Moisture-induced interfacial delamination growth in plastic IC packages during solder reflow

2002 ◽  
Author(s):  
A.A.O. Tay ◽  
T.Y. Lin
Keyword(s):  
Delamination Growth ◽  
Interfacial Delamination ◽  
Solder Reflow

An Interfacial Delamination Analysis for Multichip Module Thin Film Interconnects

1996 ◽  
Vol 118 (4) ◽  
pp. 206-213 ◽  
Author(s):  
K. X. Hu ◽  
C. P. Yeh ◽  
X. S. Wu ◽  
K. Wyatt
Keyword(s):  
Thin Film ◽  
Phase Angle ◽  
Structural Reliability ◽  
Thermal Loading ◽  
Multichip Module ◽  
Crack Model ◽  
Element Analysis ◽  
Delamination Growth ◽  
Interfacial Delamination ◽  
Functional Behavior

Analysis of interfacial delamination for multichip module thin-film interconnects (MCM/TFI) is the primary objective of this paper. An interface crack model is integrated with finite-element analysis to allow for accurate numerical evaluation of the magnitude and phase angle of the complex stress intensity factor. Under the assumption of quasi-static delamination growth, the fate of an interfacial delamination after inception of propagation is determined. It is established that whether an interfacial delamination will continue to grow or become arrested depends on the functional behavior of the energy release rate and loading phase angle over the history of delamination growth. This functional behavior is numerically obtained for a typical MCM/TFI structure with delamination along die and via base, subjected to thermal loading condition. The effect of delamination interactions on the structural reliability is also investigated. It is observed that the delamination along via wall and polymer thin film can provide a benevolent mechanism to relieve thermal constraints, leading to via stress relaxation.

Die Pad Anchoring Designs for Enhanced Adhesion Integrity in IC Packages

1993 ◽  
Vol 115 (3) ◽  
pp. 225-232 ◽  
Author(s):  
L. T. Nguyen ◽  
M. Michael
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Acoustic Tomography ◽  
Molding Compound ◽  
Interfacial Delamination ◽  
Plastic Packages ◽  
Solder Reflow ◽  
Stress Profiles ◽  
Deformation Patterns ◽  
Fatigue Failures

This paper describes mechanical means for enhancing the adhesion between the epoxy molding compound and the die and die pad in plastic packages. By introducing patterns of holes and slots along the periphery of the die pad, better anchoring between the plastic and the die and die pad is achieved. Interfacial delamination, as determined by scanning acoustic tomography, is minimized. The improved adhesion reduces wire bond fatigue failures and minimizes the risk of moisture accumulation under the die pad that often leads to plastic cracking during solder reflow. Higher packaging reliability can thus be achieved. Finite element modeling of the different design configurations yields stress profiles and deformation patterns which agree qualitatively with the experimental results.

scholarly journals Interfacial delamination and delamination mechanism maps for 3D printed flexible electrical interconnects

2021 ◽  
Vol 43 ◽  
pp. 101199
Author(s):  
Jacob Brenneman ◽  
Derya Z. Tansel ◽  
Gary K. Fedder ◽  
Rahul Panat
Keyword(s):  
Interfacial Delamination ◽  
Electrical Interconnects ◽  
3D Printed

scholarly journals Cohesive Zone Modeling for Predicting Interfacial Delamination in over mold Components

2021 ◽  
Vol 1128 (1) ◽  
pp. 012018
Author(s):  
M Sai Krishnan ◽  
S Jeyanthi ◽  
Pradeep Kumar Mani ◽  
K T Hareesh ◽  
M. C Lenin Babu
Keyword(s):  
Cohesive Zone ◽  
Cohesive Zone Modeling ◽  
Interfacial Delamination ◽  
Zone Modeling

Interfacial Delamination in Plastic Encapsulated Integrated Circuits (Pics)

1996 ◽  
Vol 445 ◽  
Author(s):  
Nickolaos Strifas ◽  
Aris Christou
Keyword(s):  
Integrated Circuits ◽  
Failure Analysis ◽  
Stress Corrosion ◽  
Integrated Circuit ◽  
Point Of View ◽  
Acoustic Microscopy ◽  
Electrical Performance ◽  
Premature Failure ◽  
Interfacial Delamination ◽  
Die Surface

AbstractThe reliability of plastic packaged integrated circuits was assessed from the point of view of interfacial mechanical integrity. It is shown that the effect of structural weaknesses caused by poor bonding, voids, microcracks or delamination may not be evident in the electrical performance characteristics, but may cause premature failure. Acoustic microscopy (C-SAM) was selected for nondestructive failure analysis of the plastic integrated circuit (IC) packages. Integrated circuits in plastic dual in line packages were initially subjected to temperature (25 °C to 85 °C) and humidity cycling (50 to 85 %) where each cycle was of one hour duration and for over 100 cycles and then analyzed. Delamination at the interfaces between the different materials within the package, which is a major cause of moisture ingress and subsequent premature package failure, was measured. The principal areas of delamination were found along the leads extending from the chip to the edge of the molded body and along the die surface itself. Images of the 3-D internal structure were produced that were used to determine the mechanism for a package failure. The evidence of corrosion and stress corrosion cracks in the regions of delamination was identified.

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