scholarly journals Process variation aware thread mapping for Chip Multiprocessors

Author(s):  
S. Hong ◽  
S.H.K. Narayanan ◽  
M. Kandemir ◽  
O. Ozturk
Author(s):  
Ramesh Varma ◽  
Richard Brooks ◽  
Ronald Twist ◽  
James Arnold ◽  
Cleston Messick

Abstract In a prequalification effort to evaluate the assembly process for the industrial grade high pin count devices for use in a high reliability application, one device exhibited characteristics that, without corrective actions and/or extensive screening, may lead to intermittent system failures and unacceptable reliability. Five methodologies confirmed this conclusion: (1) low post-decapsulation wire pull results; (2) bond shape analysis showed process variation; (3) Failure Analysis (FA) using state of the art equipment determined the root causes and verified the low wire pull results; (4) temperature cycling parts while monitoring, showed intermittent failures, and (5) parts tested from other vendors using the same techniques passed all limits.


2005 ◽  
Vol 33 (4) ◽  
pp. 64-69 ◽  
Author(s):  
Jack Sampson ◽  
Rubén González ◽  
Jean-Francois Collard ◽  
Norman P. Jouppi ◽  
Mike Schlansker
Keyword(s):  

2020 ◽  
pp. 1-1
Author(s):  
Zhengxing Zhang ◽  
Sally I. El-Henawy ◽  
Allan Sadun ◽  
Ryan Miller ◽  
Luca Daniel ◽  
...  

2014 ◽  
Vol 13 (4) ◽  
pp. 1-36 ◽  
Author(s):  
Luis Angel D. Bathen ◽  
Nikil D. Dutt
Keyword(s):  

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