A very high heat flux microchannel heat exchanger for cooling of semiconductor laser diode arrays

1996 ◽  
Vol 19 (2) ◽  
pp. 444-451 ◽  
Author(s):  
S.K. Roy ◽  
B.L. Avanic
Keyword(s):  
Heat Flux ◽  
Heat Exchanger ◽  
Semiconductor Laser ◽  
Laser Diode ◽  
High Heat ◽  
High Heat Flux ◽  
Microchannel Heat Exchanger ◽  
Semiconductor Laser Diode ◽  
Laser Diode Arrays ◽  
Very High

Development of an R245fa for Electronics Cooling System for High Heat Flux Applications

2009 ◽  
Author(s):  
Farhad Saffaraval ◽  
Amir Jokar
Keyword(s):  
Heat Flux ◽  
Heat Exchanger ◽  
Cooling System ◽  
Electronics Cooling ◽  
High Heat ◽  
Working Fluid ◽  
High Heat Flux ◽  
Two Phase ◽  
Microchannel Heat Exchanger ◽  
Mass Flow Rates

The objective of this study is to experimentally explore thermodynamic performance of R245fa, as a low-pressure and environmentally-friendly refrigerant, in a microchannel heat exchanger. This heat exchanger is used in an electronics cooling application with high-power density. Due to the large amount of latent heat that is released during evaporation process, the two-phase microchannel coolers are able to remove much more energy compared to single-phase cooling systems. In this study, R245fa is used as the working fluid in a refrigeration pump loop that mainly includes an evaporator, a condenser, a refrigerant pump, and a pressure regulator valve. The goal is to obtain optimal mass flow rates and system pressures while the temperatures in evaporator and condenser are kept constant for specific conditions. The results obtained from this study are then compared to the results previously obtained for water as the working fluid in a similar cooling system. It is expected the evaporative cooling through the microchannel heat exchanger be a viable and effective solution, especially for higher heat flux applications.

High Heat Flux Liquid-Cooled Porous Metal Heat Sink

2003 ◽  
Author(s):  
Mark T. North ◽  
Wei-Lin Cho
Keyword(s):  
Heat Flux ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Laser Diode ◽  
High Power ◽  
Heat Sink ◽  
Porous Metal ◽  
High Heat ◽  
High Heat Flux ◽  
Laser Diode Arrays

An advanced heat sinking technology is described in which heat is dissipated by flowing the liquid coolant through a matrix of well-bonded metallic particles. This porous metal heat sink has the capability to dissipate heat flux of 500W/cm2 or more with a unit area thermal resistance of 0.1°C·cm2/W. The construction of one incarnation of this class of heat sink developed for cooling of a high-power stack of laser diode arrays is described. Tradeoffs between pressure drop and thermal resistance are identified with regard to particle size and other geometric parameters. The patented manifolding geometry allows the cooling area to be scaled up without significantly increasing the overall pressure drop. Experimental data showing thermal resistance and pressure drop at a variety of different water flow rates is also presented. Applications for this technology can include cooling of laser diode arrays and high power electronic components such as CPUs.

Development of Advanced High Heat Flux Cooling System for Power Electronics

2009 ◽  
Author(s):  
Yasuhisa Shinmoto ◽  
Shinichi Miura ◽  
Koichi Suzuki ◽  
Yoshiyuki Abe ◽  
Haruhiko Ohta
Keyword(s):  
Heat Flux ◽  
Power Electronics ◽  
Critical Heat Flux ◽  
Heating Surface ◽  
Narrow Channel ◽  
High Heat ◽  
High Heat Flux ◽  
Gap Size ◽  
Narrow Channels ◽  
Very High

Recent development in electronic devices with increased heat dissipation requires severe cooling conditions and an efficient method for heat removal is needed for the cooling under high heat flux conditions. Most researches are concentrated on small semiconductors with high heat flux density, while almost no existing researches concerning the cooling of a large semiconductor, i.e. power electronics, with high heat generation density from a large cooling area. A narrow channel between parallel plates is one of ideal structures for the application of boiling phenomena which uses the cooling for such large semiconductors. To develop high-performance cooling systems for power electronics, experiments on increase in critical heat flux (CHF) for flow boiling in narrow channels by improved liquid supply was conducted. To realize the cooling of large areas at extremely high heat flux under the conditions for a minimum gap size and a minimum flow rate of liquid supplied, the structure with auxiliary liquid supply was devised to prevent the extension of dry-patches underneath flattened bubbles generated in a narrow channel. The heating surface was experimented in two channels with different dimensions. The heating surfaces have the width of 30mm and the lengths of 50mm and 150mm in the flow direction. A large width of actual power electronics is realizable by the parallel installation of the same channel structure in the transverse direction. The cooling liquid is additionally supplied via sintered metal plates from the auxiliary unheated channels located at sides or behind the main heated channel. To supply the liquid to the entire heating surface, fine grooves are machined on the heating surface for enhance the spontaneous liquid supply by the aid of capillary force. The gap size of narrow channels are varied as 0.7mm, 2mm and 5mm. Distribution of liquid flow rate to the main heated channel and the auxiliary unheated channels were varied to investigate its effect on the critical heat flux. Test liquids employed are R113, FC72 and water. The systematic experiments by using water as a test liquid were conducted. Critical heat flux values larger than 2×106W/m2 were obtained at both gap sizes of 2mm and 5mm for a heated length of 150mm. A very high heat transfer coefficient as much as 1×105W/m2K was obtained at very high heat flux near CHF for the gap size of 2mm. This paper is a summary of experimental results obtained in the past by the present authors.

scholarly journals Design of Pulse Power Supply for High-Power Semiconductor Laser Diode Arrays

IEEE Access ◽  
2019 ◽  
Vol 7 ◽  
pp. 92805-92812 ◽  
Author(s):  
Qinglin Zhao ◽  
Shu Li ◽  
Ruru Cao ◽  
Deyu Wang ◽  
Jing Yuan
Keyword(s):  
Semiconductor Laser ◽  
Laser Diode ◽  
High Power ◽  
Power Supply ◽  
Pulse Power ◽  
Pulse Power Supply ◽  
Power Semiconductor ◽  
Semiconductor Laser Diode ◽  
Laser Diode Arrays

Cavitation-Enhanced Microchannel Heat Exchanger Demonstration and Heat Transfer Correlation Development Using R-134a

2012 ◽  
Author(s):  
Joshua D. Sole ◽  
Bradley J. Shelofsky ◽  
Robert P. Scaringe ◽  
Gregory S. Cole
Keyword(s):  
Heat Transfer ◽  
Heat Exchanger ◽  
High Heat ◽  
High Heat Flux ◽  
Heat Transfer Correlation ◽  
Two Phase ◽  
Microchannel Heat Exchanger ◽  
Military Aviation ◽  
R 134A ◽  
Two Phase Heat Transfer

Electronics of all types, particularly those in the military aviation arena, are decreasing in size while at the same time increasing in power. As a result, newer high-heat-flux electronic components are exceeding the cooling capabilities of conventional single-phase military aviation coldplates and coolants. It is for this reason that we have been investigating new methods to cool the next generation of high-heat-flux military aviation electronics. In this work, a novel method of inducing two-phase conditions within a microchannel heat exchanger has been developed and demonstrated. Micro-orifices placed upstream of each microchannel in a microchannel heat exchanger not only cause an improvement in flow distribution, but can also induce cavitation in the incoming subcooled refrigerant and result in favorable two-phase flow regimes for enhanced heat transfer. In this study, R-134a is used as the coolant in the cavitation enhanced microchannel heat exchanger (CEMC-HX) which has been integrated into a vapor compression refrigeration system. Multiple micro-orifice geometries combined with a fixed microchannel geometry (nominally 250 μm × 250 μm) were investigated over a range of applied base heat fluxes (10–100 W/cm2) and mass fluxes (500–1000 kg/m2-s). Two-phase heat transfer coefficients exceeding 100,000 W/m2-K at refrigerant qualities of less than 5% have been demonstrated due to the achievement of preferential, cavitation-induced, flow regimes such as annular flow. To the author’s knowledge, this is the highest heat transfer coefficient ever reported in the literature for R-134a. Additionally, a four term two-phase heat transfer correlation was developed that achieved a mean absolute error (MAE) of 25.5%.

Micro Heat Changers and Surface-Micro-Coolers for High Heat Flux

2008 ◽  
Author(s):  
Ulrich Schygulla ◽  
Ju¨rgen J. Brandner ◽  
Eugen Anurjew ◽  
Edgar Hansjosten ◽  
Klaus Schubert
Keyword(s):  
Heat Flux ◽  
Heat Exchanger ◽  
Mass Flow ◽  
Pressure Loss ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Micro Heat Exchanger ◽  
Micro Channels ◽  
Higher Temperature

This publication describes the development of a new microstructure to transfer high heat fluxes. With a simple mathematical model based on heat conduction theory for the heat transfer in a micro channel at laminar flow conditions it was deduced that for the transmission of high heat fluxes only the initial part at the beginning of the micro channels is of importance, i.e. the micro channels should be short. Based on this principle a micro structure was designed with a large number of short micro channels taken in parallel. With this newly developed microstructure a prototype of a micro heat exchanger and a surface micro cooler was manufactured and tested. Using the prototype of the micro heat exchanger, manufactured of plastic, heat fluxes up to 500 W/cm2 were achieved at a pressure loss of 0.16 MPa and a mass flow of the water of 200 kg/h per passage. Due to the use of materials with a higher temperature resistance and higher stability like aluminum or ceramic, higher water throughputs and higher flow velocities could be realized in the micro channels. Thus it was possible to increase the heat flux up to approx. 800 W/cm2 at a pressure loss of approx. 0.35 MPa and a mass flow of 350 kg/h per passage. The important focus of investigation of the surface micro cooler was set on the examination of the surface temperatures for different heat fluxes and different velocities of the water in the micro channels. The experimental results of these surface micro coolers are summarized to characteristic maps. With this characteristic maps it is possible to determine whether a micro surface cooler can be used for a specific application.

Numerical Modeling of Chevron Plate Heat Exchangers for Thermal Management Applications

2016 ◽  
Author(s):  
Harsh Tamakuwala ◽  
Ryan Von Ness ◽  
Debjyoti Banerjee
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Exchanger ◽  
Heat Exchangers ◽  
High Heat ◽  
Plate Heat Exchanger ◽  
High Heat Flux ◽  
Plate Heat ◽  
Geometric Conditions ◽  
Swirl Flows

Plate-fin heat exchangers are widely used in industries especially aerospace, cryogenics, food and chemical process industries where high heat flux surface area per unit volume is of prime importance. These heat exchangers consists of series of corrugated plates (herringbone or chevron), separated by gasket sealing. Chevron angled plates are one of the most commonly used type of geometry. The complex design of chevron plate heat exchanger, induces high turbulence and flow reversals causing high heat transfer through the plates. This paper discusses about the computational fluid dynamics simulations conducted over a simplified geometry of Chevron Plate Heat Exchanger to understand the formulation of vortices at different Reynold’s number for various aspect ratios. A single phase laminar flow with periodic boundary condition is used for analysis of the fluid behavior in a unit pattern of the corrugation geometry. Based on different flow and geometric conditions, varying amounts of swirl-flows are observed and different behavior of shear stress and heat transfer plot along the length of the plate is observed. At higher Reynolds numbers (Re), the re-circulations and mixing by the induced vortices causes significant rise of heat flux, with marginal increase in friction factor.

Power semiconductor laser diode arrays characterization

2003 ◽  
Vol 39 (2) ◽  
pp. 203-217 ◽  
Author(s):  
Luigi Zeni ◽  
Stefania Campopiano ◽  
Antonello Cutolo ◽  
Giuseppe D’Angelo
Keyword(s):  
Semiconductor Laser ◽  
Laser Diode ◽  
Power Semiconductor ◽  
Semiconductor Laser Diode ◽  
Laser Diode Arrays
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