Failure mechanism of brittle solder joint fracture in the presence of electroless nickel immersion gold (ENIG) interface

2002 ◽  
Author(s):  
D. Goyal ◽  
T. Lane ◽  
P. Kinzie ◽  
C. Panichas ◽  
Kam Meng Chong ◽  
...  
Keyword(s):  
Solder Joint ◽  
Failure Mechanism ◽  
Electroless Nickel ◽  
Electroless Nickel Immersion Gold ◽  
Joint Fracture

Effects of Temperature–Humidity Treatment on Bending Reliability of Epoxy Sn–58Bi Solder with Electroless Nickel Immersion Gold (ENIG) and Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Finishes

2020 ◽  
Vol 12 (4) ◽  
pp. 564-570
Author(s):  
Haksan Jeong ◽  
Choong-Jae Lee ◽  
Woo-Ram Myung ◽  
Kyung Deuk Min ◽  
Seung-Boo Jung
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Solder Joints ◽  
Solder Matrix ◽  
Electroless Nickel ◽  
Bending Test ◽  
Three Point Bending ◽  
Electroless Nickel Immersion Gold ◽  
Surface Finishes ◽  
Effects Of Temperature

An epoxy Sn–58wt.%Bi solder joint was evaluated by a three-point bending test with electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG) surface finishes aged at 85 °C and 85% relative humidity. Scanning electron microscopy and electron probe microanalysis were carried out to study intermetallic compound variation. The morphology, total thickness, and chemical composition of intermetallic compound in epoxy Sn58Bi solder joints were the same as those of Sn–58wt.%Bi solder joints with each surface finish. The average number of bending-to-failure cycles for the epoxy Sn–58wt.%Bi solder/ENIG joints and epoxy Sn–58wt.%Bi solder/ENEPIG was more than 4000 and 5000, respectively. The average number of bending-to-failure cycles of the epoxy Sn–58wt.%Bi solder joint decreased with increasing age. Three-point bending reliability of epoxy Sn–58wt.%Bi solder joints was higher than that of Sn–58wt.%Bi solder with both surface finishes. Cracking of all solder joints subjected to as-reflowed was propagated through the solder matrix. However, after aging for 1000 h, cracking occurred primarily between intermetallic compound layers.

Quantitative Bump Height Analysis in ENIG Using Design of Experiment

2014 ◽  
Vol 896 ◽  
pp. 660-663
Author(s):  
Zaliman Sauli ◽  
Vithyacharan Retnasamy ◽  
Phaklen Ehkan ◽  
Fairul Afzal Ahmad Fuad ◽  
Aaron Koay Terr Yeow
Keyword(s):  
Design Of Experiment ◽  
Flip Chip ◽  
Electroless Nickel ◽  
Bump Height ◽  
Process Robustness ◽  
Electroless Nickel Immersion Gold ◽  
Optimization Of Process Parameters ◽  
Chip Technology ◽  
Higher Temperature

Flip chip technology has grown by leaps and bounds and is getting even smaller in size. Optimization of process parameters in manufacturing is eminent due to reliability issues. This paper reports the parameters that affect the quality of the bump height in electroless nickel immersion gold (ENIG) and their relationships between each other. A total of four different combinations of parameters have been carried out for this investigation using the design of experiment (DOE) approach. It can be concluded that higher temperature of electroless nickel permits an increase of bump height where as the increment in immersion gold temperature does not nessasarily affect the value of bump height. All four samples recorded a higher value of bump height than the controlled bump height value. This implies reliability of the solder joint and assembly process robustness can be improved with an increase of bump height by increasing the time.

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