A reliable die attach method for high power semiconductor lasers and optical amplifiers

2002 ◽  
Author(s):  
S.A. Merritt ◽  
P.J.S. Heim ◽  
S. Cho ◽  
M. Dagenais
Keyword(s):  
Semiconductor Lasers ◽  
High Power ◽  
Optical Amplifiers ◽  
Power Semiconductor ◽  
Die Attach

Design and realization of high power semiconductor lasers

2009 ◽  
Author(s):  
J. Boucart ◽  
S. Pawlik ◽  
A. Guarino ◽  
B. Sverdlov ◽  
J. Mueller ◽  
...  
Keyword(s):  
Semiconductor Lasers ◽  
High Power ◽  
Power Semiconductor

Packaging Process of High Power Semiconductor Lasers

2014 ◽  
pp. 185-226
Author(s):  
Xingsheng Liu ◽  
Wei Zhao ◽  
Lingling Xiong ◽  
Hui Liu
Keyword(s):  
Semiconductor Lasers ◽  
High Power ◽  
Packaging Process ◽  
Power Semiconductor

scholarly journals NOVEL COUPLED MULTI-ACTIVE REGION HIGH POWER SEMICONDUCTOR LASERS CASCADED VIA T UNNEL JUNCTION

2000 ◽  
Vol 49 (12) ◽  
pp. 2374
Author(s):  
LIAN PENG ◽  
YIN TAO ◽  
GAO GUO ◽  
ZOU DE-SHU ◽  
CHEN CHANG-HUA ◽  
...  
Keyword(s):  
Active Region ◽  
Semiconductor Lasers ◽  
High Power ◽  
Power Semiconductor

Development of High Thermally Conductive Die Attach for TIM Applications

2019 ◽  
Vol 2019 (1) ◽  
pp. 000312-000315
Author(s):  
Maciej Patelka ◽  
Sho Ikeda ◽  
Koji Sasaki ◽  
Hiroki Myodo ◽  
Nortisuka Mizumura
Keyword(s):  
Thermal Conductivity ◽  
High Power ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Power Semiconductor ◽  
Die Attach ◽  
Industry Standards ◽  
Thermally Conductive ◽  
Low Modulus ◽  
Thermal Grease

Abstract High power semiconductor applications require a Thermal Interface Die Attach Material with high thermal conductivity to efficiently release the heat generated from these devices. Current Thermal Interface Material solutions such as thermal grease, thermal pads and silicones have been industry standards, however may fall short in performance for high temperature or high-power applications. This presentation will focus on development of a cutting-edge Die Attach Solution for Thermal Interface Management, focusing on Fusion Type epoxy-based Ag adhesive with an extremally low Storage Modulus and the Thermal Conductivity reaching up to 30W/mK, and also Very Low Modulus, Low-Temperature Pressureless Sintered Silver Die Attach with the Thermal Conductivity of 70W/mK.

Evaluation of Test Protocol for Eutectic Die Attach Using High Power LEDs

2011 ◽  
Vol 2011 (1) ◽  
pp. 000136-000141 ◽  
Author(s):  
Amanda Hartnett ◽  
Seth Homer ◽  
Donald Beck ◽  
Daniel Evans
Keyword(s):  
High Power ◽  
Coefficient Of Thermal Expansion ◽  
Test Methods ◽  
Test Protocol ◽  
High Brightness ◽  
Light Emitting ◽  
Power Semiconductor ◽  
Heat System ◽  
Die Attach ◽  
Manufactured Products

High-power semiconductor devices, such as high-brightness Light Emitting Diodes (LEDs), must be mounted using a robust adhesive material to handle the temperature fluctuations generated by the chip and the mechanical stresses due to the coefficient of thermal expansion (CTE) mismatches between the die material and substrate it is mounted to. The selected material must also comply with current legislation restricting manufactured products containing numerous materials including some that were historically popular in HB LED applications due to environmental concerns. Eutectic gold-tin (AuSn) materials meet these requirements, and process recommendations for their implementation will be presented in this paper. Utilizing a Palomar Technologies die bonder, AuSn solder preforms and paste will be placed/dispensed and reflowed using a Pulsed Heat System (PHS). Evaluation methods comparing these means of eutectic die attach to a pre-plated AuSn die will be discussed. Technical generalizations will be detailed to explain the derivation of test methods as well as hypotheses of results.

Development and Applications of GaAs-Based Near-Infrared High Power Semiconductor Lasers

2019 ◽  
Vol 56 (4) ◽  
pp. 040003 ◽  
Author(s):  
袁庆贺 Yuan Qinghe ◽  
井红旗 Jing Hongqi ◽  
张秋月 Zhang Qiuyue ◽  
仲莉 Zhong Li ◽  
刘素平 Liu Suping ◽  
...  
Keyword(s):  
Semiconductor Lasers ◽  
High Power ◽  
Near Infrared ◽  
Power Semiconductor

scholarly journals Integrated electroplated heat spreaders for high power semiconductor lasers

2008 ◽  
Vol 104 (6) ◽  
pp. 064907 ◽  
Author(s):  
Jianping Fu ◽  
Ronggui Yang ◽  
Gang Chen ◽  
Jean Pierre Fleurial ◽  
G. Jeffrey Snyder
Keyword(s):  
Semiconductor Lasers ◽  
High Power ◽  
Power Semiconductor ◽  
Heat Spreaders
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