Epoxy-based aqueous-processable photodielectric dry film and conductive ViaPlug for PCB build-up and IC packaging

2002 ◽  
Author(s):  
C.G. Gonzalez ◽  
R.A. Wessel ◽  
S.A. Padlewski
Keyword(s):  
Ic Packaging ◽  
Dry Film

Acoustic microscopy techniques for the inspection of integrated circuit devices and packages

1992 ◽  
Vol 50 (2) ◽  
pp. 966-967
Author(s):  
Thomas M. Moore
Keyword(s):  
Integrated Circuit ◽  
Acoustic Microscopy ◽  
Hybrid Technique ◽  
Frequency Scanning ◽  
Ic Packaging ◽  
Ic Package ◽  
Microscopy Techniques ◽  
Ic Package Inspection ◽  
Pulse Echo ◽  
Scanning Acoustic Microscope

In the last decade, a variety of characterization techniques based on acoustic phenomena have come into widespread use. Characteristics of matter waves such as their ability to penetrate optically opaque solids and produce image contrast based on acoustic impedance differences have made these techniques attractive to semiconductor and integrated circuit (IC) packaging researchers.These techniques can be divided into two groups. The first group includes techniques primarily applied to IC package inspection which take advantage of the ability of ultrasound to penetrate deeply and nondestructively through optically opaque solids. C-mode Acoustic Microscopy (C-AM) is a recently developed hybrid technique which combines the narrow-band pulse-echo piezotransducers of conventional C-scan recording with the precision scanning and sophisticated signal analysis capabilities normally associated with the high frequency Scanning Acoustic Microscope (SAM). A single piezotransducer is scanned over the sample and both transmits acoustic pulses into the sample and receives acoustic echo signals from the sample.

Whisker Formation in Copper Electroplating

2011 ◽  
Author(s):  
Theresa Han ◽  
Eunin Cho ◽  
Jinwoo Heo ◽  
Seoung Jae Lee
Keyword(s):  
Copper Sulfate ◽  
Surface Stress ◽  
Whisker Formation ◽  
Printed Wiring Boards ◽  
Copper Electroplating ◽  
Cu Electroplating ◽  
Solution Surface ◽  
Dry Film

Abstract In the manufacture of Printed Wiring Boards (PWB), unwelcome structures, such as nodules and whiskers can be formed during copper electroplating with copper sulfate. Copper (Cu) whiskers with lengths of up to a few hundred micrometers can lead to electrical shorts between layers or patterns. In this paper, we document factors that can affect the growth of Cu whiskers; decomposition of additives in the Cu electroplating solution, surface stress, acidic cleaner, and the ingredients of a dry film. Contaminants from outside of the electroplating bath and the ingredients of the dry film were shown as key components in the formation of Cu whiskers.

scholarly journals Transient Three-Dimensional Flow Field Measurements by Means of 3D µPTV in Drying Poly(Vinyl Acetate)-Methanol Thin Films Subject to Short-Scale Marangoni Instabilities

Polymers ◽  
2021 ◽  
Vol 13 (8) ◽  
pp. 1223
Author(s):  
Max Tönsmann ◽  
Philip Scharfer ◽  
Wilhelm Schabel
Keyword(s):  
Flow Field ◽  
Vinyl Acetate ◽  
Three Dimensional ◽  
Field Measurements ◽  
Initial Assessment ◽  
Ambient Conditions ◽  
Three Dimensional Flow ◽  
Dimensional Flow ◽  
Short Scale ◽  
Dry Film

Convective Marangoni instabilities in drying polymer films may induce surface deformations, which persist in the dry film, deteriorating product performance. While theoretic stability analyses are abundantly available, experimental data are scarce. We report transient three-dimensional flow field measurements in thin poly(vinyl acetate)-methanol films, drying under ambient conditions with several films exhibiting short-scale Marangoni convection cells. An initial assessment of the upper limit of thermal and solutal Marangoni numbers reveals that the solutal effect is likely to be the dominant cause for the observed instabilities.

scholarly journals Ni‐Doped MoS 2 Dry Film Lubricant Life

2020 ◽  
Vol 7 (22) ◽  
pp. 2001109
Author(s):  
Azhar Vellore ◽  
Sergio Romero Garcia ◽  
Nicholas Walters ◽  
Duval A. Johnson ◽  
Andrew Kennett ◽  
...  
Keyword(s):  
Dry Film

Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging

2012 ◽  
Vol 52 (11) ◽  
pp. 2677-2684 ◽  
Author(s):  
Andrej Ivankovic ◽  
Kris Vanstreels ◽  
Daniel Vanderstraeten ◽  
Guy Brizar ◽  
Renaud Gillon ◽  
...  
Keyword(s):  
Elastic Modulus ◽  
Experimental Methods ◽  
Molding Compounds ◽  
Ic Packaging
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