Thermosonic wire bonding process simulation and bond pad over active stress analysis

2004 ◽  
Author(s):  
Yong Liu ◽  
S. Irving ◽  
T. Luk
Keyword(s):  
Stress Analysis ◽  
Process Simulation ◽  
Wire Bonding ◽  
Bonding Process ◽  
Active Stress ◽  
Thermosonic Wire Bonding

Silver pick up during tail formation in thermosonic wire bonding process

2011 ◽  
Vol 51 (1) ◽  
pp. 38-42 ◽  
Author(s):  
J. Lee ◽  
M. Mayer ◽  
Y. Zhou ◽  
S.J. Hong ◽  
J.T. Moon
Keyword(s):  
Wire Bonding ◽  
Bonding Process ◽  
Thermosonic Wire Bonding

Failure Analysis on Power Trench MOSFET Devices with Copper Wire Bonds

2011 ◽  
Author(s):  
Huixian Wu ◽  
Arthur Chiang ◽  
David Le ◽  
Win Pratchayakun
Keyword(s):  
Failure Analysis ◽  
Copper Wire ◽  
New Technology ◽  
Analytical Techniques ◽  
Wire Bonding ◽  
Bonding Process ◽  
Wire Bonds ◽  
Copper Wire Bonding ◽  
Wet Chemical ◽  
Microelectronic Components

Abstract With gold prices steadily going up in recent years, copper wire has gained popularity as a means to reduce cost of manufacturing microelectronic components. Performance tradeoff aside, there is an urgent need to thoroughly study the new technology to allay any fear of reliability compromise. Evaluation and optimization of copper wire bonding process is critical. In this paper, novel failure analysis and analytical techniques are applied to the evaluation of copper wire bonding process. Several FA/analytical techniques and FA procedures will be discussed in detail, including novel laser/chemical/plasma decapsulation, FIB, wet chemical etching, reactive ion etching (RIE), cross-section, CSAM, SEM, EDS, and a combination of these techniques. Two case studies will be given to demonstrate the use of these techniques in copper wire bonded devices.

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