A rapid flip chip die bonding method for semiconductor laser diode arrays

2002 ◽  
Author(s):  
S.A. Merritt ◽  
F. Seiferth ◽  
V. Vusirikala ◽  
M. Dagenais ◽  
Y.J. Chen ◽  
...  
Keyword(s):  
Semiconductor Laser ◽  
Laser Diode ◽  
Flip Chip ◽  
Semiconductor Laser Diode ◽  
Die Bonding ◽  
Laser Diode Arrays ◽  
Bonding Method

scholarly journals Design of Pulse Power Supply for High-Power Semiconductor Laser Diode Arrays

IEEE Access ◽  
2019 ◽  
Vol 7 ◽  
pp. 92805-92812 ◽  
Author(s):  
Qinglin Zhao ◽  
Shu Li ◽  
Ruru Cao ◽  
Deyu Wang ◽  
Jing Yuan
Keyword(s):  
Semiconductor Laser ◽  
Laser Diode ◽  
High Power ◽  
Power Supply ◽  
Pulse Power ◽  
Pulse Power Supply ◽  
Power Semiconductor ◽  
Semiconductor Laser Diode ◽  
Laser Diode Arrays

Power semiconductor laser diode arrays characterization

2003 ◽  
Vol 39 (2) ◽  
pp. 203-217 ◽  
Author(s):  
Luigi Zeni ◽  
Stefania Campopiano ◽  
Antonello Cutolo ◽  
Giuseppe D’Angelo
Keyword(s):  
Semiconductor Laser ◽  
Laser Diode ◽  
Power Semiconductor ◽  
Semiconductor Laser Diode ◽  
Laser Diode Arrays

Measures to Reduce Smile Effect of Semiconductor Laser Diode Arrays Caused by Packaging Thermal Stress

2017 ◽  
Vol 38 (5) ◽  
pp. 655-661
Author(s):  
陈 华 CHEN Hua ◽  
李 静 LI Jing ◽  
周兴林 ZHOU Xing-lin ◽  
吕悦晶 LYU Yue-jing
Keyword(s):  
Thermal Stress ◽  
Semiconductor Laser ◽  
Laser Diode ◽  
Semiconductor Laser Diode ◽  
Laser Diode Arrays
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