMS applications

Nanoscale ◽  
2014 ◽  
Vol 6 (16) ◽  
pp. 9681-9688 ◽  
Author(s):  
Joonseong Heo ◽  
Hyukjin J. Kwon ◽  
Hyungkook Jeon ◽  
Bumjoo Kim ◽  
Sung Jae Kim ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Three Dimensional ◽  
Rolling Method ◽  
Nanochannel Array

A tunable polymeric nanochannel array with ultra-high-aspect-ratio of 106was fabricated using stacking and rolling method.

scholarly journals Complex three-dimensional high aspect ratio microfluidic network manufactured in combined PerMX dry-resist and SU-8 technology

2011 ◽  
Vol 5 (3) ◽  
pp. 034111 ◽  
Author(s):  
Robert Ch. Meier ◽  
Vlad Badilita ◽  
Jens Brunne ◽  
Ulrike Wallrabe ◽  
Jan G. Korvink
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Three Dimensional ◽  
Microfluidic Network
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