Flip chip with lead-free solders on halogen-free microvia substrates

2002 ◽  
Author(s):  
G. Baynham ◽  
D.F. Baldwin ◽  
K. Boustedt ◽  
C. Wennerholm
Keyword(s):  
Flip Chip ◽  
Lead Free ◽  
Halogen Free ◽  
Lead Free Solders

Printed Circuit Board Pad Crater Test Methods and Sample Design

2012 ◽  
Author(s):  
Todd Embree ◽  
Deassy Novita ◽  
Gary Long ◽  
Satish Parupalli
Keyword(s):  
Test Data ◽  
Printed Circuit Board ◽  
Test Methods ◽  
Circuit Board ◽  
Lead Free ◽  
Sample Design ◽  
Printed Circuit ◽  
Highly Sensitive ◽  
Halogen Free ◽  
Lead Free Solders

The continual drive toward smaller second level interconnect dimensions, along with the introduction of Halogen-Free circuit board materials and increased process temperatures of Lead-Free solders, have all contributed to a more frequent occurrence of Pad Crater damage in circuit board materials during manufacturing and test processes. This paper addresses the methodology and test data of some common industry methods used to evaluate Pad Crater strength in circuit board materials. Pad Crater test data is highly sensitive to sample design; as a result a discussion of sample design criteria is also included.

scholarly journals Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders

2001 ◽  
Vol 42 (5) ◽  
pp. 790-793 ◽  
Author(s):  
Ikuo Shohji ◽  
Fuminari Mori ◽  
Kojiro F. Kobayashi
Keyword(s):  
Thermal Fatigue ◽  
Flip Chip ◽  
Fatigue Behavior ◽  
Lead Free ◽  
Thermal Fatigue Behavior ◽  
Lead Free Solders

Advances in Soldering Technology

2004 ◽  
pp. 189-242
Keyword(s):  
Rare Earth ◽  
Flip Chip ◽  
Acoustic Microscopy ◽  
Lead Free ◽  
Scanning Acoustic Microscopy ◽  
Calibration Standards ◽  
Evaluation Procedures ◽  
Fine Focus ◽  
Soldering Technology ◽  
Lead Free Solders

Abstract This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders. This is followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray techniques are also included. The chapter then describes several evaluation procedures and tests developed to measure solderability. Reference is also made to the production of calibration standards of solderability. The chapter also describes the characteristics of reinforced solders and amalgams as solders and the strategies to boost the strength of solders. Further, the chapter considers methods for quantifying the mechanical integrity of joints and predicting their dimensional stability under specified environmental conditions. It discusses the effects of rare earth elements on the properties of solders. The chapter concludes with information on advanced joint characterization techniques.

Evaluation of Cu-bumps with lead-free solders for flip-chip package applications

2009 ◽  
Vol 86 (12) ◽  
pp. 2392-2395 ◽  
Author(s):  
Kung-Liang Lin ◽  
Edward-Yi Chang ◽  
Lin-Chi Shih
Keyword(s):  
Flip Chip ◽  
Lead Free ◽  
Lead Free Solders

Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology

1998 ◽  
Vol 21 (1) ◽  
pp. 41-50 ◽  
Author(s):  
J. Kloeser ◽  
K. Heinricht ◽  
K. Kutzner ◽  
E. Jung ◽  
A. Ostmann ◽  
...  
Keyword(s):  
Flip Chip ◽  
Lead Free ◽  
Stencil Printing ◽  
Chip Technology ◽  
Fine Pitch ◽  
Lead Free Solders
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