Constructing high-power LED lamp model to evaluate different heat dissipation mechanism design

2014 ◽  
Author(s):  
Ming-Tzer Lin ◽  
Yi-Sheng Liao ◽  
F-C Hsu ◽  
Y-T Wang ◽  
Han Kao ◽  
...  
Keyword(s):  
Mechanism Design ◽  
High Power ◽  
Heat Dissipation ◽  
Dissipation Mechanism ◽  
High Power Led

scholarly journals Analysis on High-Power Seaport LED Luminaire with Uniform Light Distribution Based on Optimized Lens and Heatsink

2021 ◽  
Vol 11 (9) ◽  
pp. 4035
Author(s):  
Jinsheon Kim ◽  
Jeungmo Kang ◽  
Woojin Jang
Keyword(s):  
Light Source ◽  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Light Distribution ◽  
Light Sources ◽  
Led Light ◽  
High Power Led ◽  
Distribution Requirement ◽  
Lighting Application

In the case of light-emitting diode (LED) seaport luminaires, they should be designed in consideration of glare, average illuminance, and overall uniformity. Although it is possible to implement light distribution through auxiliary devices such as reflectors, it means increasing the weight and size of the luminaire, which reduces the feasibility. Considering the special environment of seaport luminaires, which are installed at a height of 30 m or more, it is necessary to reduce the weight of the device, facilitate replacement, and secure a light source with a long life. In this paper, an optimized lens design was investigated to provide uniform light distribution to meet the requirement in the seaport lighting application. Four types of lens were designed and fabricated to verify the uniform light distribution requirement for the seaport lighting application. Using numerical analysis, we optimized the lens that provides the required minimum overall uniformity for the seaport lighting application. A theoretical analysis for the heatsink structure and shape were conducted to reduce the heat from the high-power LED light sources up to 250 W. As a result of these analyses on the heat dissipation characteristics of the high-power LED light source used in the LED seaport luminaire, the heatsink with hexagonal-shape fins shows the best heat dissipation effect. Finally, a prototype LED seaport luminaire with an optimized lens and heat sink was fabricated and tested in a real seaport environment. The light distribution characteristics of this prototype LED seaport luminaire were compared with a commercial high-pressure sodium luminaire and metal halide luminaire.

Analysis and Optimization of Heat Dissipation Characteristics of High-power LED

2021 ◽  
Author(s):  
Pingfeng Wu ◽  
Runji Fang ◽  
Xuanjun Dai ◽  
Anak Agung Ayu Putri
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
High Power Led

scholarly journals Systematic Research on the Heat Dissipation Channel of High Power LED Street Lamps

2021 ◽  
Vol 1952 (3) ◽  
pp. 032003
Author(s):  
Zhao Wang ◽  
Qijun Bao ◽  
Yuefeng Li ◽  
Jun Zou ◽  
Hao Zheng ◽  
...  
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Systematic Research ◽  
High Power Led

Heat Dissipation Analysis of High Power LED Connected to Copper Coated Heat Sink by Soldering

2011 ◽  
Vol 32 (11) ◽  
pp. 1171-1175 ◽  
Author(s):  
柴伟伟 CHAI Wei-wei ◽  
陈清华 CHEN Qing-hua ◽  
李琳红 LI Ling-hong ◽  
唐文勇 TANG Wen-yong ◽  
张学清 ZHANG Xue-qing ◽  
...  
Keyword(s):  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
High Power Led

Heat Dissipation Simulation Analysis of High Power LED via Heat Slug Geometry Variation

2014 ◽  
Vol 1082 ◽  
pp. 344-347
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Rajendaran Vairavan ◽  
Hussin Kamarudin ◽  
Mukhzeer Mohamad Shahimin ◽  
...  
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Simulation Analysis ◽  
Life Time ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Potential Development ◽  
High Power Led ◽  
Superior Surface ◽  
Von Mises

High power LEDs are currently being plagued by heat dissipation challenges due to its high power density thus limiting its further potential development and fulfillment. Exercising proper selection of packaging component could improve the life time of high power LED. In this work, the significance of the heat slug geometry on the heat dissipation of high power LED was addressed through simulation analysis. The heat slug geometries were varied in order to compare the heat dissipation of the high power LED. Ansys version 11 was utilized for the simulation. The heat dissipation of the high power LED was evaluated in terms of junction temperature, von Mises stress and thermal resistance. The key results of the analysis showed that a superior surface area is preferred for an enhanced heat dissipation of high power LED

Enhanced Energy Efficiency of Light Grid System with Optimized System Design and Recycling with Thermoelectric Platform

2021 ◽  
Vol 21 (3) ◽  
pp. 1927-1931
Author(s):  
Jae-Hoon Ji ◽  
Hong-Tae Kim ◽  
Sung-Jin Kim ◽  
Masao Kamiko ◽  
Jung-Hyuk Koh
Keyword(s):  
Energy Efficiency ◽  
High Power ◽  
Heat Dissipation ◽  
Electrical Energy ◽  
Grid System ◽  
Optical Energy ◽  
Thermoelectric Modules ◽  
Dissipation Structure ◽  
High Power Led ◽  
Effective Design

In this work, a light grid system with a high-power LED chip was manufactured and employed to analyze the energy efficiency of output optical energy. The high-power LED system based on thermoelectric modules, a heat dissipation structure and optical transmission system with an optical fiber were optimally combined and designed, which increased the efficiency of light grid system. Additionally, by introducing an effective design for the heat dissipation structure, the output optical energy and recycled electrical energy were increased. The recycled energy through optimized heat dissipation structure was 1.94 W, and the system efficiency of designed light grid system is more than 50%. In this research, we intensively studied the energy efficiency of a light grid system as well as the recycling of thermal energy through thermoelectric modules.

MEMS Based Metal Plated Silicon Package for High Power LED

2006 ◽  
Vol 326-328 ◽  
pp. 309-312 ◽  
Author(s):  
Sung Jun Lee ◽  
Ji Hyun Park ◽  
Chang Hyun Lim ◽  
Won Kyu Jeong ◽  
Seog Moon Choi ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
High Power ◽  
Power Dissipation ◽  
Heat Dissipation ◽  
High Efficiency ◽  
Low Cost ◽  
Wafer Level ◽  
High Power Led ◽  
Key Factor ◽  
Mems Technology

By the development of high power LED for solid states lighting, the requirement for driving current has increased critically, thereby increasing power dissipation. Heat flux corresponds to power dissipation is mainly generated in p-n junction of LED, so the effective removal of heat is the key factor for long lifetime of LED chip. In this study, we newly proposed the silicon package for high power LED using MEMS technology and estimated its heat dissipation characteristic. Our silicon package structure is composed of base and reflector cup. The role of base is that settle LED chip at desired position and supply electrical interconnection for LED operation, and finally transfer the heat from junction region to outside. For improved heat transfer, we introduced the heat conductive metal plated trench structure at the opposite side of LED attached side. The depth and the diameter of trench were 150 and 100um, respectively. Copper with high thermal conductivity than silicon was filled in trench by electroplating and the thickness of copper was about 100um. Reflector cup was formed by anisotropic wet etching and then, silicon package platform could be fabricated by eutectic bonding between base and reflector cup. The thermal resistance of silicon package was about 6 to 7K/W from junction to case, and also, thermal resistance reduction of 0.64K/W was done by metal plated trench. This result could be comparable to that of other high power LED package. Our silicon package platform is easy to be expanded into array and wafer level package. So, it is suitable for future high efficiency and low cost package.

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