In this paper, a multi-layer LCP substrate fabrication process was described and millimeter wave transmission lines and filters were designed and fabricated on the LCP substrate. Various transitions from a CPW to a microstrip line with their characteristic impedance being 50 ohms were investigated. The characteristics of the wirebonding assembly for connecting two transmission lines was also examined. The measurement results show that an insertion loss of 1.3 dB at 60 GHz can be achieved for the two-wire bonding trasmisssion line including two transitions from a CPW to a microstrip line.
ON-CHIP TECHNOLOGY INDEPENDENT 3-D MODELS FOR MILLIMETER-WAVE TRANSMISSION LINES WITH BEND AND GAP DISCONTINUITY