Thermo-Mechanical Analysis of Thru-Silicon-Via Based High Density Compliant Interconnect
2010 ◽
Vol 4
(8)
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pp. 465-473
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Keyword(s):
2020 ◽
pp. 089270572093915
2017 ◽
Vol 52
(7)
◽
pp. 867-876
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2010 ◽
Vol 43
(1)
◽
pp. 33-48
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Keyword(s):