Advanced moisture diffusion modeling and characterisation for electronic packaging

2003 ◽  
Author(s):  
E.H. Wong ◽  
S.W. Koh ◽  
K.H. Lee ◽  
R. Rajoo
Keyword(s):  
Electronic Packaging ◽  
Moisture Diffusion ◽  
Diffusion Modeling

scholarly journals A Novel Moisture Diffusion Modeling Approach Using Finite Element Analysis

Electronics ◽  
2018 ◽  
Vol 7 (12) ◽  
pp. 438 ◽  
Author(s):  
Cagan Diyaroglu ◽  
Erdogan Madenci ◽  
Selda Oterkus ◽  
Erkan Oterkus
Keyword(s):  
Finite Element ◽  
Surface Effect ◽  
Moisture Diffusion ◽  
Current Approach ◽  
Numerical Results ◽  
Solution Technique ◽  
Material System ◽  
Diffusion Modeling ◽  
Element Analysis ◽  
Moisture Concentration

In this study, a novel wetness and moisture concentration analysis approach is presented. A finite element method is utilized for the solution technique mainly using thermal and surface effect elements. Numerical results obtained from the current approach are compared against other existing finite element-based solutions and the newly introduced peridynamics theory. For numerical analysis, a reflow soldering stage is simulated for a multi-material system with time-dependent saturated moisture concentrations. Different solubility activation energies and temperature conditions are considered. Numerical results demonstrate that the developed methodology can make accurate predictions under different conditions and it is more general than some other existing models which are limited to certain conditions.

MOISTURE DIFFUSION MODELING OF WHEAT KERNELS DURING SOAKING

1999 ◽  
Vol 42 (5) ◽  
pp. 1359-1366 ◽  
Author(s):  
S. Kang ◽  
S. R. Delwiche
Keyword(s):  
Moisture Diffusion ◽  
Diffusion Modeling ◽  
Wheat Kernels

On Moisture Diffusion Modeling Using Thermal-Moisture Analogy

2007 ◽  
Vol 129 (4) ◽  
pp. 421-426 ◽  
Author(s):  
Samson Yoon ◽  
Bongtae Han ◽  
Zhaoyang Wang
Keyword(s):  
Thermal Loading ◽  
Moisture Diffusion ◽  
Loading Conditions ◽  
Diffusion Modeling ◽  
Governing Equations ◽  
Practical Applications ◽  
Diffusion Analysis ◽  
Material Systems ◽  
Single Material

Thermal-moisture analogy schemes for a moisture diffusion analysis are reviewed. Two schemes for practical applications are described using the governing equations of heat and mass diffusions: (1) direct analogy and (2) normalized analogy. The schemes are implemented to define valid domains of application. The results corroborate that the direct analogy is valid only for single-material systems, but the normalized analogy can be extended to multimaterial systems if thermal loading conditions are isothermal, spatially as well as temporally.

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