3-D simulation on current density distribution in flip-chip solder joints with thick Cu UBM under current stressing

2005 ◽  
Author(s):  
S.W. Liang ◽  
T.L. Shao ◽  
Chih Chen
Keyword(s):  
Density Distribution ◽  
Current Density ◽  
Flip Chip ◽  
Solder Joints ◽  
Current Density Distribution ◽  
Current Stressing

Electromigration Reliability With Respect to Cu Weight Contents of Sn–Ag–Cu Flip-Chip Solder Joints Under Comparatively Low Current Stressing

2008 ◽  
Vol 130 (4) ◽  
Author(s):  
Yi-Shao Lai ◽  
Ying-Ta Chiu
Keyword(s):  
Intermetallic Compound ◽  
Ambient Temperature ◽  
Current Density ◽  
Flip Chip ◽  
Solder Joints ◽  
Average Current Density ◽  
Current Stressing ◽  
Weight Content ◽  
Average Current ◽  
Better Than

This work presents electromigration reliability and patterns of Sn–3Ag–0.5Cu and Sn–3Ag–1.5Cu∕Sn–3Ag–0.5Cu composite flip-chip solder joints with Ti∕Ni(V)∕Cu under bump metallurgy (UBM), bonded on Au∕Ni∕Cu substrate pads. The solder joints were subjected to an average current density of 5kA∕cm2 under an ambient temperature of 150°C. Under the situation when electron charges flow from the UBM toward the substrate, Sn diffuses from the Cu–Ni–Sn intermetallic compound developed around the UBM toward the UBM and eventually causes the Ni(V) layer to deform. Electromigration reliability of Sn–3Ag–1.5Cu∕Sn–3Ag–0.5Cu composite flip-chip solder joints was found to be better than that of Sn–3Ag–0.5Cu solder joints. According to the morphological observations on cross-sectioned solder joints, a failure mechanism is proposed as follows. Since the deformation of the Ni(V) layer as a result of Sn diffusion toward the UBM is considered as the dominant failure, a greater Cu weight content in the solder joints would trap more Sn in the Sn–Cu interfacial reaction and would therefore retard the diffusion of Sn toward the UBM and hence enhance the electromigration reliability.

Energy Balance on Current Density Distribution of Cathode Spot in Vacuum Arc

2019 ◽  
Vol 139 (5) ◽  
pp. 302-308 ◽  
Author(s):  
Shinji Yamamoto ◽  
Soshi Iwata ◽  
Toru Iwao ◽  
Yoshiyasu Ehara
Keyword(s):  
Energy Balance ◽  
Density Distribution ◽  
Current Density ◽  
Cathode Spot ◽  
Current Density Distribution ◽  
Vacuum Arc

Automated Measurement of the Spatial Current Density Distribution of Process Electron Beams

Vestnik MEI ◽  
2018 ◽  
Vol 2 (2) ◽  
pp. 72-79
Author(s):  
Aleksey S. Kozhechenko ◽  
◽  
Aleksey V. Shcherbakov ◽  
Regina V. Rodyakina ◽  
Daria A. Gaponova ◽  
...  
Keyword(s):  
Density Distribution ◽  
Current Density ◽  
Electron Beams ◽  
Current Density Distribution ◽  
Automated Measurement ◽  
Spatial Current
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