Guided modes on a cylindrical channel in a collisional anisotropic plasma

2002 ◽  
Author(s):  
A.V. Kudrin ◽  
L.E. Kurina ◽  
M.Yu. Lyakh ◽  
T.M. Zaboronkova
Keyword(s):  
Cylindrical Channel ◽  
Anisotropic Plasma ◽  
Guided Modes

Anisotropic Plasma ChemicalVapor Deposition of Copper Films in Trenches

2003 ◽  
Vol 766 ◽  
Author(s):  
Kosuke Takenaka ◽  
Masao Onishi ◽  
Manabu Takenshita ◽  
Toshio Kinoshita ◽  
Kazunori Koga ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Deposition Rate ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Anisotropic Plasma ◽  
Bottom Surface ◽  
Chemical Vapor Deposition Method ◽  
Copper Films ◽  
Deposition Method ◽  
Via Holes

AbstractAn ion-assisted chemical vapor deposition method by which Cu is deposited preferentially from the bottom of trenches (anisotropic CVD) has been proposed in order to fill small via holes and trenches. By using Ar + H2 + C2H5OH[Cu(hfac)2] discharges with a ratio H2 / (H2 + Ar) = 83%, Cu is filled preferentially from the bottom of trenches without deposition on the sidewall and top surfaces. The deposition rate on the bottom surface of trenches is experimentally found to increase with decreasing its width.

Theory of a VLF Strip Antenna Located in an Anisotropic Plasma

2021 ◽  
pp. 1-1
Author(s):  
Tong He ◽  
Hui Ran Zeng ◽  
Li Na Hea ◽  
Kai Li
Keyword(s):  
Anisotropic Plasma
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