Development of 50mm Flipchip Plastic Ball Grid Array Package with LowiK Silicon Technology

Proceedings Electronic Components and Technology, 2005. ECTC '05. ◽

10.1109/ectc.2005.1441238 ◽

2005 ◽

Author(s):

Z. Kutlu ◽

S. Rajagopalan ◽

Chaowen Chung

Keyword(s):

Ball Grid Array ◽

Silicon Technology ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Package

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A study of compact thermal model topologies in CFD for a flip chip plastic ball grid array package

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/6144.926382 ◽

2001 ◽

Vol 24 (2) ◽

pp. 191-198 ◽

Cited By ~ 20

Author(s):

S. Shidore ◽

V. Adams ◽

T.T. Lee

Keyword(s):

Thermal Model ◽

Flip Chip ◽

Ball Grid Array ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Package

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Thermal evaluation of a cost-effective plastic ball grid array package-NuBGA

1997 Proceedings 47th Electronic Components and Technology Conference ◽

10.1109/ectc.1997.606186 ◽

2002 ◽

Cited By ~ 1

Author(s):

F. Wu ◽

J. Lau ◽

K.-L. Chen

Keyword(s):

Cost Effective ◽

Ball Grid Array ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Package

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Thermal performance of a low‐cost thermal enhanced plastic ball grid array package ‐ NuBGA

Microelectronics International ◽

10.1108/13565369810215609 ◽

1998 ◽

Vol 15 (2) ◽

pp. 25-33 ◽

Cited By ~ 4

Author(s):

John H. Lau ◽

K.L. Chen ◽

F. Wu

Keyword(s):

Thermal Performance ◽

Low Cost ◽

Ball Grid Array ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Package

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Technical evaluation of a near chip scale size flip chip/plastic ball grid array package

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) ◽

10.1109/ectc.1998.678739 ◽

2002 ◽

Cited By ~ 4

Author(s):

M. Jimarez ◽

Li Li ◽

C. Tytran ◽

C. Loveland ◽

J. Obrzut

Keyword(s):

Flip Chip ◽

Ball Grid Array ◽

Scale Size ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Package ◽

Technical Evaluation

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Effects of solder joint structure and shape on thermal reliability of plastic ball grid array package

The International Journal of Advanced Manufacturing Technology ◽

10.1007/s00170-004-2260-y ◽

2005 ◽

Vol 27 (7-8) ◽

pp. 677-687 ◽

Cited By ~ 10

Author(s):

R.S. Chen ◽

S.C. Tseng ◽

C.S. Wan

Keyword(s):

Solder Joint ◽

Ball Grid Array ◽

Thermal Reliability ◽

Joint Structure ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Package

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Scanning electron microscopy study of the cross section of intermetallic compound in the solder ball on the plastic ball grid array package following reliability tests

Journal of Electronic Materials ◽

10.1007/s11664-005-0090-9 ◽

2005 ◽

Vol 34 (7) ◽

pp. 1026-1029

Author(s):

Yeh-Fang Duann ◽

Jen-Hung Chiang ◽

Shung-Jim Yang ◽

Hsun-Wen Chang

Keyword(s):

Electron Microscopy ◽

Cross Section ◽

Solder Ball ◽

Ball Grid Array ◽

Microscopy Study ◽

Electron Microscopy Study ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Package ◽

Scanning Electron

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Development of real time/variable sensitivity warpage measurement technique and its application to plastic ball grid array package

IEEE Transactions on Electronics Packaging Manufacturing ◽

10.1109/6104.755090 ◽

1999 ◽

Vol 22 (1) ◽

pp. 63-70 ◽

Cited By ~ 33

Author(s):

K. Verma ◽

D. Columbus ◽

B. Han

Keyword(s):

Real Time ◽

Measurement Technique ◽

Ball Grid Array ◽

Time Variable ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Package ◽

Variable Sensitivity

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Development of improved thermal performance embedded heat slug plastic ball grid array package

53rd Electronic Components and Technology Conference, 2003. Proceedings. ◽

10.1109/ectc.2003.1216493 ◽

2004 ◽

Cited By ~ 6

Author(s):

B.A. Zahn ◽

F. Carson ◽

T.K. Lee ◽

R. Coronado ◽

D. Mitchell

Keyword(s):

Thermal Performance ◽

Ball Grid Array ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Package

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Prediction of effect of heat sink adhesive on mechanical reliability of a wire bonded plastic ball grid array package

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) ◽

10.1109/itherm.2002.1012555 ◽

2003 ◽

Cited By ~ 4

Author(s):

A. Kaisare ◽

Zhenxue Han ◽

D. Agonager ◽

K. Ramakrishna

Keyword(s):

Heat Sink ◽

Ball Grid Array ◽

Mechanical Reliability ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Package

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Plasma cleaning of plastic ball grid array package

Microelectronics Reliability ◽

10.1016/s0026-2714(98)00184-x ◽

1999 ◽

Vol 39 (1) ◽

pp. 97-105 ◽

Cited By ~ 33

Author(s):

C Lee ◽

R Gopalakrishnan ◽

K Nyunt ◽

A Wong ◽

R.C.-E Tan ◽

...

Keyword(s):

Ball Grid Array ◽

Plasma Cleaning ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Package

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