Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology

2002 ◽  
Author(s):  
J. Kloeser ◽  
K. Heinricht ◽  
K. Kutner ◽  
E. Jung ◽  
A. Ostmann ◽  
...  
Keyword(s):  
Flip Chip ◽  
Lead Free ◽  
Stencil Printing ◽  
Chip Technology ◽  
Fine Pitch ◽  
Lead Free Solders

Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology

1998 ◽  
Vol 21 (1) ◽  
pp. 41-50 ◽  
Author(s):  
J. Kloeser ◽  
K. Heinricht ◽  
K. Kutzner ◽  
E. Jung ◽  
A. Ostmann ◽  
...  
Keyword(s):  
Flip Chip ◽  
Lead Free ◽  
Stencil Printing ◽  
Chip Technology ◽  
Fine Pitch ◽  
Lead Free Solders

A Study of the Aperture Filling Process in Solder Paste Stencil Printing

1999 ◽  
Author(s):  
Jianbiao Pan ◽  
Gregory L. Tonkay
Keyword(s):  
Flip Chip ◽  
Deposition Process ◽  
Area Ratio ◽  
Solder Paste ◽  
Stencil Printing ◽  
Printing Process ◽  
Surface Mount ◽  
Fine Pitch ◽  
Main Indicator ◽  
Advanced Packaging

Abstract Stencil printing has been the dominant method of solder deposition in surface mount assembly. With the development of advanced packaging technologies such as ball grid array (BGA) and flip chip on board (FCOB), stencil printing will continue to play an important role. However, the stencil printing process is not completely understood because 52–71 percent of fine and ultra-fine pitch surface mount assembly defects are printing process related (Clouthier, 1999). This paper proposes an analytical model of the solder paste deposition process during stencil printing. The model derives the relationship between the transfer ratio and the area ratio. The area ratio is recommended as a main indicator for determining the maximum stencil thickness. This model explains two experimental phenomena. One is that increasing stencil thickness does not necessarily lead to thicker deposits. The other is that perpendicular apertures print thicker than parallel apertures.

Thermally Activated Bumping Process using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers

2013 ◽  
Vol 2013 (1) ◽  
pp. 000420-000423
Author(s):  
Kwang-Seong Choi ◽  
Ho-Eun Bae ◽  
Haksun Lee ◽  
Hyun-Cheol Bae ◽  
Yong-Sung Eom
Keyword(s):  
Screen Printing ◽  
Flip Chip ◽  
Solder Bump ◽  
Low Cost ◽  
Organic Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermally Activated ◽  
Fine Pitch ◽  
Free Solder

A novel bumping process using solder bump maker (SBM) is developed for fine-pitch flip chip bonding. It features maskless screen printing process with the result that a fine-pitch, low-cost, and lead-free solder-on-pad (SoP) technology can be easily implemented. The process includes two main steps: one is the thermally activated aggregation of solder powder on the metal pads on a substrate and the other is the reflow of the deposited powder on the pads. Only a small quantity of solder powder adjacent to the pads can join the first step, so a quite uniform SoP array on the substrate can be easily obtained regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of 130 μm is, successfully, formed.

A novel bumping process for fine pitch Sn–Cu lead-free plating-based flip chip solder bumps

2007 ◽  
Vol 10 (4-5) ◽  
pp. 133-142 ◽  
Author(s):  
Jung-Tang Huang ◽  
Pen-Shan Chao ◽  
Hou-Jun Hsu ◽  
Sheng-Hsiung Shih
Keyword(s):  
Flip Chip ◽  
Lead Free ◽  
Fine Pitch ◽  
Solder Bumps

scholarly journals Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders

2001 ◽  
Vol 42 (5) ◽  
pp. 790-793 ◽  
Author(s):  
Ikuo Shohji ◽  
Fuminari Mori ◽  
Kojiro F. Kobayashi
Keyword(s):  
Thermal Fatigue ◽  
Flip Chip ◽  
Fatigue Behavior ◽  
Lead Free ◽  
Thermal Fatigue Behavior ◽  
Lead Free Solders

Sub process challenges in ultra fine pitch stencil printing of type‐6 and type‐7 Pb‐free solder pastes for flip chip assembly applications

2005 ◽  
Vol 17 (1) ◽  
pp. 24-32 ◽  
Author(s):  
G.J. Jackson ◽  
M.W. Hendriksen ◽  
R.W. Kay ◽  
M. Desmulliez ◽  
R.K. Durairaj ◽  
...  
Keyword(s):  
Flip Chip ◽  
Stencil Printing ◽  
Fine Pitch ◽  
Solder Pastes ◽  
Flip Chip Assembly ◽  
Free Solder
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