Compact modeling approach for microchannel cooling aimed at high-level thermal analysis of 3D packaged ICs
Keyword(s):
2017 ◽
Vol 24
(1)
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pp. 419-431
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Keyword(s):
2018 ◽
Vol 11
(10)
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pp. 3983-3997
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2006 ◽
Vol E89-C
(11)
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pp. 1581-1590
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